DE588944T1 - Verbesserter miniaturtransponder. - Google Patents

Verbesserter miniaturtransponder.

Info

Publication number
DE588944T1
DE588944T1 DE0588944T DE92913812T DE588944T1 DE 588944 T1 DE588944 T1 DE 588944T1 DE 0588944 T DE0588944 T DE 0588944T DE 92913812 T DE92913812 T DE 92913812T DE 588944 T1 DE588944 T1 DE 588944T1
Authority
DE
Germany
Prior art keywords
transponder
integrated circuit
heat
circuit device
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE0588944T
Other languages
English (en)
Inventor
Leonard D. Minneapolis Mn 55409 Hadden
Glen Leo Silver Lake Mn 55381 Zirbes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trovan Ltd
Original Assignee
Trovan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27108525&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE588944(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US07/710,786 external-priority patent/US5281855A/en
Application filed by Trovan Ltd filed Critical Trovan Ltd
Publication of DE588944T1 publication Critical patent/DE588944T1/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/74Systems using reradiation of radio waves, e.g. secondary radar systems; Analogous systems
    • G01S13/76Systems using reradiation of radio waves, e.g. secondary radar systems; Analogous systems wherein pulse-type signals are transmitted
    • G01S13/767Responders; Transponders
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V15/00Tags attached to, or associated with, an object, in order to enable detection of the object
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/0773Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H01Q7/08Ferrite rod or like elongated core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/05599Material
    • H01L2224/056Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05638Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05644Gold [Au] as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/05599Material
    • H01L2224/056Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05638Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05647Copper [Cu] as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/4501Shape
    • H01L2224/45012Cross-sectional shape
    • H01L2224/45015Cross-sectional shape being circular
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147Copper (Cu) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48092Helix
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/4813Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01014Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01018Argon [Ar]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01022Titanium [Ti]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049Nitrides composed of metals from groups of the periodic table
    • H01L2924/050414th Group
    • H01L2924/05042Si3N4
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Geophysics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Semiconductor Integrated Circuits (AREA)

Claims (20)

Europäische Patentanmeldung EP 0 588 944 Patentansprüche
1. Verfahren zum Bilden von verstärkten Kontaktpads an einer integrierten Schaltungsvorrichtung, die einen Teil eines verkapselten Miniaturtransponders bildet, mit den Schritten:
Abscheiden einer zusätzlichen Schicht aus isolierendem Material auf der Oberfläche der Vorrichtung;
Ausbilden von Öffnungen in der Isolationsschicht, um die Standardkontaktpads der Schaltung der Vorrichtung freizulegen; und
Bilden von verstärkten Kontaktpads, die auf der Isolationsschicht liegen und mit den Standardkontaktpads durch die Öffnungen in Verbindung stehen, um einen Chip zu bilden, an dem elektrische Verbindungsanschlüsse direkt angeschlossen werden können.
2. Verfahren nach Anspruch 1, wobei die verstärkten Kontaktpads gebildet werden, indem zuerst Feldmetall in elektrischer Verbindung mit den Standardpads abgeschieden wird und die verstärkten Pads direkt darauf plattiert werden.
3. Verfahren nach Anspruch 2, wobei die zusätzliche Isolationsschicht eine Schicht aus Siliziumnitrit mit einer Dicke von über 10 · 10"7 m (10.000 Angström) ist.
05BB
4. Verfahren nach Anspruch 3, wobei die verstärkten Pads aus einem Metall, ausgewählt aus der aus Gold und Kupfer bestehenden Gruppe, bestehen, mit einer Dicke von zumindest 20 · 1O'3 mm (20 Micron) .
5. Integrierte Schaltungsvorrichtung, die einen Teil eines verkapselten Miniaturtransponders bildet, mit:
einem Siliziumsubstrat, das einen Chip bildet, in dessen einer Oberfläche eine integrierte Schaltung gebildet ist und der eine Metallisierungsschicht aufweist, die einen ersten Satz von Kontaktpads bildet;
einer Isolationsschicht, die die Oberfläche des die Metallisierungsschicht enthaltenden Chips bedeckt und Öffnungen darin aufweist, die die ersten Kontaktpads freilegen; und
einer Vielzahl von zweiten Kontaktpads, die auf der Isolationsschicht angeordnet sind und die ersten Pads durch die Öffnungen kontaktieren.
6. Integrierte Schaltungsvorrichtung nach Anspruch 5, wobei die Isolationsschicht eine Dicke von über 10 · 10"7 mm (10.000 Angström) hat.
7. Integrierte Schaltungsvorrichtung nach Anspruch 6, wobei die Dicke der zweiten Pads über 20 · 10"3 mm (20 Micron) liegt.
8. Integrierte Schaltungsvorrichtung nach Anspruch 7, wobei die integrierte Schaltungsvorrichtung die Signalerzeugungsschaltkreise der Transpondervorrichtung bildet.
9. Integrierte Schaltungsvorrichtung nach Anspruch 8, weiterhin mit einer Einrichtung, die eine elektromagnetische Antenne mit Anschlußdrähten bildet, die auf die zweiten Pads bondiert sind.
10. Integrierte Schaltungsvorrichtung nach einem der Ansprüche 5 bis 9, weiterhin mit einer Verkapselungseinrichtung, die den Chip und die Antenne gemeinsam verkapselt unter Ausbildung einer Transpondervorrichtung.
11. Integrierte Schaltungsvorrichtung nach Anspruch 10, wobei die Verkapselungseinrichtung ein wärmeschrumpfendes Kunststoffmaterial aufweist.
12. Integrierte Schaltungsvorrichtung nach Anspruch 11, wobei das Kunststoffmaterial inert und geeignet zur Verwendung in einem lebenden Körper ist. .
. Integrierte Schaltungsvorrichtung nach Anspruch 12, wobei die Verkapselungseinrichtung eine Glaskapsel aufweist, um die das wärmeschrumpfende Kunststoffmaterial geformt ist.
14. Anschlußloser passiver Transponder, mit:
einem Signalgenerator, einem Signalsender und einer Koppeleinrichtung zur induktiven Kopplung an ein Kraftfeld, so daß eine Veränderung des Kraftfeldes relativ zu der Koppeleinrichtung einen elektrischen Strom zumindest innerhalb des Generators erzeugt;
wobei der gesamte Transponder in einem wärmegeschrumpften Material verkapselt ist.
15. Transponder nach Anspruch 14, wobei der Transponder zuerst in einer Glaskapsel und danach in dem wärmegeschrumpften Material verkapselt wird.
16. Transponder nach Anspruch 14 oder Anspruch 15, wobei das wärmegeschrumpfte Material vor der Aufbringung zur Verkapselung des Transponders in der Form eines hohlen Rohres vorliegt, welches an einem Ende geschlossen ist.
17. Transponder nach Anspruch 16, wobei das Rohr einen thermischen Kunststoff aufweist, der bei Aufbringung von Wärme auf das Rohr unter Abdichtung des offenen Endes des Rohrs fließt.
18. Verfahren zum Verkapseln eines anschlußlosen passiven Transponders, wobei der Transponder eine Koppeleinrichtung, die den Transponder im Einsatz induktiv mit einem Kraftfeld koppelt, so daß eine Veränderung des Kraftfeldes relativ zu dem Transponder ein elektrisches Signal im Inneren des Transponders generiert, einen Signalgenerator und einen Signalsender aufweist, wobei das Verfahren die Schritte aufweist:
Anordnen des Transponders in einer Hülle aus wärmeschrumpfbarem Material; und
Aufbringen von Wärme auf das wärmeschrumpf bare Material, um den Transponder in der Umhüllung zu verkapseln.
19. Verfahren nach Anspruch 18, wobei die Hülle vor der Aufbringung von Wärme auf das wärmeschrumpfbare Material in der Form eines Rohres vorliegt, welches an einem Ende geschlossen ist.
20. Verfahren nach Anspruch 19, wobei das Rohr einen thermischen Kunststoff aufweist, der bei Aufbringung von Wärme unter Abdichtung des offenen Endes des Rohrs fließt.
DE0588944T 1991-06-05 1992-06-05 Verbesserter miniaturtransponder. Pending DE588944T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/710,786 US5281855A (en) 1991-06-05 1991-06-05 Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die
US07/787,828 US5223851A (en) 1991-06-05 1991-11-05 Apparatus for facilitating interconnection of antenna lead wires to an integrated circuit and encapsulating the assembly to form an improved miniature transponder device
PCT/US1992/004731 WO1992022827A1 (en) 1991-06-05 1992-06-05 An improved miniature transponder device

Publications (1)

Publication Number Publication Date
DE588944T1 true DE588944T1 (de) 1997-01-30

Family

ID=27108525

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69222526T Expired - Lifetime DE69222526T2 (de) 1991-06-05 1992-06-05 Verbesserter miniaturtransponder
DE0588944T Pending DE588944T1 (de) 1991-06-05 1992-06-05 Verbesserter miniaturtransponder.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69222526T Expired - Lifetime DE69222526T2 (de) 1991-06-05 1992-06-05 Verbesserter miniaturtransponder

Country Status (6)

Country Link
US (1) US5223851A (de)
EP (1) EP0588944B1 (de)
JP (1) JP2782558B2 (de)
AU (1) AU2190292A (de)
DE (2) DE69222526T2 (de)
WO (1) WO1992022827A1 (de)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991016718A1 (fr) * 1990-04-19 1991-10-31 Ake Gustafson Procede d'assemblage d'une bobine sur un circuit imprime
BR9205671A (pt) * 1991-02-25 1994-02-17 Ake Gustafson Processo de fixaçao de uma bobinagem a um circuitoeletronico
DE69406224T2 (de) * 1993-08-18 1998-03-19 Bridgestone Corp Luftreifen mit einem Transponder, Einrichtung und Verfahren zum Aufnehmen und Ablesen von einem Transponder
DE4431606A1 (de) * 1994-09-05 1996-03-07 Siemens Ag Chipkartenmodul für eine kontaktlose Chipkarte und Verfahren zu deren Herstellung
US5648765A (en) * 1995-03-08 1997-07-15 Cresap; Michael S. Tag tansponder system and method to identify items for purposes such as locating, identifying, counting, inventorying, or the like
US5578393A (en) * 1995-03-10 1996-11-26 United States Advanced Battery Consortium Thermal contact sheet for high temperature batteries
DE19509999C2 (de) * 1995-03-22 1998-04-16 David Finn Verfahren und Vorrichtung zur Herstellung einer Transpondereinheit sowie Transpondereinheit
FR2733104B1 (fr) * 1995-04-12 1997-06-06 Droz Francois Repondeur de petites dimensions et procede de fabrication de tels repondeurs
US5925562A (en) * 1995-04-25 1999-07-20 Irori Remotely programmable matrices with memories
US6329139B1 (en) 1995-04-25 2001-12-11 Discovery Partners International Automated sorting system for matrices with memory
US6017496A (en) 1995-06-07 2000-01-25 Irori Matrices with memories and uses thereof
JP3414044B2 (ja) * 1995-04-27 2003-06-09 アルプス電気株式会社 座標入力装置およびその製造方法
US5840148A (en) * 1995-06-30 1998-11-24 Bio Medic Data Systems, Inc. Method of assembly of implantable transponder
JP3150575B2 (ja) * 1995-07-18 2001-03-26 沖電気工業株式会社 タグ装置及びその製造方法
US6001211A (en) * 1995-07-18 1999-12-14 Oki Electric Industry Co., Ltd. Method of producing a tag device with IC capacitively coupled to antenna
US5641634A (en) 1995-11-30 1997-06-24 Mandecki; Wlodek Electronically-indexed solid-phase assay for biomolecules
US6001571A (en) 1995-11-30 1999-12-14 Mandecki; Wlodek Multiplex assay for nucleic acids employing transponders
US5736332A (en) * 1995-11-30 1998-04-07 Mandecki; Wlodek Method of determining the sequence of nucleic acids employing solid-phase particles carrying transponders
US6051377A (en) * 1995-11-30 2000-04-18 Pharmaseq, Inc. Multiplex assay for nucleic acids employing transponders
WO1997019958A1 (en) 1995-11-30 1997-06-05 Wlodek Mandecki Screening of drugs from chemical combinatorial libraries employing transponders
DE19605038A1 (de) * 1996-02-12 1997-08-14 Daimler Benz Ag Verfahren zum Bonden von Isolierdraht und Vorrichtung zur Durchführung des Verfahrens
US5963132A (en) * 1996-10-11 1999-10-05 Avid Indentification Systems, Inc. Encapsulated implantable transponder
US5981166A (en) * 1997-04-23 1999-11-09 Pharmaseq, Inc. Screening of soluble chemical compounds for their pharmacological properties utilizing transponders
FR2768707B1 (fr) * 1997-09-22 1999-10-29 Plastic Omnium Cie Dispositif de transport et/ou de collecte en matiere plastique moulee comportant un dispositif d'identification et procede de fabrication
US6363940B1 (en) * 1998-05-14 2002-04-02 Calypso Medical Technologies, Inc. System and method for bracketing and removing tissue
WO2002039917A1 (en) * 1998-05-14 2002-05-23 Calypso Medical, Inc. Systems and methods for locating and defining a target location within a human body
DE19844089C2 (de) * 1998-06-25 2001-04-05 Pav Card Gmbh Verfahren zur Herstellung von Transponderanordnungen
DE19840248A1 (de) * 1998-09-03 2000-03-16 Fraunhofer Ges Forschung Schaltungschip mit spezifischer Anschlußflächenanordnung
US6919799B2 (en) 1999-04-29 2005-07-19 Bridgestone/Firestone North American Tire, Llc Monitoring device and tire combination
US6208244B1 (en) 1999-04-29 2001-03-27 Bridgestone/Firestone Research, Inc. Combination monitoring device and patch for a pneumatic tire and method of installing the same with a coupled antenna
DE19919924A1 (de) 1999-04-30 2000-11-16 Siemens Ag Verfahren zum Betrieb eines Bestückautomaten, Bestückautomat, auswechselbare Komponente für einen Bestückautomaten und System aus einem Bestückautomaten und einer auswechselbaren Komponente
US6718629B1 (en) * 1999-04-30 2004-04-13 Siemens Aktiengesellschaft Method and apparatus for mounting components onto a substrate of an electrical assembly
DE19919917A1 (de) 1999-04-30 2000-11-16 Siemens Ag Verfahren und Vorrichtung zum Bestücken von Substraten mit Bauelementen
US6441741B1 (en) 1999-05-17 2002-08-27 Avid Identification Systems, Inc. Overmolded transponder
DE19925217A1 (de) 1999-06-01 2000-12-21 Siemens Ag Verfahren zum Bestücken von Substraten mit Bauelementen
US7176846B2 (en) * 2000-01-11 2007-02-13 Digital Angel Corporation Passive integrated transponder tag with unitary antenna core
US6400338B1 (en) * 2000-01-11 2002-06-04 Destron-Fearing Corporation Passive integrated transponder tag with unitary antenna core
US6304232B1 (en) 2000-02-24 2001-10-16 The Goodyear Tire & Rubber Company Circuit module
US6688353B1 (en) 2000-03-31 2004-02-10 Bridgestone/Firestone North American Tire, Llc Attachment patch for mounting an electronic monitoring device to the inside of a pneumatic tire
US6580363B1 (en) 2000-06-30 2003-06-17 Bridgestone/Firestone North American Tire, Llc Method of encapsulating an electronic tire tag
JP3711026B2 (ja) * 2000-07-17 2005-10-26 株式会社ハネックス Rfidタグの設置構造及びrfidタグの設置方法及びrfidタグの通信方法
US7161476B2 (en) 2000-07-26 2007-01-09 Bridgestone Firestone North American Tire, Llc Electronic tire management system
US6275153B1 (en) 2000-07-26 2001-08-14 Andrew Brooks Identification and tracking system
US8266465B2 (en) 2000-07-26 2012-09-11 Bridgestone Americas Tire Operation, LLC System for conserving battery life in a battery operated device
JP3481575B2 (ja) * 2000-09-28 2003-12-22 寛児 川上 アンテナ
DE10296526B4 (de) * 2001-03-19 2008-11-13 Hitachi Maxell, Ltd., Ibaraki Kernstück und das Kernstück verwendender Informationsträger für berührungslose Kommunikation
US20020170591A1 (en) * 2001-05-15 2002-11-21 Pharmaseq, Inc. Method and apparatus for powering circuitry with on-chip solar cells within a common substrate
US7135978B2 (en) * 2001-09-14 2006-11-14 Calypso Medical Technologies, Inc. Miniature resonating marker assembly
US6856250B2 (en) 2002-01-11 2005-02-15 Randy Hilliard Tracking system, apparatus and method
DE10227683B4 (de) * 2002-06-20 2004-07-22 Aeg Identifikationssysteme Gmbh Verfahren zur Anbringung eines Transponders an einem Metallkörper und Metallkörper mit einem Transponder
US7289839B2 (en) * 2002-12-30 2007-10-30 Calypso Medical Technologies, Inc. Implantable marker with a leadless signal transmitter compatible for use in magnetic resonance devices
CA2448459C (en) * 2003-11-06 2014-04-29 Aeg Identifikationssysteme Gmbh Method for fitting a transponder to a metal body, and a transponder module for carrying out the method
AU2003261498B2 (en) * 2003-11-07 2009-07-02 Aeg Identifikationssysteme Gmbh Method for fitting a transponder to a metal body, and a transponder module for carrying out the method
US8196589B2 (en) * 2003-12-24 2012-06-12 Calypso Medical Technologies, Inc. Implantable marker with wireless signal transmitter
US6995729B2 (en) * 2004-01-09 2006-02-07 Biosense Webster, Inc. Transponder with overlapping coil antennas on a common core
US20050234316A1 (en) * 2004-04-16 2005-10-20 Sensors For Medicine And Science, Inc. Housing for a circuit that is to be implanted in-vivo and process of making the same
US7292148B2 (en) * 2004-06-18 2007-11-06 Avery Dennison Corporation Method of variable position strap mounting for RFID transponder
US20060244569A1 (en) * 2005-02-28 2006-11-02 Brian Gaetto Tooth-borne radio-frequency medical read-write memory chip
US20060267774A1 (en) * 2005-03-24 2006-11-30 Feinberg Stewart C Transponder overmolded with ethylene copolymers
FR2886490B1 (fr) * 2005-05-31 2008-08-08 Alain Limpas Transpondeur implantable de tres petite taille et sa methode de fabrication
DE102005058977A1 (de) * 2005-12-09 2007-06-14 Atmel Germany Gmbh Transpondereinrichtung mit Mega-Pads
FR2909258B1 (fr) * 2006-11-30 2012-08-03 Prosonic Transpondeur miniature et systeme d'identification comportant un tel transpondeur et un lecteur adapte.
US20080180242A1 (en) * 2007-01-29 2008-07-31 Cottingham Hugh V Micron-scale implantable transponder
IL184260A0 (en) * 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
US8028923B2 (en) * 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
DE102011009577A1 (de) * 2011-01-27 2012-08-02 Texas Instruments Deutschland Gmbh RFID-Transponder und Verfahren zum Verbinden eines Halbleiter-Dies mit einer Antenne
JP6111907B2 (ja) * 2013-07-05 2017-04-12 三菱電機株式会社 半導体装置の製造方法
JP2013219404A (ja) * 2013-08-02 2013-10-24 Sumida Corporation アンテナ部品の製造方法
JP6429680B2 (ja) * 2015-03-03 2018-11-28 パナソニック株式会社 アンテナ一体型モジュール及びレーダ装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5949695B2 (ja) 1976-12-17 1984-12-04 株式会社日立製作所 ガラス封止半導体装置の製法
JPS5421165A (en) * 1977-07-18 1979-02-17 Nec Corp Semiconductor device
US4273859A (en) * 1979-12-31 1981-06-16 Honeywell Information Systems Inc. Method of forming solder bump terminals on semiconductor elements
JPS56150830A (en) * 1980-04-25 1981-11-21 Hitachi Ltd Semiconductor device
NL8402239A (nl) * 1984-07-13 1986-02-03 Paalman Berend Johan Werkwijze voor het merken van dieren, en daartoe dienend merkonderdeel en aanbrengwerktuig.
DE3782888T2 (de) * 1986-02-25 1993-07-08 Destron Idi Inc Mit einer spritze implantierbarer identifikationstransponder.
US4695926A (en) * 1986-07-01 1987-09-22 Bell Of Pennsylvania Encapsulation and insulation of electronic circuit board structures
JPS63283040A (ja) * 1987-05-15 1988-11-18 Toshiba Corp 半導体装置
DE3788348T2 (de) 1987-07-31 1994-03-17 Texas Instruments Deutschland Transponder-Anordnung.
NL8802481A (nl) * 1988-10-10 1990-05-01 Texas Instruments Holland Transponder alsmede werkwijze voor het vervaardigen daarvan.
US4911217A (en) * 1989-03-24 1990-03-27 The Goodyear Tire & Rubber Company Integrated circuit transponder in a pneumatic tire for tire identification
US5084699A (en) * 1989-05-26 1992-01-28 Trovan Limited Impedance matching coil assembly for an inductively coupled transponder
NL8901663A (nl) 1989-06-30 1991-01-16 Philips Nv Wikkelingsdrager en werkwijze voor het met behulp daarvan vormen van een samenstel bevattende een elektrische spoel en een elektronisch onderdeel.
NL9001777A (nl) * 1990-08-06 1992-03-02 Texas Instruments Holland Transponder.
BR9205671A (pt) 1991-02-25 1994-02-17 Ake Gustafson Processo de fixaçao de uma bobinagem a um circuitoeletronico
US5442778A (en) 1991-11-12 1995-08-15 Xerox Corporation Scatter-gather: a cluster-based method and apparatus for browsing large document collections

Also Published As

Publication number Publication date
EP0588944A1 (de) 1994-03-30
US5223851A (en) 1993-06-29
WO1992022827A1 (en) 1992-12-23
EP0588944B1 (de) 2003-01-02
AU2190292A (en) 1993-01-12
JP2782558B2 (ja) 1998-08-06
JPH06510364A (ja) 1994-11-17
DE69222526D1 (de) 1997-11-06
EP0588944A4 (en) 1994-09-21
DE69222526T2 (de) 2004-05-13

Similar Documents

Publication Publication Date Title
DE588944T1 (de) Verbesserter miniaturtransponder.
US5089878A (en) Low impedance packaging
US5043534A (en) Metal electronic package having improved resistance to electromagnetic interference
DE69015969T2 (de) Packung eines Hochfrequenz-Transistors mit Nickeloxidschutzschicht.
EP0202279B1 (de) Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
US6838776B2 (en) Circuit device with at least partial packaging and method for forming
DE10201781B4 (de) Hochfrequenz-Leistungsbauteil und Hochfrequenz-Leistungsmodul sowie Verfahren zur Herstellung derselben
KR0145768B1 (ko) 리드 프레임과 그를 이용한 반도체 패키지 제조방법
US20130049217A1 (en) Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits
DE112005002369T5 (de) Verfahren zur Herstellung eines Halbleitergehäuses und Aufbau desselben
DE19518753A1 (de) Halbleitervorrichtung und Verfahren zu ihrer Herstellung
DE3865769D1 (de) Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen.
DE4424549C2 (de) Verfahren zum Gehäusen eines Leistungshalbleiterbauelements und durch dieses Verfahren hergestelltes Gehäuse
WO2005050699A3 (en) Method of forming a semiconductor package and structure thereof
US6973717B2 (en) Method for producing a semiconductor device in chip format
JP2781018B2 (ja) 半導体装置およびその製造方法
US8377749B1 (en) Integrated circuit transmission line
KR100521820B1 (ko) 도금된구리상부표면레벨상호접속을갖는집적회로를위한플라스틱캡슐화
DE3881360T2 (de) Verfahren zum anbringen eines elektronischen bauelementes auf einem substrat.
CN106571347A (zh) 绝缘管芯
DE19639902A1 (de) Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
JPH01198351A (ja) 電子素子とそのコンタクトを基板上に固定する方法
DE102021129249A1 (de) Gemoldetes Halbleiterpackage mit Hochspannungs-Isolierung
JPS61145696A (ja) Icカ−ド
DE19630593C2 (de) Verfahren zum Verbinden einer integrierten Schatung mit einem Substrat und elektronische Schaltungsanordnung