KR100706148B1 - 다양한 홈 패턴을 구비한 섹션을 갖는 화학 기계적 평탄화 또는 연마 패드 - Google Patents

다양한 홈 패턴을 구비한 섹션을 갖는 화학 기계적 평탄화 또는 연마 패드 Download PDF

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Publication number
KR100706148B1
KR100706148B1 KR1020017014762A KR20017014762A KR100706148B1 KR 100706148 B1 KR100706148 B1 KR 100706148B1 KR 1020017014762 A KR1020017014762 A KR 1020017014762A KR 20017014762 A KR20017014762 A KR 20017014762A KR 100706148 B1 KR100706148 B1 KR 100706148B1
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South Korea
Prior art keywords
polishing pad
groove
sections
section
linear
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Expired - Fee Related
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KR1020017014762A
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English (en)
Korean (ko)
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KR20020011417A (ko
Inventor
젠슨앨런제이.
토른톤브라이언에스.
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램 리서치 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020017014762A 1999-05-21 2000-05-15 다양한 홈 패턴을 구비한 섹션을 갖는 화학 기계적 평탄화 또는 연마 패드 Expired - Fee Related KR100706148B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/316,166 US6261168B1 (en) 1999-05-21 1999-05-21 Chemical mechanical planarization or polishing pad with sections having varied groove patterns
US09/316,166 1999-05-21

Publications (2)

Publication Number Publication Date
KR20020011417A KR20020011417A (ko) 2002-02-08
KR100706148B1 true KR100706148B1 (ko) 2007-04-11

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Application Number Title Priority Date Filing Date
KR1020017014762A Expired - Fee Related KR100706148B1 (ko) 1999-05-21 2000-05-15 다양한 홈 패턴을 구비한 섹션을 갖는 화학 기계적 평탄화 또는 연마 패드

Country Status (9)

Country Link
US (3) US6261168B1 (enExample)
EP (2) EP1329290A3 (enExample)
JP (1) JP2003500843A (enExample)
KR (1) KR100706148B1 (enExample)
AT (1) ATE251524T1 (enExample)
DE (1) DE60005816T2 (enExample)
SG (1) SG152899A1 (enExample)
TW (1) TW462906B (enExample)
WO (1) WO2000071297A1 (enExample)

Cited By (1)

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WO2019175475A1 (en) * 2018-03-14 2019-09-19 Mirka Ltd A method and an apparatus for abrading, and products and uses for such

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CN119703981B (zh) * 2025-02-28 2025-04-25 江西祥益鼎盛科技有限公司 一种pcb板磨毛边装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019175475A1 (en) * 2018-03-14 2019-09-19 Mirka Ltd A method and an apparatus for abrading, and products and uses for such
EP3765241A4 (en) * 2018-03-14 2021-12-29 Mirka Ltd. A method and an apparatus for abrading, and products and uses for such

Also Published As

Publication number Publication date
DE60005816T2 (de) 2004-05-19
TW462906B (en) 2001-11-11
DE60005816D1 (de) 2003-11-13
WO2000071297A1 (en) 2000-11-30
SG152899A1 (en) 2009-06-29
JP2003500843A (ja) 2003-01-07
EP1178872A1 (en) 2002-02-13
EP1178872B1 (en) 2003-10-08
US20020028646A1 (en) 2002-03-07
EP1329290A3 (en) 2003-07-30
KR20020011417A (ko) 2002-02-08
US20010031615A1 (en) 2001-10-18
ATE251524T1 (de) 2003-10-15
US6585579B2 (en) 2003-07-01
EP1329290A2 (en) 2003-07-23
US6261168B1 (en) 2001-07-17
US6634936B2 (en) 2003-10-21

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