DE59802304D1 - Reduktives Ni-Bad - Google Patents

Reduktives Ni-Bad

Info

Publication number
DE59802304D1
DE59802304D1 DE59802304T DE59802304T DE59802304D1 DE 59802304 D1 DE59802304 D1 DE 59802304D1 DE 59802304 T DE59802304 T DE 59802304T DE 59802304 T DE59802304 T DE 59802304T DE 59802304 D1 DE59802304 D1 DE 59802304D1
Authority
DE
Germany
Prior art keywords
nickel
bath
reductive
acid
complexant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE59802304T
Other languages
English (en)
Inventor
Dr Freudenberger
Walter Macht
Heidemarie Stiesch
Erwin Marka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doduco Contacts and Refining GmbH
Original Assignee
AMI Doduco GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMI Doduco GmbH filed Critical AMI Doduco GmbH
Application granted granted Critical
Publication of DE59802304D1 publication Critical patent/DE59802304D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Catalysts (AREA)
DE59802304T 1997-08-06 1998-07-31 Reduktives Ni-Bad Expired - Fee Related DE59802304D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19733991A DE19733991A1 (de) 1997-08-06 1997-08-06 Reduktives Ni-Bad

Publications (1)

Publication Number Publication Date
DE59802304D1 true DE59802304D1 (de) 2002-01-17

Family

ID=7838137

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19733991A Withdrawn DE19733991A1 (de) 1997-08-06 1997-08-06 Reduktives Ni-Bad
DE59802304T Expired - Fee Related DE59802304D1 (de) 1997-08-06 1998-07-31 Reduktives Ni-Bad

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19733991A Withdrawn DE19733991A1 (de) 1997-08-06 1997-08-06 Reduktives Ni-Bad

Country Status (3)

Country Link
EP (1) EP0897998B1 (de)
AT (1) ATE210207T1 (de)
DE (2) DE19733991A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19908755A1 (de) * 1999-02-19 2000-08-24 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf elektrisch nichtleitenden Oberflächen
US7803457B2 (en) 2003-12-29 2010-09-28 General Electric Company Composite coatings for groundwall insulation, method of manufacture thereof and articles derived therefrom
CN100590751C (zh) * 2004-09-02 2010-02-17 积水化学工业株式会社 导电性微粒以及各向异性导电材料
CN103422079B (zh) 2012-05-22 2016-04-13 比亚迪股份有限公司 一种化学镀铜液及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3489576A (en) * 1966-08-04 1970-01-13 Gen Motors Corp Chemical nickel plating
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
US4983428A (en) * 1988-06-09 1991-01-08 United Technologies Corporation Ethylenethiourea wear resistant electroless nickel-boron coating compositions
KR960005765A (ko) * 1994-07-14 1996-02-23 모리시다 요이치 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법
TW390915B (en) * 1995-10-23 2000-05-21 Uyemura C & Co Ltd Electroless nickel plating solution and method

Also Published As

Publication number Publication date
DE19733991A1 (de) 1999-02-11
ATE210207T1 (de) 2001-12-15
EP0897998B1 (de) 2001-12-05
EP0897998A3 (de) 1999-05-12
EP0897998A2 (de) 1999-02-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee