DE588944T1 - Verbesserter miniaturtransponder. - Google Patents
Verbesserter miniaturtransponder.Info
- Publication number
- DE588944T1 DE588944T1 DE0588944T DE92913812T DE588944T1 DE 588944 T1 DE588944 T1 DE 588944T1 DE 0588944 T DE0588944 T DE 0588944T DE 92913812 T DE92913812 T DE 92913812T DE 588944 T1 DE588944 T1 DE 588944T1
- Authority
- DE
- Germany
- Prior art keywords
- transponder
- integrated circuit
- heat
- circuit device
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 8
- 239000000463 material Substances 0.000 claims 6
- 230000008878 coupling Effects 0.000 claims 4
- 238000010168 coupling process Methods 0.000 claims 4
- 238000005859 coupling reaction Methods 0.000 claims 4
- 238000005538 encapsulation Methods 0.000 claims 3
- 239000002654 heat shrinkable material Substances 0.000 claims 3
- 238000009413 insulation Methods 0.000 claims 3
- 239000002775 capsule Substances 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 2
- 238000001465 metallisation Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 238000004891 communication Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910000939 field's metal Inorganic materials 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 230000001939 inductive effect Effects 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/74—Systems using reradiation of radio waves, e.g. secondary radar systems; Analogous systems
- G01S13/76—Systems using reradiation of radio waves, e.g. secondary radar systems; Analogous systems wherein pulse-type signals are transmitted
- G01S13/767—Responders; Transponders
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V15/00—Tags attached to, or associated with, an object, in order to enable detection of the object
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H—ELECTRICITY
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
- H01Q7/08—Ferrite rod or like elongated core
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Remote Sensing (AREA)
- Radar, Positioning & Navigation (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Geophysics (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Radar Systems Or Details Thereof (AREA)
- Semiconductor Integrated Circuits (AREA)
Claims (20)
1. Verfahren zum Bilden von verstärkten Kontaktpads an einer integrierten Schaltungsvorrichtung, die einen Teil eines
verkapselten Miniaturtransponders bildet, mit den Schritten:
Abscheiden einer zusätzlichen Schicht aus isolierendem Material auf der Oberfläche der Vorrichtung;
Ausbilden von Öffnungen in der Isolationsschicht, um die
Standardkontaktpads der Schaltung der Vorrichtung freizulegen; und
Bilden von verstärkten Kontaktpads, die auf der Isolationsschicht
liegen und mit den Standardkontaktpads durch die Öffnungen in Verbindung stehen, um einen Chip zu bilden,
an dem elektrische Verbindungsanschlüsse direkt angeschlossen werden können.
2. Verfahren nach Anspruch 1, wobei die verstärkten Kontaktpads
gebildet werden, indem zuerst Feldmetall in elektrischer Verbindung mit den Standardpads abgeschieden wird und die
verstärkten Pads direkt darauf plattiert werden.
3. Verfahren nach Anspruch 2, wobei die zusätzliche Isolationsschicht
eine Schicht aus Siliziumnitrit mit einer Dicke von über 10 · 10"7 m (10.000 Angström) ist.
05BB
4. Verfahren nach Anspruch 3, wobei die verstärkten Pads aus
einem Metall, ausgewählt aus der aus Gold und Kupfer bestehenden Gruppe, bestehen, mit einer Dicke von zumindest
20 · 1O'3 mm (20 Micron) .
5. Integrierte Schaltungsvorrichtung, die einen Teil eines verkapselten Miniaturtransponders bildet, mit:
einem Siliziumsubstrat, das einen Chip bildet, in dessen einer Oberfläche eine integrierte Schaltung gebildet ist
und der eine Metallisierungsschicht aufweist, die einen ersten Satz von Kontaktpads bildet;
einer Isolationsschicht, die die Oberfläche des die Metallisierungsschicht enthaltenden Chips bedeckt und
Öffnungen darin aufweist, die die ersten Kontaktpads freilegen; und
einer Vielzahl von zweiten Kontaktpads, die auf der Isolationsschicht angeordnet sind und die ersten Pads durch
die Öffnungen kontaktieren.
6. Integrierte Schaltungsvorrichtung nach Anspruch 5, wobei die Isolationsschicht eine Dicke von über 10 · 10"7 mm
(10.000 Angström) hat.
7. Integrierte Schaltungsvorrichtung nach Anspruch 6, wobei die Dicke der zweiten Pads über 20 · 10"3 mm (20 Micron)
liegt.
8. Integrierte Schaltungsvorrichtung nach Anspruch 7, wobei die integrierte Schaltungsvorrichtung die Signalerzeugungsschaltkreise
der Transpondervorrichtung bildet.
9. Integrierte Schaltungsvorrichtung nach Anspruch 8, weiterhin
mit einer Einrichtung, die eine elektromagnetische Antenne mit Anschlußdrähten bildet, die auf die zweiten Pads
bondiert sind.
10. Integrierte Schaltungsvorrichtung nach einem der Ansprüche
5 bis 9, weiterhin mit einer Verkapselungseinrichtung, die den Chip und die Antenne gemeinsam verkapselt unter
Ausbildung einer Transpondervorrichtung.
11. Integrierte Schaltungsvorrichtung nach Anspruch 10, wobei die Verkapselungseinrichtung ein wärmeschrumpfendes
Kunststoffmaterial aufweist.
12. Integrierte Schaltungsvorrichtung nach Anspruch 11, wobei das Kunststoffmaterial inert und geeignet zur Verwendung
in einem lebenden Körper ist. .
. Integrierte Schaltungsvorrichtung nach Anspruch 12, wobei
die Verkapselungseinrichtung eine Glaskapsel aufweist, um die das wärmeschrumpfende Kunststoffmaterial geformt
ist.
14. Anschlußloser passiver Transponder, mit:
einem Signalgenerator, einem Signalsender und einer Koppeleinrichtung zur induktiven Kopplung an ein Kraftfeld,
so daß eine Veränderung des Kraftfeldes relativ zu der Koppeleinrichtung einen elektrischen Strom zumindest
innerhalb des Generators erzeugt;
wobei der gesamte Transponder in einem wärmegeschrumpften
Material verkapselt ist.
15. Transponder nach Anspruch 14, wobei der Transponder zuerst
in einer Glaskapsel und danach in dem wärmegeschrumpften Material verkapselt wird.
16. Transponder nach Anspruch 14 oder Anspruch 15, wobei das
wärmegeschrumpfte Material vor der Aufbringung zur Verkapselung des Transponders in der Form eines hohlen Rohres
vorliegt, welches an einem Ende geschlossen ist.
17. Transponder nach Anspruch 16, wobei das Rohr einen thermischen
Kunststoff aufweist, der bei Aufbringung von Wärme auf das Rohr unter Abdichtung des offenen Endes des Rohrs
fließt.
18. Verfahren zum Verkapseln eines anschlußlosen passiven Transponders, wobei der Transponder eine Koppeleinrichtung,
die den Transponder im Einsatz induktiv mit einem Kraftfeld koppelt, so daß eine Veränderung des Kraftfeldes relativ
zu dem Transponder ein elektrisches Signal im Inneren des Transponders generiert, einen Signalgenerator und einen
Signalsender aufweist, wobei das Verfahren die Schritte aufweist:
Anordnen des Transponders in einer Hülle aus wärmeschrumpfbarem Material; und
Aufbringen von Wärme auf das wärmeschrumpf bare Material,
um den Transponder in der Umhüllung zu verkapseln.
19. Verfahren nach Anspruch 18, wobei die Hülle vor der Aufbringung von Wärme auf das wärmeschrumpfbare Material
in der Form eines Rohres vorliegt, welches an einem Ende geschlossen ist.
20. Verfahren nach Anspruch 19, wobei das Rohr einen thermischen Kunststoff aufweist, der bei Aufbringung von Wärme unter
Abdichtung des offenen Endes des Rohrs fließt.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/710,786 US5281855A (en) | 1991-06-05 | 1991-06-05 | Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die |
US07/787,828 US5223851A (en) | 1991-06-05 | 1991-11-05 | Apparatus for facilitating interconnection of antenna lead wires to an integrated circuit and encapsulating the assembly to form an improved miniature transponder device |
PCT/US1992/004731 WO1992022827A1 (en) | 1991-06-05 | 1992-06-05 | An improved miniature transponder device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE588944T1 true DE588944T1 (de) | 1997-01-30 |
Family
ID=27108525
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69222526T Expired - Lifetime DE69222526T2 (de) | 1991-06-05 | 1992-06-05 | Verbesserter miniaturtransponder |
DE0588944T Pending DE588944T1 (de) | 1991-06-05 | 1992-06-05 | Verbesserter miniaturtransponder. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69222526T Expired - Lifetime DE69222526T2 (de) | 1991-06-05 | 1992-06-05 | Verbesserter miniaturtransponder |
Country Status (6)
Country | Link |
---|---|
US (1) | US5223851A (de) |
EP (1) | EP0588944B1 (de) |
JP (1) | JP2782558B2 (de) |
AU (1) | AU2190292A (de) |
DE (2) | DE69222526T2 (de) |
WO (1) | WO1992022827A1 (de) |
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-
1991
- 1991-11-05 US US07/787,828 patent/US5223851A/en not_active Expired - Lifetime
-
1992
- 1992-06-05 EP EP92913812A patent/EP0588944B1/de not_active Expired - Lifetime
- 1992-06-05 AU AU21902/92A patent/AU2190292A/en not_active Abandoned
- 1992-06-05 DE DE69222526T patent/DE69222526T2/de not_active Expired - Lifetime
- 1992-06-05 DE DE0588944T patent/DE588944T1/de active Pending
- 1992-06-05 JP JP5500941A patent/JP2782558B2/ja not_active Expired - Fee Related
- 1992-06-05 WO PCT/US1992/004731 patent/WO1992022827A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0588944A1 (de) | 1994-03-30 |
US5223851A (en) | 1993-06-29 |
WO1992022827A1 (en) | 1992-12-23 |
EP0588944B1 (de) | 2003-01-02 |
AU2190292A (en) | 1993-01-12 |
JP2782558B2 (ja) | 1998-08-06 |
JPH06510364A (ja) | 1994-11-17 |
DE69222526D1 (de) | 1997-11-06 |
EP0588944A4 (en) | 1994-09-21 |
DE69222526T2 (de) | 2004-05-13 |
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