DE60005816T2 - Polierkissen mit rillenmuster zur verwendung in einer chemisch-mechanischen poliervorrichtung - Google Patents

Polierkissen mit rillenmuster zur verwendung in einer chemisch-mechanischen poliervorrichtung Download PDF

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Publication number
DE60005816T2
DE60005816T2 DE60005816T DE60005816T DE60005816T2 DE 60005816 T2 DE60005816 T2 DE 60005816T2 DE 60005816 T DE60005816 T DE 60005816T DE 60005816 T DE60005816 T DE 60005816T DE 60005816 T2 DE60005816 T2 DE 60005816T2
Authority
DE
Germany
Prior art keywords
polishing pad
groove
polishing
groove pattern
sections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60005816T
Other languages
German (de)
English (en)
Other versions
DE60005816D1 (de
Inventor
J. Alan JENSEN
S. Brian THORNTON
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of DE60005816D1 publication Critical patent/DE60005816D1/de
Application granted granted Critical
Publication of DE60005816T2 publication Critical patent/DE60005816T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60005816T 1999-05-21 2000-05-15 Polierkissen mit rillenmuster zur verwendung in einer chemisch-mechanischen poliervorrichtung Expired - Fee Related DE60005816T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/316,166 US6261168B1 (en) 1999-05-21 1999-05-21 Chemical mechanical planarization or polishing pad with sections having varied groove patterns
US316166 1999-05-21
PCT/US2000/013328 WO2000071297A1 (en) 1999-05-21 2000-05-15 Chemical mechanical planarization or polishing pad with sections having varied groove patterns

Publications (2)

Publication Number Publication Date
DE60005816D1 DE60005816D1 (de) 2003-11-13
DE60005816T2 true DE60005816T2 (de) 2004-05-19

Family

ID=23227799

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60005816T Expired - Fee Related DE60005816T2 (de) 1999-05-21 2000-05-15 Polierkissen mit rillenmuster zur verwendung in einer chemisch-mechanischen poliervorrichtung

Country Status (9)

Country Link
US (3) US6261168B1 (enExample)
EP (2) EP1329290A3 (enExample)
JP (1) JP2003500843A (enExample)
KR (1) KR100706148B1 (enExample)
AT (1) ATE251524T1 (enExample)
DE (1) DE60005816T2 (enExample)
SG (1) SG152899A1 (enExample)
TW (1) TW462906B (enExample)
WO (1) WO2000071297A1 (enExample)

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US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
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US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
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US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
JP4641781B2 (ja) * 2003-11-04 2011-03-02 三星電子株式会社 不均一強度を有する研磨面を使用した化学的機械的研磨装置および方法
KR100578133B1 (ko) * 2003-11-04 2006-05-10 삼성전자주식회사 화학적 기계적 연마 장치 및 이에 사용되는 연마 패드
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US7086936B1 (en) * 2003-12-22 2006-08-08 Lam Research Corporation Linear chemical mechanical planarization (CMP) system and method for planarizing a wafer in a single CMP module
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TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
KR102717581B1 (ko) * 2016-12-22 2024-10-16 삼성전자주식회사 금속 판, 패턴 형성 장치 및 이를 이용한 패턴 형성 방법
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CN119703981B (zh) * 2025-02-28 2025-04-25 江西祥益鼎盛科技有限公司 一种pcb板磨毛边装置

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Also Published As

Publication number Publication date
US20010031615A1 (en) 2001-10-18
EP1329290A3 (en) 2003-07-30
ATE251524T1 (de) 2003-10-15
EP1329290A2 (en) 2003-07-23
KR20020011417A (ko) 2002-02-08
DE60005816D1 (de) 2003-11-13
KR100706148B1 (ko) 2007-04-11
JP2003500843A (ja) 2003-01-07
US6634936B2 (en) 2003-10-21
US6585579B2 (en) 2003-07-01
EP1178872B1 (en) 2003-10-08
US20020028646A1 (en) 2002-03-07
US6261168B1 (en) 2001-07-17
TW462906B (en) 2001-11-11
EP1178872A1 (en) 2002-02-13
SG152899A1 (en) 2009-06-29
WO2000071297A1 (en) 2000-11-30

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