EP0897998A3 - Reduktives Ni-Bad - Google Patents

Reduktives Ni-Bad Download PDF

Info

Publication number
EP0897998A3
EP0897998A3 EP98114391A EP98114391A EP0897998A3 EP 0897998 A3 EP0897998 A3 EP 0897998A3 EP 98114391 A EP98114391 A EP 98114391A EP 98114391 A EP98114391 A EP 98114391A EP 0897998 A3 EP0897998 A3 EP 0897998A3
Authority
EP
European Patent Office
Prior art keywords
nickel
bath
nickel bath
reductive
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP98114391A
Other languages
English (en)
French (fr)
Other versions
EP0897998B1 (de
EP0897998A2 (de
Inventor
Renate Dr. Freudenberger
Walter Macht
Heidemarie Stiesch
Erwin Marka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doduco Contacts and Refining GmbH
Original Assignee
AMI Doduco GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMI Doduco GmbH filed Critical AMI Doduco GmbH
Publication of EP0897998A2 publication Critical patent/EP0897998A2/de
Publication of EP0897998A3 publication Critical patent/EP0897998A3/de
Application granted granted Critical
Publication of EP0897998B1 publication Critical patent/EP0897998B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Abstract

Es wird ein wässriges, saures, reduktiv abscheidendes Bad zum stromlosen Abscheiden von Nickel beschrieben, das folgende Zusammensetzung hat: Nickel in Form eines Nickelsalzes: ein Hypophoshit als Reduktionsmittel; eine oder mehrere Verbindungen aus der Gruppe der Carbon- und Hydroxicarbonsäuren, einschließlich ihrer Di- und Tricarbonsäuren als Komplexbildner für das Nickel: ein Blei-, Zinn-, Arsen-, Thallium- oder Molybdan-Acetat oder -Sulfat als Stabilisator und als Beschleuniger ein Thioharnstoff-, Isothioharnstoff- oder Rhodanidderivat, welche als Substituenten, am Stickstoff oder Schwefel, Alkyl- und/oder Aryl-Gruppen aufweisen. Durch die Carbon- und Hydroxicarbonsäuren arbeitet das Bad in einem pH-Bereich zwischen 5 und 6. Das Bad wird bei einer Temperatur zwischen 80° und 90°C betrieben. Es wird eine Lebensdauer des Bades von bis zu 8 MTO erreicht. Als Komolexbildner für den Stabilisator kann dem Bad zusätzlich Methylglycin-Diessigsäure zugesetzt sein.
EP98114391A 1997-08-06 1998-07-31 Reduktives Ni-Bad Expired - Lifetime EP0897998B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19733991 1997-08-06
DE19733991A DE19733991A1 (de) 1997-08-06 1997-08-06 Reduktives Ni-Bad

Publications (3)

Publication Number Publication Date
EP0897998A2 EP0897998A2 (de) 1999-02-24
EP0897998A3 true EP0897998A3 (de) 1999-05-12
EP0897998B1 EP0897998B1 (de) 2001-12-05

Family

ID=7838137

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98114391A Expired - Lifetime EP0897998B1 (de) 1997-08-06 1998-07-31 Reduktives Ni-Bad

Country Status (3)

Country Link
EP (1) EP0897998B1 (de)
AT (1) ATE210207T1 (de)
DE (2) DE19733991A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19908755A1 (de) * 1999-02-19 2000-08-24 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf elektrisch nichtleitenden Oberflächen
US7803457B2 (en) 2003-12-29 2010-09-28 General Electric Company Composite coatings for groundwall insulation, method of manufacture thereof and articles derived therefrom
JP4235227B2 (ja) * 2004-09-02 2009-03-11 積水化学工業株式会社 導電性微粒子及び異方性導電材料
CN103422079B (zh) 2012-05-22 2016-04-13 比亚迪股份有限公司 一种化学镀铜液及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3489576A (en) * 1966-08-04 1970-01-13 Gen Motors Corp Chemical nickel plating
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
EP0346265A1 (de) * 1988-06-09 1989-12-13 United Technologies Corporation Ethylenthioharnstoff enthaltende Zusammensetzungen zur Herstellung von verschleissfesten, stromlos abgeschiedenen Nickel-Borüberzügen
EP0692554A1 (de) * 1994-07-14 1996-01-17 Matsushita Electric Industrial Co., Ltd. Stromloses Plattierbad und Verfahren zur Herstellung einer elektrischen Verbindungen eines Halbleiters Anordnung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW390915B (en) * 1995-10-23 2000-05-21 Uyemura C & Co Ltd Electroless nickel plating solution and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3489576A (en) * 1966-08-04 1970-01-13 Gen Motors Corp Chemical nickel plating
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
EP0346265A1 (de) * 1988-06-09 1989-12-13 United Technologies Corporation Ethylenthioharnstoff enthaltende Zusammensetzungen zur Herstellung von verschleissfesten, stromlos abgeschiedenen Nickel-Borüberzügen
EP0692554A1 (de) * 1994-07-14 1996-01-17 Matsushita Electric Industrial Co., Ltd. Stromloses Plattierbad und Verfahren zur Herstellung einer elektrischen Verbindungen eines Halbleiters Anordnung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
KEPING H ET AL: "A SUPER HIGH SPEED ELECTROLESS NICKEL PLATING PROCESS", TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, vol. 74, no. PART 03, 1 May 1996 (1996-05-01), pages 91 - 94, XP000594644 *

Also Published As

Publication number Publication date
EP0897998B1 (de) 2001-12-05
DE19733991A1 (de) 1999-02-11
ATE210207T1 (de) 2001-12-15
EP0897998A2 (de) 1999-02-24
DE59802304D1 (de) 2002-01-17

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