TW462906B - Chemical mechanical planarization or polishing pad with sections having varied groove patterns - Google Patents

Chemical mechanical planarization or polishing pad with sections having varied groove patterns Download PDF

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Publication number
TW462906B
TW462906B TW089109756A TW89109756A TW462906B TW 462906 B TW462906 B TW 462906B TW 089109756 A TW089109756 A TW 089109756A TW 89109756 A TW89109756 A TW 89109756A TW 462906 B TW462906 B TW 462906B
Authority
TW
Taiwan
Prior art keywords
polishing pad
polishing
patent application
grooves
groove pattern
Prior art date
Application number
TW089109756A
Other languages
English (en)
Chinese (zh)
Inventor
Alan J Jensen
Brian S Thornton
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of TW462906B publication Critical patent/TW462906B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW089109756A 1999-05-21 2000-06-05 Chemical mechanical planarization or polishing pad with sections having varied groove patterns TW462906B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/316,166 US6261168B1 (en) 1999-05-21 1999-05-21 Chemical mechanical planarization or polishing pad with sections having varied groove patterns

Publications (1)

Publication Number Publication Date
TW462906B true TW462906B (en) 2001-11-11

Family

ID=23227799

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089109756A TW462906B (en) 1999-05-21 2000-06-05 Chemical mechanical planarization or polishing pad with sections having varied groove patterns

Country Status (9)

Country Link
US (3) US6261168B1 (enExample)
EP (2) EP1178872B1 (enExample)
JP (1) JP2003500843A (enExample)
KR (1) KR100706148B1 (enExample)
AT (1) ATE251524T1 (enExample)
DE (1) DE60005816T2 (enExample)
SG (1) SG152899A1 (enExample)
TW (1) TW462906B (enExample)
WO (1) WO2000071297A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7991216B2 (en) 2007-06-15 2011-08-02 National Taiwan University Of Science And Technology Method of analyzing effective polishing frequency and number of polishing times on polishing pads having different patterns and profiles

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US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
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JP4641781B2 (ja) * 2003-11-04 2011-03-02 三星電子株式会社 不均一強度を有する研磨面を使用した化学的機械的研磨装置および方法
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JP5635194B2 (ja) * 2010-09-15 2014-12-03 エルジー・ケム・リミテッド Ｃｍｐ用研磨パッド
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TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
KR102717581B1 (ko) * 2016-12-22 2024-10-16 삼성전자주식회사 금속 판, 패턴 형성 장치 및 이를 이용한 패턴 형성 방법
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CN119703981B (zh) * 2025-02-28 2025-04-25 江西祥益鼎盛科技有限公司 一种pcb板磨毛边装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7991216B2 (en) 2007-06-15 2011-08-02 National Taiwan University Of Science And Technology Method of analyzing effective polishing frequency and number of polishing times on polishing pads having different patterns and profiles

Also Published As

Publication number Publication date
EP1329290A2 (en) 2003-07-23
US20020028646A1 (en) 2002-03-07
KR20020011417A (ko) 2002-02-08
US20010031615A1 (en) 2001-10-18
DE60005816T2 (de) 2004-05-19
ATE251524T1 (de) 2003-10-15
SG152899A1 (en) 2009-06-29
EP1329290A3 (en) 2003-07-30
US6261168B1 (en) 2001-07-17
EP1178872A1 (en) 2002-02-13
WO2000071297A1 (en) 2000-11-30
JP2003500843A (ja) 2003-01-07
EP1178872B1 (en) 2003-10-08
KR100706148B1 (ko) 2007-04-11
US6585579B2 (en) 2003-07-01
DE60005816D1 (de) 2003-11-13
US6634936B2 (en) 2003-10-21

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