DE59502220D1 - Materialbearbeitungseinrichtung - Google Patents

Materialbearbeitungseinrichtung

Info

Publication number
DE59502220D1
DE59502220D1 DE59502220T DE59502220T DE59502220D1 DE 59502220 D1 DE59502220 D1 DE 59502220D1 DE 59502220 T DE59502220 T DE 59502220T DE 59502220 T DE59502220 T DE 59502220T DE 59502220 D1 DE59502220 D1 DE 59502220D1
Authority
DE
Germany
Prior art keywords
material processing
processing facility
facility
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE59502220T
Other languages
English (en)
Inventor
In Den Baeumen Joachim Schulte
Robert Grub
Herbert Gross
Juergen Schweizer
Siegfrid Dippon
Wilhelm Tamm
Si-Ty Lam
Hans-Juergen Kahlert
Heinrich Endert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss AG
Hewlett Packard GmbH Germany
Original Assignee
Carl Zeiss AG
Hewlett Packard GmbH Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP94105764A external-priority patent/EP0677985B1/de
Application filed by Carl Zeiss AG, Hewlett Packard GmbH Germany filed Critical Carl Zeiss AG
Application granted granted Critical
Publication of DE59502220D1 publication Critical patent/DE59502220D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/045Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036Multilayers with layers of different types
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0329Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0376Flush conductors, i.e. flush with the surface of the printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025Abrading, e.g. grinding or sand blasting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0023Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/425Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
DE59502220T 1994-04-14 1995-04-12 Materialbearbeitungseinrichtung Expired - Lifetime DE59502220D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP94105764A EP0677985B1 (de) 1994-04-14 1994-04-14 Verfahren zur Herstellung von Leiterplatten
DE4423040 1994-07-01

Publications (1)

Publication Number Publication Date
DE59502220D1 true DE59502220D1 (de) 1998-06-25

Family

ID=25937893

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19513354A Withdrawn DE19513354A1 (de) 1994-04-14 1995-04-08 Materialbearbeitungseinrichtung
DE59502220T Expired - Lifetime DE59502220D1 (de) 1994-04-14 1995-04-12 Materialbearbeitungseinrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19513354A Withdrawn DE19513354A1 (de) 1994-04-14 1995-04-08 Materialbearbeitungseinrichtung

Country Status (4)

Country Link
US (1) US5676866A (de)
JP (1) JP3748280B2 (de)
KR (1) KR100381943B1 (de)
DE (2) DE19513354A1 (de)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6373026B1 (en) * 1996-07-31 2002-04-16 Mitsubishi Denki Kabushiki Kaisha Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
GB9601049D0 (en) 1996-01-18 1996-03-20 Xaar Ltd Methods of and apparatus for forming nozzles
DE19707834A1 (de) * 1996-04-09 1997-10-16 Zeiss Carl Fa Materialbestrahlungsgerät und Verfahren zum Betrieb von Materialbestrahlungsgeräten
JP3689490B2 (ja) * 1996-06-07 2005-08-31 キヤノン株式会社 ノズル部材の製造方法及びそれを用いた加工装置
DE19734983A1 (de) * 1996-09-04 1998-03-05 Zeiss Carl Fa Optische Anordnung
US6037103A (en) 1996-12-11 2000-03-14 Nitto Denko Corporation Method for forming hole in printed board
US6040552A (en) * 1997-01-30 2000-03-21 Jain; Kanti High-speed drilling system for micro-via pattern formation, and resulting structure
JPH1128591A (ja) * 1997-07-07 1999-02-02 Hitachi Electron Eng Co Ltd テクスチャ加工装置
KR100369688B1 (ko) * 1997-12-12 2003-01-30 마쯔시다덴기산교 가부시키가이샤 레이저 가공 방법 및 레이저 가공 장치와 그 제어 방법
DE19801364A1 (de) * 1998-01-16 1999-07-22 Zeiss Carl Fa Werkstückbestrahlungsanlage
US6037564A (en) * 1998-03-31 2000-03-14 Matsushita Electric Industrial Co., Ltd. Method for scanning a beam and an apparatus therefor
US6774340B1 (en) * 1998-11-25 2004-08-10 Komatsu Limited Shape of microdot mark formed by laser beam and microdot marking method
DE19915000C2 (de) * 1999-04-01 2002-05-08 Microlas Lasersystem Gmbh Vorrichtung und Verfahren zum Steuern der Intensitätsverteilung eines Laserstrahls
CA2370832A1 (en) * 1999-04-27 2000-11-02 Gsi Lumonics Inc. A system and method for material processing using multiple laser beams
US6396025B1 (en) 1999-07-01 2002-05-28 Aeromet Corporation Powder feed nozzle for laser welding
DE59905945D1 (de) * 1999-12-23 2003-07-17 Leister Process Technologies S Verfahren und Vorrichtung zum Erwärmen von mindestens zwei Elementen mittels Laserstrahlen mit hoher Energiedichte
US6433303B1 (en) 2000-03-31 2002-08-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus using laser pulses to make an array of microcavity holes
US6574024B1 (en) 2000-03-31 2003-06-03 Matsushita Electric Industrial Co., Ltd. Laser beam homogenization by scanning a beam onto a mask
US6605799B2 (en) 2000-05-25 2003-08-12 Westar Photonics Modulation of laser energy with a predefined pattern
US6605796B2 (en) * 2000-05-25 2003-08-12 Westar Photonics Laser beam shaping device and apparatus for material machining
US6329634B1 (en) 2000-07-17 2001-12-11 Carl-Zeiss-Stiftung Workpiece irradiation system
DE10060176B4 (de) * 2000-12-04 2008-06-19 Precitec Kg Laserbearbeitungskopf
US6689985B2 (en) 2001-01-17 2004-02-10 Orbotech, Ltd. Laser drill for use in electrical circuit fabrication
US6777645B2 (en) 2001-03-29 2004-08-17 Gsi Lumonics Corporation High-speed, precision, laser-based method and system for processing material of one or more targets within a field
KR100990300B1 (ko) 2001-06-13 2010-10-26 오르보테크 엘티디. 에너지 전달 시스템
US6670570B2 (en) * 2001-06-15 2003-12-30 L'air Liquide - Societe Anonyme A Directoire Et Couseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Methods and apparatus for localized heating of metallic and non-metallic surfaces
WO2003009039A1 (de) * 2001-07-17 2003-01-30 Sieb & Meyer Ag SPIEGELVERSTELLVORRICHTUNG INSBESONDERE FüR LASERBEARBEITUNGSMASCHINEN
US6951995B2 (en) 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
DE10307309B4 (de) * 2003-02-20 2007-06-14 Hitachi Via Mechanics, Ltd., Ebina Vorrichtung und Verfahren zur Bearbeitung von elektrischen Schaltungssubstraten mittels Laser
US6867388B2 (en) * 2003-04-08 2005-03-15 Branson Ultrasonics Corporation Electronic masking laser imaging system
US6947454B2 (en) * 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
US7521651B2 (en) * 2003-09-12 2009-04-21 Orbotech Ltd Multiple beam micro-machining system and method
US20060257929A1 (en) * 2003-11-12 2006-11-16 Microbiosystems, Limited Partnership Method for the rapid taxonomic identification of pathogenic microorganisms and their toxic proteins
WO2005084874A1 (ja) * 2004-03-05 2005-09-15 Olympus Corporation レーザ加工装置
US7233424B2 (en) * 2004-08-30 2007-06-19 Dot Intellectual Properties, Llc Steering assembly with electromagnetic actuators
US20060114948A1 (en) * 2004-11-29 2006-06-01 Lo Ho W Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
EP1728582A1 (de) * 2005-05-31 2006-12-06 Trumpf Laser- und Systemtechnik GmbH Einrichtung zur Erfassung von Veränderungen eines Laserstrahls
DE102006007750A1 (de) * 2006-02-20 2007-08-23 Wavelight Ag Verfahren und optische Anordnung zur Kontrolle der Fokustiefe eines abbildenden optischen Systems
US7615722B2 (en) 2006-07-17 2009-11-10 Coherent, Inc. Amorphous silicon crystallization using combined beams from optically pumped semiconductor lasers
US20080013182A1 (en) * 2006-07-17 2008-01-17 Joerg Ferber Two-stage laser-beam homogenizer
DE102007032044A1 (de) * 2007-07-10 2009-01-15 Robert Bosch Gmbh Werkzeugmaschine
US8178818B2 (en) * 2008-03-31 2012-05-15 Electro Scientific Industries, Inc. Photonic milling using dynamic beam arrays
US7982160B2 (en) * 2008-03-31 2011-07-19 Electro Scientific Industries, Inc. Photonic clock stabilized laser comb processing
CN102245339B (zh) * 2008-10-10 2015-08-26 Ipg微系统有限公司 具有多重细激光束传输系统的激光加工系统和方法
WO2011082065A2 (en) * 2009-12-30 2011-07-07 Gsi Group Corporation Link processing with high speed beam deflection
US8946594B2 (en) * 2011-11-04 2015-02-03 Applied Materials, Inc. Optical design for line generation using microlens array
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
TWI730945B (zh) 2014-07-08 2021-06-21 美商康寧公司 用於雷射處理材料的方法與設備
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
EP3169477B1 (de) * 2014-07-14 2020-01-29 Corning Incorporated System und verfahren zur verarbeitung transparenter materialien mithilfe von in länge und durchmesser anpassbaren laserstrahlbrennlinien
US20160016255A1 (en) * 2014-07-17 2016-01-21 Siemens Energy, Inc. Laser correction of metal deformation
US10307867B2 (en) * 2014-11-05 2019-06-04 Asm Technology Singapore Pte Ltd Laser fiber array for singulating semiconductor wafers
US10047001B2 (en) * 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
WO2016115017A1 (en) 2015-01-12 2016-07-21 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
WO2016122821A2 (en) * 2015-01-29 2016-08-04 Imra America, Inc. Laser-based modification of transparent materials
US9855626B2 (en) * 2015-01-29 2018-01-02 Rohr, Inc. Forming a pattern of apertures in an object with a plurality of laser beams
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
CN107666983B (zh) 2015-03-27 2020-10-02 康宁股份有限公司 可透气窗及其制造方法
JP2019532908A (ja) 2016-08-30 2019-11-14 コーニング インコーポレイテッド 強度マッピング光学システムによる材料のレーザー切断
CN113399816B (zh) 2016-09-30 2023-05-16 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
WO2018081031A1 (en) 2016-10-24 2018-05-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US20210283719A1 (en) * 2020-03-12 2021-09-16 Rohr, Inc. Substrate perforation system & method using beamlets
CN117673209B (zh) * 2024-02-01 2024-07-09 天合光能股份有限公司 太阳能电池及其制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2708039A1 (de) * 1977-02-24 1979-04-19 Boc Ltd Einrichtung zur aufspaltung eines zusammengesetzten laserstrahls in zwei sekundaerstrahlen
DE2918283C2 (de) * 1979-05-07 1983-04-21 Carl Baasel, Lasertechnik KG, 8000 München Gerät zur Substratbehandlung mit einem Drehspiegel od. dgl.
US4560641A (en) * 1982-03-26 1985-12-24 Hitachi, Ltd. Method for forming fine multilayer resist patterns
GB8306951D0 (en) * 1983-03-14 1983-04-20 Ici Plc Energy beam focusing apparatus
US4713518A (en) * 1984-06-08 1987-12-15 Semiconductor Energy Laboratory Co., Ltd. Electronic device manufacturing methods
US4623776A (en) * 1985-01-03 1986-11-18 Dow Corning Corporation Ring of light laser optics system
US4744615A (en) * 1986-01-29 1988-05-17 International Business Machines Corporation Laser beam homogenizer
JPS63193130A (ja) * 1987-02-05 1988-08-10 Canon Inc 光量制御装置
DE3831743A1 (de) * 1988-09-17 1990-03-29 Philips Patentverwaltung Vorrichtung zur bearbeitung eines werkstueckes mit laserlicht und verwendung dieser vorrichtung
JP2663560B2 (ja) * 1988-10-12 1997-10-15 日本電気株式会社 レーザ加工装置
JPH02175090A (ja) * 1988-12-27 1990-07-06 Isamu Miyamoto レーザビーム成形装置
JPH082511B2 (ja) * 1989-05-08 1996-01-17 松下電器産業株式会社 レーザ加工装置
DE3916264A1 (de) * 1989-05-18 1990-11-22 Diehl Gmbh & Co Einrichtung zur strahlfuehrung bei der laser-werkstueckbearbeitung
DE3918293A1 (de) * 1989-06-05 1990-12-06 Zeiss Carl Fa Linsenraster
JPH03142092A (ja) * 1989-10-25 1991-06-17 Matsushita Electric Ind Co Ltd レーザ光学系及びこれを用いたレーザ加工方法
US5170029A (en) * 1990-04-19 1992-12-08 Matsushita Electric Works, Ltd. Energy-beam welding method
JP2657957B2 (ja) * 1990-04-27 1997-09-30 キヤノン株式会社 投影装置及び光照射方法
US5302798A (en) * 1991-04-01 1994-04-12 Canon Kabushiki Kaisha Method of forming a hole with a laser and an apparatus for forming a hole with a laser
US5268554A (en) * 1992-06-29 1993-12-07 General Electric Co. Apparatus and system for positioning a laser beam
JP2658809B2 (ja) * 1992-08-27 1997-09-30 三菱電機株式会社 レーザ加工装置

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US5676866A (en) 1997-10-14
JPH0847789A (ja) 1996-02-20
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JP3748280B2 (ja) 2006-02-22
KR100381943B1 (ko) 2003-07-16
DE19513354A1 (de) 1995-12-14

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