DE60000696D1 - Verfahren zur Verbesserung der Adhäsion von Polymeren an Metalloberflächen - Google Patents
Verfahren zur Verbesserung der Adhäsion von Polymeren an MetalloberflächenInfo
- Publication number
- DE60000696D1 DE60000696D1 DE60000696T DE60000696T DE60000696D1 DE 60000696 D1 DE60000696 D1 DE 60000696D1 DE 60000696 T DE60000696 T DE 60000696T DE 60000696 T DE60000696 T DE 60000696T DE 60000696 D1 DE60000696 D1 DE 60000696D1
- Authority
- DE
- Germany
- Prior art keywords
- polymers
- adhesion
- improving
- metal surfaces
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/40—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing molybdates, tungstates or vanadates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/166—Metal in the pretreated surface to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
- C09J2400/226—Presence of unspecified polymer in the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Treatment Of Metals (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/229,019 US6146701A (en) | 1997-06-12 | 1999-01-12 | Process for improving the adhension of polymeric materials to metal surfaces |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60000696D1 true DE60000696D1 (de) | 2002-12-12 |
DE60000696T2 DE60000696T2 (de) | 2003-07-31 |
Family
ID=22859510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60000696T Expired - Lifetime DE60000696T2 (de) | 1999-01-12 | 2000-01-12 | Verfahren zur Verbesserung der Adhäsion von Polymeren an Metalloberflächen |
Country Status (6)
Country | Link |
---|---|
US (1) | US6146701A (de) |
EP (1) | EP1020503B1 (de) |
JP (1) | JP3798593B2 (de) |
DE (1) | DE60000696T2 (de) |
ES (1) | ES2186613T3 (de) |
TW (1) | TW577914B (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7351353B1 (en) * | 2000-01-07 | 2008-04-01 | Electrochemicals, Inc. | Method for roughening copper surfaces for bonding to substrates |
ES2270789T3 (es) * | 2000-05-22 | 2007-04-16 | Macdermid Incorporated | Proceso para mejorar la adhesion de materiales polimericos a supercifies metalicas. |
US6383272B1 (en) * | 2000-06-08 | 2002-05-07 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
US6419784B1 (en) * | 2000-06-21 | 2002-07-16 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
US6521139B1 (en) | 2000-08-04 | 2003-02-18 | Shipley Company L.L.C. | Composition for circuit board manufacture |
JP4687852B2 (ja) * | 2001-06-25 | 2011-05-25 | 三菱瓦斯化学株式会社 | 銅および銅合金の表面処理剤 |
US6746547B2 (en) | 2002-03-05 | 2004-06-08 | Rd Chemical Company | Methods and compositions for oxide production on copper |
US6716281B2 (en) * | 2002-05-10 | 2004-04-06 | Electrochemicals, Inc. | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates |
US7186305B2 (en) * | 2002-11-26 | 2007-03-06 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
US7232478B2 (en) * | 2003-07-14 | 2007-06-19 | Enthone Inc. | Adhesion promotion in printed circuit boards |
US7214304B2 (en) * | 2004-10-13 | 2007-05-08 | Hyunjung Lee | Process for preparing a non-conductive substrate for electroplating |
US7645393B2 (en) * | 2007-04-27 | 2010-01-12 | Kesheng Feng | Metal surface treatment composition |
US8308893B2 (en) * | 2010-02-01 | 2012-11-13 | Ming De Wang | Nano-oxide process for bonding copper/copper alloy and resin |
KR101688407B1 (ko) * | 2013-10-17 | 2016-12-22 | 다우 코닝 도레이 캄파니 리미티드 | 경화성 실리콘 조성물 및 광 반도체 장치 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE400575B (sv) * | 1974-12-13 | 1978-04-03 | Nordnero Ab | Bad for betning av koppar och dess legeringar |
JPS52150104A (en) * | 1976-06-07 | 1977-12-13 | Fuji Photo Film Co Ltd | Photoosensitive lithographic press plate material |
JPS57116775A (en) * | 1981-01-14 | 1982-07-20 | Toshiba Corp | Etching solution for nickel |
US4409037A (en) * | 1982-04-05 | 1983-10-11 | Macdermid Incorporated | Adhesion promoter for printed circuits |
US4844981A (en) * | 1982-04-05 | 1989-07-04 | Macdermid, Incorporated | Adhesion promoter for printed circuits |
US4512818A (en) * | 1983-05-23 | 1985-04-23 | Shipley Company Inc. | Solution for formation of black oxide |
JPS6113688A (ja) * | 1984-06-28 | 1986-01-21 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔およびその製造方法 |
JPS61176192A (ja) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | 銅と樹脂との接着方法 |
US4775444A (en) * | 1987-08-26 | 1988-10-04 | Macdermid, Incorporated | Process for fabricating multilayer circuit boards |
JPH0713304B2 (ja) * | 1987-12-14 | 1995-02-15 | 日立化成工業株式会社 | 銅の表面処理法 |
JPH01246393A (ja) * | 1988-03-25 | 1989-10-02 | Fukuda Metal Foil & Powder Co Ltd | 内層用銅箔または銅張積層板の表面処理方法 |
US4997722A (en) * | 1989-07-10 | 1991-03-05 | Edward Adler | Composition and method for improving adherence of copper foil to resinous substrates |
US4997516A (en) * | 1989-07-10 | 1991-03-05 | Edward Adler | Method for improving adherence of copper foil to resinous substrates |
JPH0379778A (ja) * | 1989-08-21 | 1991-04-04 | Sanshin Chem Ind Co Ltd | 銅のエッチング液組成物およびエッチング方法 |
US5037482A (en) * | 1990-02-16 | 1991-08-06 | Macdermid, Incorporated | Composition and method for improving adhesion of coatings to copper surfaces |
US5289630A (en) * | 1991-07-22 | 1994-03-01 | Macdermid, Incorporated | Process for fabricating multilayer printed circuits |
JP3079778B2 (ja) | 1992-06-11 | 2000-08-21 | 株式会社デンソー | 内燃機関のバルブタイミング調整装置 |
JP3387528B2 (ja) * | 1992-08-07 | 2003-03-17 | 朝日化学工業株式会社 | 銅または銅合金のエッチング用組成物およびそのエッチング方法 |
JP2717911B2 (ja) * | 1992-11-19 | 1998-02-25 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
JP3225471B2 (ja) * | 1992-12-24 | 2001-11-05 | 旭電化工業株式会社 | 銅溶解剤 |
AU5668394A (en) * | 1993-01-11 | 1994-08-15 | Macdermid, Incorporated | Phosphating compositions and processes, particularly for use in fabrication of printed circuits utilizing organic resists |
US5259979A (en) * | 1993-01-13 | 1993-11-09 | Oliver Sales Company | Process for regeneration of cleaning compounds |
JP3347457B2 (ja) * | 1994-02-24 | 2002-11-20 | 日本電解株式会社 | 非シアン系銅−亜鉛電気めっき浴、これを用いたプリント配線板用銅箔の表面処理方法及びプリント配線板用銅箔 |
JP2781954B2 (ja) * | 1994-03-04 | 1998-07-30 | メック株式会社 | 銅および銅合金の表面処理剤 |
US5802714A (en) * | 1994-07-19 | 1998-09-08 | Hitachi, Ltd. | Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment |
JP3400558B2 (ja) * | 1994-08-12 | 2003-04-28 | メック株式会社 | 銅および銅合金のエッチング液 |
GB9425090D0 (en) * | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
JP2923524B2 (ja) * | 1995-08-01 | 1999-07-26 | メック株式会社 | 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法 |
JPH105626A (ja) * | 1996-06-26 | 1998-01-13 | Mitsubishi Kakoki Kaisha Ltd | 遠心分離装置 |
JP2001506971A (ja) * | 1996-09-18 | 2001-05-29 | メトレックス リサーチ コーポレイション | 過酸化水素消毒および滅菌組成物 |
US5869130A (en) * | 1997-06-12 | 1999-02-09 | Mac Dermid, Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
JPH11240683A (ja) * | 1998-02-25 | 1999-09-07 | Mitsubishi Electric Corp | エレベーター用板戸 |
-
1999
- 1999-01-12 US US09/229,019 patent/US6146701A/en not_active Expired - Lifetime
- 1999-12-24 TW TW088122898A patent/TW577914B/zh not_active IP Right Cessation
- 1999-12-28 JP JP37329699A patent/JP3798593B2/ja not_active Expired - Lifetime
-
2000
- 2000-01-12 DE DE60000696T patent/DE60000696T2/de not_active Expired - Lifetime
- 2000-01-12 EP EP00300183A patent/EP1020503B1/de not_active Expired - Lifetime
- 2000-01-12 ES ES00300183T patent/ES2186613T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2000234084A (ja) | 2000-08-29 |
JP3798593B2 (ja) | 2006-07-19 |
US6146701A (en) | 2000-11-14 |
ES2186613T3 (es) | 2003-05-16 |
EP1020503A1 (de) | 2000-07-19 |
TW577914B (en) | 2004-03-01 |
DE60000696T2 (de) | 2003-07-31 |
EP1020503B1 (de) | 2002-11-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60142648D1 (de) | Zusammensetzung zur Verbesserung der Haftfähigkeit von Polymeren an der Metalloberflächen | |
ATE239048T1 (de) | Verfahren zur rheologieänderung von polymeren | |
DE60000696T2 (de) | Verfahren zur Verbesserung der Adhäsion von Polymeren an Metalloberflächen | |
DE60219318D1 (de) | Verfahren zur beschichtung von hydrogel gegenständen in der form | |
DE60013197D1 (de) | Verfahren zur Hemmung der Polymerisation von leicht polymerisierenden Substanzen | |
DE69516555T2 (de) | Verfahren zur Verbesserung der Adhäsion im Fluorpolymerbeschichtungsverfahren | |
DE50203798D1 (de) | Verfahren zur beschichtung von gegenständen | |
DE59802791D1 (de) | Verfahren zur sputterbeschichtung von oberflächen | |
ATE191721T1 (de) | Verfahren zur zersetzung von polymeren zu monomeren | |
DE60115253D1 (de) | Verfahren zur steigerung der adhäsion von polymeren an metallen | |
ATE293130T1 (de) | Verfahren zur hydrierung von ungesättigten polymeren | |
DE69939253D1 (de) | Verfahren zur veränderung von polymeroberflächen zur besseren benetzbarkeit | |
DE50107254D1 (de) | Verfahren zur Instandsetzung von metallischen Bauteilen | |
DE60007099D1 (de) | Verfahren zur oberflächenbehandlung von polymeren | |
DE69710640T2 (de) | Verfahren zur Erhöhung der Wanddicke von Metallrohren | |
DE69811199T2 (de) | Kontinuierliches Verfahren zur Herstellung von Polymeren | |
DE69602343D1 (de) | Verfahren zur Verbesserung der Stabilität von leitfähigen Polymeren | |
DE59700338D1 (de) | Verfahren zur Verbesserung des Korrosionsschutzes von aluminiumbeschichteten Oberflächen | |
DE60012417D1 (de) | Verfahren zur Herstellung von Polymeren | |
DE60032224D1 (de) | Verfahren zur polymerisation von silalkylensiloxanen | |
DE59900154D1 (de) | Verfahren zur Herstellung von Klebemitteln mit verbesserter Adhäsion | |
DE60030691D1 (de) | Verfahren zur Verbesserung der Adhäsion von Polymermaterialien an Metalloberflächen | |
DE60213912D1 (de) | Verfahren zur Erholung der Umwelt in städtischen Regionen | |
DE59809314D1 (de) | Verfahren zur Aufrauhung von Kunststoffoberflächen | |
DE50012927D1 (de) | Verfahren zur kontinuierlichen Bestimmung der optischen Schichtdicke von Beschichtungen |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |