DE60005816D1 - Polierkissen mit rillenmuster zur verwendung in einer chemisch-mechanischen poliervorrichtung - Google Patents
Polierkissen mit rillenmuster zur verwendung in einer chemisch-mechanischen poliervorrichtungInfo
- Publication number
- DE60005816D1 DE60005816D1 DE60005816T DE60005816T DE60005816D1 DE 60005816 D1 DE60005816 D1 DE 60005816D1 DE 60005816 T DE60005816 T DE 60005816T DE 60005816 T DE60005816 T DE 60005816T DE 60005816 D1 DE60005816 D1 DE 60005816D1
- Authority
- DE
- Germany
- Prior art keywords
- polishing pad
- groove pattern
- polishing
- chemical
- cushion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/04—Zonally-graded surfaces
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US316166 | 1999-05-21 | ||
US09/316,166 US6261168B1 (en) | 1999-05-21 | 1999-05-21 | Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
PCT/US2000/013328 WO2000071297A1 (en) | 1999-05-21 | 2000-05-15 | Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60005816D1 true DE60005816D1 (de) | 2003-11-13 |
DE60005816T2 DE60005816T2 (de) | 2004-05-19 |
Family
ID=23227799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60005816T Expired - Fee Related DE60005816T2 (de) | 1999-05-21 | 2000-05-15 | Polierkissen mit rillenmuster zur verwendung in einer chemisch-mechanischen poliervorrichtung |
Country Status (9)
Country | Link |
---|---|
US (3) | US6261168B1 (de) |
EP (2) | EP1178872B1 (de) |
JP (1) | JP2003500843A (de) |
KR (1) | KR100706148B1 (de) |
AT (1) | ATE251524T1 (de) |
DE (1) | DE60005816T2 (de) |
SG (1) | SG152899A1 (de) |
TW (1) | TW462906B (de) |
WO (1) | WO2000071297A1 (de) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6296557B1 (en) | 1999-04-02 | 2001-10-02 | Micron Technology, Inc. | Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
US6261168B1 (en) * | 1999-05-21 | 2001-07-17 | Lam Research Corporation | Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
US6585679B1 (en) * | 1999-10-21 | 2003-07-01 | Retinalabs.Com | System and method for enhancing oxygen content of infusion/irrigation fluid for ophthalmic surgery |
US20020068516A1 (en) * | 1999-12-13 | 2002-06-06 | Applied Materials, Inc | Apparatus and method for controlled delivery of slurry to a region of a polishing device |
US7670468B2 (en) | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
US6884153B2 (en) * | 2000-02-17 | 2005-04-26 | Applied Materials, Inc. | Apparatus for electrochemical processing |
US7077721B2 (en) * | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US6848970B2 (en) * | 2002-09-16 | 2005-02-01 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
US6962524B2 (en) * | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US20030213703A1 (en) * | 2002-05-16 | 2003-11-20 | Applied Materials, Inc. | Method and apparatus for substrate polishing |
US7678245B2 (en) | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
US6422929B1 (en) * | 2000-03-31 | 2002-07-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing pad for a linear polisher and method for forming |
US6733373B1 (en) * | 2000-03-31 | 2004-05-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing assembly for a linear chemical mechanical polishing apparatus and method for forming |
US6500054B1 (en) * | 2000-06-08 | 2002-12-31 | International Business Machines Corporation | Chemical-mechanical polishing pad conditioner |
US6475332B1 (en) * | 2000-10-05 | 2002-11-05 | Lam Research Corporation | Interlocking chemical mechanical polishing system |
US6896776B2 (en) | 2000-12-18 | 2005-05-24 | Applied Materials Inc. | Method and apparatus for electro-chemical processing |
JP2002200555A (ja) * | 2000-12-28 | 2002-07-16 | Ebara Corp | 研磨工具および該研磨工具を具備したポリッシング装置 |
US6620031B2 (en) | 2001-04-04 | 2003-09-16 | Lam Research Corporation | Method for optimizing the planarizing length of a polishing pad |
US6857941B2 (en) * | 2001-06-01 | 2005-02-22 | Applied Materials, Inc. | Multi-phase polishing pad |
KR20030015567A (ko) * | 2001-08-16 | 2003-02-25 | 에스케이에버텍 주식회사 | 웨이브 형태의 그루브가 형성된 화학적 기계적 연마패드 |
KR100646702B1 (ko) * | 2001-08-16 | 2006-11-17 | 에스케이씨 주식회사 | 홀 및/또는 그루브로 형성된 화학적 기계적 연마패드 |
US6648743B1 (en) * | 2001-09-05 | 2003-11-18 | Lsi Logic Corporation | Chemical mechanical polishing pad |
US7070480B2 (en) | 2001-10-11 | 2006-07-04 | Applied Materials, Inc. | Method and apparatus for polishing substrates |
US20030072639A1 (en) * | 2001-10-17 | 2003-04-17 | Applied Materials, Inc. | Substrate support |
JP3843933B2 (ja) * | 2002-02-07 | 2006-11-08 | ソニー株式会社 | 研磨パッド、研磨装置および研磨方法 |
US7544114B2 (en) * | 2002-04-11 | 2009-06-09 | Saint-Gobain Technology Company | Abrasive articles with novel structures and methods for grinding |
US20030194959A1 (en) * | 2002-04-15 | 2003-10-16 | Cabot Microelectronics Corporation | Sintered polishing pad with regions of contrasting density |
DE10222956B4 (de) * | 2002-05-24 | 2009-01-29 | FIP Forschungsinstitut für Produktionstechnik GmbH Braunschweig | Feinschleifmaschine |
US8602851B2 (en) * | 2003-06-09 | 2013-12-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled penetration subpad |
US6602123B1 (en) * | 2002-09-13 | 2003-08-05 | Infineon Technologies Ag | Finishing pad design for multidirectional use |
US20070010169A1 (en) * | 2002-09-25 | 2007-01-11 | Ppg Industries Ohio, Inc. | Polishing pad with window for planarization |
WO2004028744A1 (en) * | 2002-09-25 | 2004-04-08 | Ppg Industries Ohio, Inc. | Polishing pad with window for planarization |
JP2004172296A (ja) * | 2002-11-19 | 2004-06-17 | Matsushita Electric Ind Co Ltd | 半導体ウェーハの研磨方法及びその研磨パッド |
WO2004073926A1 (en) * | 2003-02-18 | 2004-09-02 | Parker-Hannifin Corporation | Polishing article for electro-chemical mechanical polishing |
US7121937B2 (en) | 2003-03-17 | 2006-10-17 | 3M Innovative Properties Company | Abrasive brush elements and segments |
TWI238100B (en) * | 2003-09-29 | 2005-08-21 | Iv Technologies Co Ltd | Polishing pad and fabricating method thereof |
US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
US20050173259A1 (en) * | 2004-02-06 | 2005-08-11 | Applied Materials, Inc. | Endpoint system for electro-chemical mechanical polishing |
KR100578133B1 (ko) * | 2003-11-04 | 2006-05-10 | 삼성전자주식회사 | 화학적 기계적 연마 장치 및 이에 사용되는 연마 패드 |
JP4641781B2 (ja) * | 2003-11-04 | 2011-03-02 | 三星電子株式会社 | 不均一強度を有する研磨面を使用した化学的機械的研磨装置および方法 |
US7186164B2 (en) * | 2003-12-03 | 2007-03-06 | Applied Materials, Inc. | Processing pad assembly with zone control |
US7086936B1 (en) * | 2003-12-22 | 2006-08-08 | Lam Research Corporation | Linear chemical mechanical planarization (CMP) system and method for planarizing a wafer in a single CMP module |
US6951510B1 (en) * | 2004-03-12 | 2005-10-04 | Agere Systems, Inc. | Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size |
US6935938B1 (en) | 2004-03-31 | 2005-08-30 | Lam Research Corporation | Multiple-conditioning member device for chemical mechanical planarization conditioning |
TWI293266B (en) * | 2004-05-05 | 2008-02-11 | Iv Technologies Co Ltd | A single-layer polishing pad and a method of producing the same |
TWI254354B (en) * | 2004-06-29 | 2006-05-01 | Iv Technologies Co Ltd | An inlaid polishing pad and a method of producing the same |
US20060079159A1 (en) * | 2004-10-08 | 2006-04-13 | Markus Naujok | Chemical mechanical polish with multi-zone abrasive-containing matrix |
KR100882045B1 (ko) * | 2006-02-15 | 2009-02-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 그루브형 서브패드를 구비한 폴리싱 장치 |
TWI321503B (en) | 2007-06-15 | 2010-03-11 | Univ Nat Taiwan Science Tech | The analytical method of the effective polishing frequency and number of times towards the polishing pads having different grooves and profiles |
TWI409868B (zh) * | 2008-01-30 | 2013-09-21 | Iv Technologies Co Ltd | 研磨方法、研磨墊及研磨系統 |
US9180570B2 (en) * | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
US8360823B2 (en) * | 2010-06-15 | 2013-01-29 | 3M Innovative Properties Company | Splicing technique for fixed abrasives used in chemical mechanical planarization |
WO2012036444A2 (ko) * | 2010-09-15 | 2012-03-22 | 주식회사 엘지화학 | Cmp용 연마 패드 |
CN102615571A (zh) * | 2011-01-28 | 2012-08-01 | 中芯国际集成电路制造(上海)有限公司 | 抛光装置及方法 |
TWI492818B (zh) * | 2011-07-12 | 2015-07-21 | Iv Technologies Co Ltd | 研磨墊、研磨方法以及研磨系統 |
TWI599447B (zh) | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | 具有偏移同心溝槽圖樣之邊緣排除區的cmp拋光墊 |
TWI769988B (zh) * | 2015-10-07 | 2022-07-11 | 美商3M新設資產公司 | 拋光墊與系統及其製造與使用方法 |
CN111971148A (zh) * | 2018-03-14 | 2020-11-20 | 磨卡有限公司 | 用于研磨的方法和设备以及产品和所述产品的用途 |
CN113579990B (zh) * | 2021-07-30 | 2022-07-26 | 上海积塔半导体有限公司 | 固定研磨粒抛光装置及抛光方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5177908A (en) | 1990-01-22 | 1993-01-12 | Micron Technology, Inc. | Polishing pad |
US5020283A (en) | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
JPH0647678A (ja) | 1992-06-25 | 1994-02-22 | Kawasaki Steel Corp | 湿式研磨用エンドレスベルト |
US5441598A (en) | 1993-12-16 | 1995-08-15 | Motorola, Inc. | Polishing pad for chemical-mechanical polishing of a semiconductor substrate |
US5650039A (en) * | 1994-03-02 | 1997-07-22 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved slurry distribution |
US5489233A (en) | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
US5534106A (en) * | 1994-07-26 | 1996-07-09 | Kabushiki Kaisha Toshiba | Apparatus for processing semiconductor wafers |
US5672095A (en) * | 1995-09-29 | 1997-09-30 | Intel Corporation | Elimination of pad conditioning in a chemical mechanical polishing process |
US5690540A (en) | 1996-02-23 | 1997-11-25 | Micron Technology, Inc. | Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers |
JPH09270399A (ja) * | 1996-03-29 | 1997-10-14 | Nippon Steel Corp | 基板研磨方法及びその装置 |
US5645469A (en) | 1996-09-06 | 1997-07-08 | Advanced Micro Devices, Inc. | Polishing pad with radially extending tapered channels |
US5722877A (en) * | 1996-10-11 | 1998-03-03 | Lam Research Corporation | Technique for improving within-wafer non-uniformity of material removal for performing CMP |
JPH10156705A (ja) | 1996-11-29 | 1998-06-16 | Sumitomo Metal Ind Ltd | 研磨装置および研磨方法 |
US5842910A (en) | 1997-03-10 | 1998-12-01 | International Business Machines Corporation | Off-center grooved polish pad for CMP |
US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
US6736714B2 (en) | 1997-07-30 | 2004-05-18 | Praxair S.T. Technology, Inc. | Polishing silicon wafers |
US6093651A (en) | 1997-12-23 | 2000-07-25 | Intel Corporation | Polish pad with non-uniform groove depth to improve wafer polish rate uniformity |
JP2000000755A (ja) * | 1998-06-16 | 2000-01-07 | Sony Corp | 研磨パッド及び研磨方法 |
GB2345255B (en) * | 1998-12-29 | 2000-12-27 | United Microelectronics Corp | Chemical-Mechanical Polishing Pad |
US6261168B1 (en) * | 1999-05-21 | 2001-07-17 | Lam Research Corporation | Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
-
1999
- 1999-05-21 US US09/316,166 patent/US6261168B1/en not_active Expired - Fee Related
-
2000
- 2000-05-15 EP EP00930746A patent/EP1178872B1/de not_active Expired - Lifetime
- 2000-05-15 KR KR1020017014762A patent/KR100706148B1/ko not_active IP Right Cessation
- 2000-05-15 DE DE60005816T patent/DE60005816T2/de not_active Expired - Fee Related
- 2000-05-15 SG SG200306843-4A patent/SG152899A1/en unknown
- 2000-05-15 EP EP03075541A patent/EP1329290A3/de not_active Withdrawn
- 2000-05-15 AT AT00930746T patent/ATE251524T1/de not_active IP Right Cessation
- 2000-05-15 JP JP2000619588A patent/JP2003500843A/ja active Pending
- 2000-05-15 WO PCT/US2000/013328 patent/WO2000071297A1/en active IP Right Grant
- 2000-06-05 TW TW089109756A patent/TW462906B/zh not_active IP Right Cessation
-
2001
- 2001-05-30 US US09/870,212 patent/US6634936B2/en not_active Expired - Fee Related
- 2001-07-13 US US09/905,332 patent/US6585579B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20020028646A1 (en) | 2002-03-07 |
TW462906B (en) | 2001-11-11 |
US6261168B1 (en) | 2001-07-17 |
US6585579B2 (en) | 2003-07-01 |
DE60005816T2 (de) | 2004-05-19 |
WO2000071297A1 (en) | 2000-11-30 |
EP1178872A1 (de) | 2002-02-13 |
US20010031615A1 (en) | 2001-10-18 |
EP1329290A3 (de) | 2003-07-30 |
EP1178872B1 (de) | 2003-10-08 |
JP2003500843A (ja) | 2003-01-07 |
SG152899A1 (en) | 2009-06-29 |
KR20020011417A (ko) | 2002-02-08 |
ATE251524T1 (de) | 2003-10-15 |
KR100706148B1 (ko) | 2007-04-11 |
US6634936B2 (en) | 2003-10-21 |
EP1329290A2 (de) | 2003-07-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |