DE59502220D1 - Materialbearbeitungseinrichtung - Google Patents
MaterialbearbeitungseinrichtungInfo
- Publication number
- DE59502220D1 DE59502220D1 DE59502220T DE59502220T DE59502220D1 DE 59502220 D1 DE59502220 D1 DE 59502220D1 DE 59502220 T DE59502220 T DE 59502220T DE 59502220 T DE59502220 T DE 59502220T DE 59502220 D1 DE59502220 D1 DE 59502220D1
- Authority
- DE
- Germany
- Prior art keywords
- material processing
- processing facility
- facility
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP94105764A EP0677985B1 (de) | 1994-04-14 | 1994-04-14 | Verfahren zur Herstellung von Leiterplatten |
DE4423040 | 1994-07-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE59502220D1 true DE59502220D1 (de) | 1998-06-25 |
Family
ID=25937893
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19513354A Withdrawn DE19513354A1 (de) | 1994-04-14 | 1995-04-08 | Materialbearbeitungseinrichtung |
DE59502220T Expired - Lifetime DE59502220D1 (de) | 1994-04-14 | 1995-04-12 | Materialbearbeitungseinrichtung |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19513354A Withdrawn DE19513354A1 (de) | 1994-04-14 | 1995-04-08 | Materialbearbeitungseinrichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5676866A (de) |
JP (1) | JP3748280B2 (de) |
KR (1) | KR100381943B1 (de) |
DE (2) | DE19513354A1 (de) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6373026B1 (en) * | 1996-07-31 | 2002-04-16 | Mitsubishi Denki Kabushiki Kaisha | Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board |
GB9601049D0 (en) | 1996-01-18 | 1996-03-20 | Xaar Ltd | Methods of and apparatus for forming nozzles |
DE19707834A1 (de) * | 1996-04-09 | 1997-10-16 | Zeiss Carl Fa | Materialbestrahlungsgerät und Verfahren zum Betrieb von Materialbestrahlungsgeräten |
JP3689490B2 (ja) * | 1996-06-07 | 2005-08-31 | キヤノン株式会社 | ノズル部材の製造方法及びそれを用いた加工装置 |
DE19734983A1 (de) * | 1996-09-04 | 1998-03-05 | Zeiss Carl Fa | Optische Anordnung |
US6037103A (en) * | 1996-12-11 | 2000-03-14 | Nitto Denko Corporation | Method for forming hole in printed board |
US6040552A (en) * | 1997-01-30 | 2000-03-21 | Jain; Kanti | High-speed drilling system for micro-via pattern formation, and resulting structure |
JPH1128591A (ja) * | 1997-07-07 | 1999-02-02 | Hitachi Electron Eng Co Ltd | テクスチャ加工装置 |
TW436357B (en) * | 1997-12-12 | 2001-05-28 | Matsushita Electric Ind Co Ltd | Laser drilling equipment and control method |
DE19801364A1 (de) * | 1998-01-16 | 1999-07-22 | Zeiss Carl Fa | Werkstückbestrahlungsanlage |
US6037564A (en) * | 1998-03-31 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Method for scanning a beam and an apparatus therefor |
US6774340B1 (en) * | 1998-11-25 | 2004-08-10 | Komatsu Limited | Shape of microdot mark formed by laser beam and microdot marking method |
DE19915000C2 (de) * | 1999-04-01 | 2002-05-08 | Microlas Lasersystem Gmbh | Vorrichtung und Verfahren zum Steuern der Intensitätsverteilung eines Laserstrahls |
KR100691924B1 (ko) * | 1999-04-27 | 2007-03-09 | 지에스아이 루모닉스 인코퍼레이티드 | 재료 가공 장치 및 방법 |
US6396025B1 (en) | 1999-07-01 | 2002-05-28 | Aeromet Corporation | Powder feed nozzle for laser welding |
DE59905945D1 (de) * | 1999-12-23 | 2003-07-17 | Leister Process Technologies S | Verfahren und Vorrichtung zum Erwärmen von mindestens zwei Elementen mittels Laserstrahlen mit hoher Energiedichte |
US6433303B1 (en) | 2000-03-31 | 2002-08-13 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus using laser pulses to make an array of microcavity holes |
US6574024B1 (en) | 2000-03-31 | 2003-06-03 | Matsushita Electric Industrial Co., Ltd. | Laser beam homogenization by scanning a beam onto a mask |
US6605799B2 (en) | 2000-05-25 | 2003-08-12 | Westar Photonics | Modulation of laser energy with a predefined pattern |
US6605796B2 (en) * | 2000-05-25 | 2003-08-12 | Westar Photonics | Laser beam shaping device and apparatus for material machining |
US6329634B1 (en) | 2000-07-17 | 2001-12-11 | Carl-Zeiss-Stiftung | Workpiece irradiation system |
DE10060176B4 (de) | 2000-12-04 | 2008-06-19 | Precitec Kg | Laserbearbeitungskopf |
US6689985B2 (en) | 2001-01-17 | 2004-02-10 | Orbotech, Ltd. | Laser drill for use in electrical circuit fabrication |
US7027155B2 (en) * | 2001-03-29 | 2006-04-11 | Gsi Lumonics Corporation | Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
KR100992262B1 (ko) * | 2001-06-13 | 2010-11-05 | 오르보테크 엘티디. | 기판 미세가공 시스템 |
US6670570B2 (en) * | 2001-06-15 | 2003-12-30 | L'air Liquide - Societe Anonyme A Directoire Et Couseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude | Methods and apparatus for localized heating of metallic and non-metallic surfaces |
WO2003009039A1 (de) * | 2001-07-17 | 2003-01-30 | Sieb & Meyer Ag | SPIEGELVERSTELLVORRICHTUNG INSBESONDERE FüR LASERBEARBEITUNGSMASCHINEN |
US6951995B2 (en) | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
DE10307309B4 (de) * | 2003-02-20 | 2007-06-14 | Hitachi Via Mechanics, Ltd., Ebina | Vorrichtung und Verfahren zur Bearbeitung von elektrischen Schaltungssubstraten mittels Laser |
US6867388B2 (en) * | 2003-04-08 | 2005-03-15 | Branson Ultrasonics Corporation | Electronic masking laser imaging system |
US6947454B2 (en) * | 2003-06-30 | 2005-09-20 | Electro Scientific Industries, Inc. | Laser pulse picking employing controlled AOM loading |
US7521651B2 (en) * | 2003-09-12 | 2009-04-21 | Orbotech Ltd | Multiple beam micro-machining system and method |
US20060257929A1 (en) * | 2003-11-12 | 2006-11-16 | Microbiosystems, Limited Partnership | Method for the rapid taxonomic identification of pathogenic microorganisms and their toxic proteins |
EP1721695A4 (de) * | 2004-03-05 | 2009-04-01 | Olympus Corp | Laserbearbeitungseinrichtung |
US7233424B2 (en) * | 2004-08-30 | 2007-06-19 | Dot Intellectual Properties, Llc | Steering assembly with electromagnetic actuators |
US20060114948A1 (en) * | 2004-11-29 | 2006-06-01 | Lo Ho W | Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams |
EP1728582A1 (de) * | 2005-05-31 | 2006-12-06 | Trumpf Laser- und Systemtechnik GmbH | Einrichtung zur Erfassung von Veränderungen eines Laserstrahls |
DE102006007750A1 (de) * | 2006-02-20 | 2007-08-23 | Wavelight Ag | Verfahren und optische Anordnung zur Kontrolle der Fokustiefe eines abbildenden optischen Systems |
US20080013182A1 (en) * | 2006-07-17 | 2008-01-17 | Joerg Ferber | Two-stage laser-beam homogenizer |
US7615722B2 (en) | 2006-07-17 | 2009-11-10 | Coherent, Inc. | Amorphous silicon crystallization using combined beams from optically pumped semiconductor lasers |
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US7982160B2 (en) | 2008-03-31 | 2011-07-19 | Electro Scientific Industries, Inc. | Photonic clock stabilized laser comb processing |
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EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
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US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
CN107073641B (zh) | 2014-07-14 | 2020-11-10 | 康宁股份有限公司 | 接口块;用于使用这种接口块切割在波长范围内透明的衬底的系统和方法 |
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EP3169477B1 (de) * | 2014-07-14 | 2020-01-29 | Corning Incorporated | System und verfahren zur verarbeitung transparenter materialien mithilfe von in länge und durchmesser anpassbaren laserstrahlbrennlinien |
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US10307867B2 (en) * | 2014-11-05 | 2019-06-04 | Asm Technology Singapore Pte Ltd | Laser fiber array for singulating semiconductor wafers |
US10047001B2 (en) * | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
EP3708548A1 (de) | 2015-01-12 | 2020-09-16 | Corning Incorporated | Laserschneiden von thermisch vorgespannten substraten mit einem multiphotonenabsorptionsverfahren |
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US10730783B2 (en) | 2016-09-30 | 2020-08-04 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
EP3529214B1 (de) | 2016-10-24 | 2020-12-23 | Corning Incorporated | Substratverarbeitungsstation zur laserbasierten verarbeitung von flächigen glassubstraten |
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-
1995
- 1995-04-08 DE DE19513354A patent/DE19513354A1/de not_active Withdrawn
- 1995-04-12 DE DE59502220T patent/DE59502220D1/de not_active Expired - Lifetime
- 1995-04-13 KR KR1019950008710A patent/KR100381943B1/ko not_active IP Right Cessation
- 1995-04-14 US US08/422,577 patent/US5676866A/en not_active Expired - Lifetime
- 1995-04-14 JP JP11268495A patent/JP3748280B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR950035542A (ko) | 1995-12-30 |
JP3748280B2 (ja) | 2006-02-22 |
KR100381943B1 (ko) | 2003-07-16 |
US5676866A (en) | 1997-10-14 |
JPH0847789A (ja) | 1996-02-20 |
DE19513354A1 (de) | 1995-12-14 |
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