DE60003132D1 - Verfahren zum Anschliessen zweier Sätze von Elektrodenanschlüssen auf einer Leiterplatte - Google Patents

Verfahren zum Anschliessen zweier Sätze von Elektrodenanschlüssen auf einer Leiterplatte

Info

Publication number
DE60003132D1
DE60003132D1 DE60003132T DE60003132T DE60003132D1 DE 60003132 D1 DE60003132 D1 DE 60003132D1 DE 60003132 T DE60003132 T DE 60003132T DE 60003132 T DE60003132 T DE 60003132T DE 60003132 D1 DE60003132 D1 DE 60003132D1
Authority
DE
Germany
Prior art keywords
circuit board
connector
sets
lcd panel
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60003132T
Other languages
English (en)
Other versions
DE60003132T2 (de
Inventor
Hajime Michiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Application granted granted Critical
Publication of DE60003132D1 publication Critical patent/DE60003132D1/de
Publication of DE60003132T2 publication Critical patent/DE60003132T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Credit Cards Or The Like (AREA)
  • Combinations Of Printed Boards (AREA)
DE60003132T 1999-09-16 2000-08-22 Verfahren zum Anschliessen zweier Sätze von Elektrodenanschlüssen auf einer Leiterplatte Expired - Fee Related DE60003132T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26167299 1999-09-16
JP26167299 1999-09-16

Publications (2)

Publication Number Publication Date
DE60003132D1 true DE60003132D1 (de) 2003-07-10
DE60003132T2 DE60003132T2 (de) 2004-04-08

Family

ID=17365145

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60003132T Expired - Fee Related DE60003132T2 (de) 1999-09-16 2000-08-22 Verfahren zum Anschliessen zweier Sätze von Elektrodenanschlüssen auf einer Leiterplatte

Country Status (8)

Country Link
US (1) US6296493B1 (de)
EP (1) EP1085611B1 (de)
KR (1) KR20010039892A (de)
CN (1) CN1162942C (de)
AT (1) ATE242555T1 (de)
DE (1) DE60003132T2 (de)
NO (1) NO318944B1 (de)
TW (1) TW588478B (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200285944Y1 (ko) * 1999-05-26 2002-08-22 삼성전자 주식회사 엘씨디 모니터의 샤시 고정장치
US6730998B1 (en) * 2000-02-10 2004-05-04 Micron Technology, Inc. Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same
US6468891B2 (en) * 2000-02-24 2002-10-22 Micron Technology, Inc. Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
TWI304909B (de) * 2000-10-04 2009-01-01 Matsushita Electric Ind Co Ltd
US6506059B2 (en) * 2001-03-29 2003-01-14 Avx Corporation Electrical connectors for display devices
JP3616031B2 (ja) * 2001-05-10 2005-02-02 富士通株式会社 異方導電性シート、その製造方法、電子装置及び動作試験用検査装置
JP2004146210A (ja) * 2002-10-24 2004-05-20 Fuji Polymer Industries Co Ltd 異方導電性エラスチックコネクタ
KR100718850B1 (ko) * 2003-01-22 2007-05-16 닛본 덴끼 가부시끼가이샤 회로 기판 장치 및 배선 기판간 접속 방법
TW566722U (en) * 2003-05-02 2003-12-11 Compal Electronics Inc Connector structure
KR20040097496A (ko) * 2003-05-12 2004-11-18 일진다이아몬드(주) 액정 디스플레이 패널 및 액정 프로젝터
KR100637429B1 (ko) * 2003-10-24 2006-10-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
DE102004027788A1 (de) * 2004-06-08 2006-01-05 Infineon Technologies Ag Halbleiterbasisbauteil mit Umverdrahtungssubstrat und Zwischenverdrahtungsplatte für einen Halbleiterbauteilstapel sowie Verfahren zu deren Herstellung
CN2745247Y (zh) * 2004-09-16 2005-12-07 鸿富锦精密工业（深圳）有限公司 连接器固定装置
US7721118B1 (en) 2004-09-27 2010-05-18 Nvidia Corporation Optimizing power and performance for multi-processor graphics processing
US8066515B2 (en) * 2004-11-17 2011-11-29 Nvidia Corporation Multiple graphics adapter connection systems
US8134568B1 (en) 2004-12-15 2012-03-13 Nvidia Corporation Frame buffer region redirection for multiple graphics adapters
US8212831B1 (en) 2004-12-15 2012-07-03 Nvidia Corporation Broadcast aperture remapping for multiple graphics adapters
KR20080016271A (ko) * 2006-08-18 2008-02-21 삼성전자주식회사 유기 발광 표시 장치 및 그 제조 방법
KR20090108098A (ko) * 2007-02-09 2009-10-14 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 미부와의 접속을 유지하기 위한 클립
FR2915628B1 (fr) * 2007-04-27 2011-12-30 Valeo Systemes Thermiques Dispositif electronique comportant deux composants electroniques relies entre eux par un connecteur souple
KR100911007B1 (ko) * 2007-05-18 2009-08-05 삼성에스디아이 주식회사 샤시 베이스 조립체와, 이를 포함한 디스플레이 장치
CN101784952A (zh) * 2007-06-20 2010-07-21 株式会社普利司通 信息显示面板
JP4721297B2 (ja) * 2008-11-20 2011-07-13 株式会社ヨコオ 中継コネクタ
JP5465898B2 (ja) * 2009-03-11 2014-04-09 日本航空電子工業株式会社 光半導体デバイス、ソケットおよび光半導体ユニット
US8436251B2 (en) * 2009-07-08 2013-05-07 Medtronic, Inc. Ribbon connecting electrical components
US9876298B2 (en) 2014-08-04 2018-01-23 Te Connectivity Corporation Flexible connector and methods of manufacture
JP6754031B2 (ja) * 2015-12-25 2020-09-09 北川工業株式会社 クリップ及び固定機構
JP6433629B1 (ja) * 2017-12-22 2018-12-05 堺ディスプレイプロダクト株式会社 表示装置および表示装置の製造方法
WO2019123647A1 (ja) * 2017-12-22 2019-06-27 堺ディスプレイプロダクト株式会社 表示装置および表示装置の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3492538A (en) * 1967-09-07 1970-01-27 Thomas & Betts Corp Removable stack interconnection system
GB1513281A (en) * 1974-08-09 1978-06-07 Seiko Instr & Electronics Liquid crystal display device
US4028794A (en) * 1974-09-09 1977-06-14 Amp Incorporated Laminated connector
US4132984A (en) * 1976-05-20 1979-01-02 Liquid Xtal Displays Inc. Liquid crystal display
NO148869C (no) * 1977-09-24 1983-12-28 Amp Inc Fremgangsmaate for fremstilling av et kontaktstykke
JPS568081U (de) * 1979-06-29 1981-01-23
JPS5740874A (en) * 1980-08-22 1982-03-06 Shinetsu Polymer Co Pressure contact holding type connector
US4973256A (en) * 1989-08-18 1990-11-27 Texas Instruments Incorporated Device under test interface board and test electronic card interconnection in semiconductor test system
GB9303533D0 (en) * 1993-02-22 1993-04-07 Amp Holland Mother board-to-daughter board elastomeric electrical connector
US5462441A (en) * 1994-05-27 1995-10-31 Renn; Robert M. Low profile electrical connector
US5588846A (en) * 1995-08-25 1996-12-31 The Whitaker Corporation Right angle electrical connector
US5888076A (en) * 1997-06-13 1999-03-30 Japan Aviation Elecronics Industry, Limited LCD panel connector for use in connection between an LCD panel and a circuit board

Also Published As

Publication number Publication date
CN1162942C (zh) 2004-08-18
NO318944B1 (no) 2005-05-30
TW588478B (en) 2004-05-21
KR20010039892A (ko) 2001-05-15
ATE242555T1 (de) 2003-06-15
EP1085611B1 (de) 2003-06-04
DE60003132T2 (de) 2004-04-08
NO20004248D0 (no) 2000-08-24
US6296493B1 (en) 2001-10-02
NO20004248L (no) 2001-03-19
EP1085611A1 (de) 2001-03-21
CN1289945A (zh) 2001-04-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee