NO318944B1 - Fremgangsmate ved elektrisk sammenkobling av to sett med elektrodeterminaler i rekke pa elektroniske kortenheter - Google Patents
Fremgangsmate ved elektrisk sammenkobling av to sett med elektrodeterminaler i rekke pa elektroniske kortenheter Download PDFInfo
- Publication number
- NO318944B1 NO318944B1 NO20004248A NO20004248A NO318944B1 NO 318944 B1 NO318944 B1 NO 318944B1 NO 20004248 A NO20004248 A NO 20004248A NO 20004248 A NO20004248 A NO 20004248A NO 318944 B1 NO318944 B1 NO 318944B1
- Authority
- NO
- Norway
- Prior art keywords
- electrode terminals
- connector
- electronic card
- card unit
- clamping
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000008878 coupling Effects 0.000 claims description 40
- 238000010168 coupling process Methods 0.000 claims description 40
- 238000005859 coupling reaction Methods 0.000 claims description 40
- 239000007769 metal material Substances 0.000 claims description 9
- 238000010276 construction Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 27
- 239000002184 metal Substances 0.000 abstract description 27
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 4
- 238000003491 array Methods 0.000 abstract 1
- 229920001971 elastomer Polymers 0.000 description 57
- 239000005060 rubber Substances 0.000 description 50
- 229920002379 silicone rubber Polymers 0.000 description 26
- 229910001369 Brass Inorganic materials 0.000 description 25
- 239000010951 brass Substances 0.000 description 25
- 239000004945 silicone rubber Substances 0.000 description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 15
- 229910052737 gold Inorganic materials 0.000 description 15
- 239000010931 gold Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 15
- 229910001220 stainless steel Inorganic materials 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 12
- 239000010935 stainless steel Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 239000000806 elastomer Substances 0.000 description 7
- 238000007731 hot pressing Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910000676 Si alloy Inorganic materials 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 description 3
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 229910001000 nickel titanium Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004822 Hot adhesive Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920005558 epichlorohydrin rubber Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000004636 vulcanized rubber Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Credit Cards Or The Like (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26167299 | 1999-09-16 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO20004248D0 NO20004248D0 (no) | 2000-08-24 |
| NO20004248L NO20004248L (no) | 2001-03-19 |
| NO318944B1 true NO318944B1 (no) | 2005-05-30 |
Family
ID=17365145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO20004248A NO318944B1 (no) | 1999-09-16 | 2000-08-24 | Fremgangsmate ved elektrisk sammenkobling av to sett med elektrodeterminaler i rekke pa elektroniske kortenheter |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6296493B1 (de) |
| EP (1) | EP1085611B1 (de) |
| KR (1) | KR20010039892A (de) |
| CN (1) | CN1162942C (de) |
| AT (1) | ATE242555T1 (de) |
| DE (1) | DE60003132T2 (de) |
| NO (1) | NO318944B1 (de) |
| TW (1) | TW588478B (de) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200285944Y1 (ko) * | 1999-05-26 | 2002-08-22 | 삼성전자 주식회사 | 엘씨디 모니터의 샤시 고정장치 |
| US6730998B1 (en) * | 2000-02-10 | 2004-05-04 | Micron Technology, Inc. | Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same |
| US6468891B2 (en) * | 2000-02-24 | 2002-10-22 | Micron Technology, Inc. | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| TWI304909B (de) * | 2000-10-04 | 2009-01-01 | Matsushita Electric Ind Co Ltd | |
| US6506059B2 (en) * | 2001-03-29 | 2003-01-14 | Avx Corporation | Electrical connectors for display devices |
| JP3616031B2 (ja) * | 2001-05-10 | 2005-02-02 | 富士通株式会社 | 異方導電性シート、その製造方法、電子装置及び動作試験用検査装置 |
| JP2004146210A (ja) * | 2002-10-24 | 2004-05-20 | Fuji Polymer Industries Co Ltd | 異方導電性エラスチックコネクタ |
| US7405948B2 (en) * | 2003-01-22 | 2008-07-29 | Nec Corporation | Circuit board device and method of interconnecting wiring boards |
| TW566722U (en) * | 2003-05-02 | 2003-12-11 | Compal Electronics Inc | Connector structure |
| KR20040097496A (ko) * | 2003-05-12 | 2004-11-18 | 일진다이아몬드(주) | 액정 디스플레이 패널 및 액정 프로젝터 |
| KR100637429B1 (ko) * | 2003-10-24 | 2006-10-20 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
| DE102004027788A1 (de) * | 2004-06-08 | 2006-01-05 | Infineon Technologies Ag | Halbleiterbasisbauteil mit Umverdrahtungssubstrat und Zwischenverdrahtungsplatte für einen Halbleiterbauteilstapel sowie Verfahren zu deren Herstellung |
| CN2745247Y (zh) * | 2004-09-16 | 2005-12-07 | 鸿富锦精密工业（深圳）有限公司 | 连接器固定装置 |
| US7721118B1 (en) | 2004-09-27 | 2010-05-18 | Nvidia Corporation | Optimizing power and performance for multi-processor graphics processing |
| US8066515B2 (en) * | 2004-11-17 | 2011-11-29 | Nvidia Corporation | Multiple graphics adapter connection systems |
| US8212831B1 (en) | 2004-12-15 | 2012-07-03 | Nvidia Corporation | Broadcast aperture remapping for multiple graphics adapters |
| US8134568B1 (en) | 2004-12-15 | 2012-03-13 | Nvidia Corporation | Frame buffer region redirection for multiple graphics adapters |
| KR20080016271A (ko) * | 2006-08-18 | 2008-02-21 | 삼성전자주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| WO2008100775A1 (en) * | 2007-02-09 | 2008-08-21 | 3M Innovative Properties Company | Clip for maintaining connection with electrical tail |
| FR2915628B1 (fr) * | 2007-04-27 | 2011-12-30 | Valeo Systemes Thermiques | Dispositif electronique comportant deux composants electroniques relies entre eux par un connecteur souple |
| KR100911007B1 (ko) * | 2007-05-18 | 2009-08-05 | 삼성에스디아이 주식회사 | 샤시 베이스 조립체와, 이를 포함한 디스플레이 장치 |
| JPWO2008156175A1 (ja) * | 2007-06-20 | 2010-08-26 | 株式会社ブリヂストン | 情報表示用パネル |
| JP4721297B2 (ja) * | 2008-11-20 | 2011-07-13 | 株式会社ヨコオ | 中継コネクタ |
| JP5465898B2 (ja) * | 2009-03-11 | 2014-04-09 | 日本航空電子工業株式会社 | 光半導体デバイス、ソケットおよび光半導体ユニット |
| US8436251B2 (en) * | 2009-07-08 | 2013-05-07 | Medtronic, Inc. | Ribbon connecting electrical components |
| US9876298B2 (en) | 2014-08-04 | 2018-01-23 | Te Connectivity Corporation | Flexible connector and methods of manufacture |
| JP6754031B2 (ja) * | 2015-12-25 | 2020-09-09 | 北川工業株式会社 | クリップ及び固定機構 |
| JP6387214B1 (ja) * | 2017-12-22 | 2018-09-05 | 堺ディスプレイプロダクト株式会社 | 表示装置および表示装置の製造方法 |
| JP6433629B1 (ja) * | 2017-12-22 | 2018-12-05 | 堺ディスプレイプロダクト株式会社 | 表示装置および表示装置の製造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3492538A (en) * | 1967-09-07 | 1970-01-27 | Thomas & Betts Corp | Removable stack interconnection system |
| GB1513282A (en) * | 1974-08-09 | 1978-06-07 | Seiko Instr & Electronics | Liquid crystal display device |
| US4028794A (en) * | 1974-09-09 | 1977-06-14 | Amp Incorporated | Laminated connector |
| US4132984A (en) * | 1976-05-20 | 1979-01-02 | Liquid Xtal Displays Inc. | Liquid crystal display |
| AU516166B2 (en) * | 1977-09-24 | 1981-05-21 | Amp Incorporated | Electrical connector |
| JPS568081U (de) * | 1979-06-29 | 1981-01-23 | ||
| JPS5740874A (en) * | 1980-08-22 | 1982-03-06 | Shinetsu Polymer Co | Pressure contact holding type connector |
| US4973256A (en) * | 1989-08-18 | 1990-11-27 | Texas Instruments Incorporated | Device under test interface board and test electronic card interconnection in semiconductor test system |
| GB9303533D0 (en) * | 1993-02-22 | 1993-04-07 | Amp Holland | Mother board-to-daughter board elastomeric electrical connector |
| US5462441A (en) * | 1994-05-27 | 1995-10-31 | Renn; Robert M. | Low profile electrical connector |
| US5588846A (en) * | 1995-08-25 | 1996-12-31 | The Whitaker Corporation | Right angle electrical connector |
| US5888076A (en) * | 1997-06-13 | 1999-03-30 | Japan Aviation Elecronics Industry, Limited | LCD panel connector for use in connection between an LCD panel and a circuit board |
-
2000
- 2000-08-21 TW TW089116891A patent/TW588478B/zh not_active IP Right Cessation
- 2000-08-22 AT AT00117984T patent/ATE242555T1/de not_active IP Right Cessation
- 2000-08-22 DE DE60003132T patent/DE60003132T2/de not_active Expired - Fee Related
- 2000-08-22 EP EP00117984A patent/EP1085611B1/de not_active Expired - Lifetime
- 2000-08-24 NO NO20004248A patent/NO318944B1/no not_active IP Right Cessation
- 2000-09-08 US US09/657,978 patent/US6296493B1/en not_active Expired - Fee Related
- 2000-09-15 CN CNB001270680A patent/CN1162942C/zh not_active Expired - Fee Related
- 2000-09-16 KR KR1020000054434A patent/KR20010039892A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1085611B1 (de) | 2003-06-04 |
| NO20004248D0 (no) | 2000-08-24 |
| DE60003132D1 (de) | 2003-07-10 |
| ATE242555T1 (de) | 2003-06-15 |
| NO20004248L (no) | 2001-03-19 |
| US6296493B1 (en) | 2001-10-02 |
| KR20010039892A (ko) | 2001-05-15 |
| DE60003132T2 (de) | 2004-04-08 |
| TW588478B (en) | 2004-05-21 |
| CN1289945A (zh) | 2001-04-04 |
| CN1162942C (zh) | 2004-08-18 |
| EP1085611A1 (de) | 2001-03-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM1K | Lapsed by not paying the annual fees |