DE588944T1 - Verbesserter miniaturtransponder. - Google Patents

Verbesserter miniaturtransponder.

Info

Publication number
DE588944T1
DE588944T1 DE0588944T DE92913812T DE588944T1 DE 588944 T1 DE588944 T1 DE 588944T1 DE 0588944 T DE0588944 T DE 0588944T DE 92913812 T DE92913812 T DE 92913812T DE 588944 T1 DE588944 T1 DE 588944T1
Authority
DE
Germany
Prior art keywords
transponder
integrated circuit
heat
circuit device
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE0588944T
Other languages
English (en)
Inventor
Leonard D. Minneapolis Mn 55409 Hadden
Glen Leo Silver Lake Mn 55381 Zirbes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trovan Ltd
Original Assignee
Trovan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27108525&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE588944(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US07/710,786 external-priority patent/US5281855A/en
Application filed by Trovan Ltd filed Critical Trovan Ltd
Publication of DE588944T1 publication Critical patent/DE588944T1/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/74—Systems using reradiation of radio waves, e.g. secondary radar systems; Analogous systems
    • G01S13/76—Systems using reradiation of radio waves, e.g. secondary radar systems; Analogous systems wherein pulse-type signals are transmitted
    • G01S13/767—Responders; Transponders
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V15/00—Tags attached to, or associated with, an object, in order to enable detection of the object
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Geophysics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Semiconductor Integrated Circuits (AREA)

Claims (20)

Europäische Patentanmeldung EP 0 588 944 Patentansprüche
1. Verfahren zum Bilden von verstärkten Kontaktpads an einer integrierten Schaltungsvorrichtung, die einen Teil eines verkapselten Miniaturtransponders bildet, mit den Schritten:
Abscheiden einer zusätzlichen Schicht aus isolierendem Material auf der Oberfläche der Vorrichtung;
Ausbilden von Öffnungen in der Isolationsschicht, um die Standardkontaktpads der Schaltung der Vorrichtung freizulegen; und
Bilden von verstärkten Kontaktpads, die auf der Isolationsschicht liegen und mit den Standardkontaktpads durch die Öffnungen in Verbindung stehen, um einen Chip zu bilden, an dem elektrische Verbindungsanschlüsse direkt angeschlossen werden können.
2. Verfahren nach Anspruch 1, wobei die verstärkten Kontaktpads gebildet werden, indem zuerst Feldmetall in elektrischer Verbindung mit den Standardpads abgeschieden wird und die verstärkten Pads direkt darauf plattiert werden.
3. Verfahren nach Anspruch 2, wobei die zusätzliche Isolationsschicht eine Schicht aus Siliziumnitrit mit einer Dicke von über 10 · 10"7 m (10.000 Angström) ist.
05BB
4. Verfahren nach Anspruch 3, wobei die verstärkten Pads aus einem Metall, ausgewählt aus der aus Gold und Kupfer bestehenden Gruppe, bestehen, mit einer Dicke von zumindest 20 · 1O'3 mm (20 Micron) .
5. Integrierte Schaltungsvorrichtung, die einen Teil eines verkapselten Miniaturtransponders bildet, mit:
einem Siliziumsubstrat, das einen Chip bildet, in dessen einer Oberfläche eine integrierte Schaltung gebildet ist und der eine Metallisierungsschicht aufweist, die einen ersten Satz von Kontaktpads bildet;
einer Isolationsschicht, die die Oberfläche des die Metallisierungsschicht enthaltenden Chips bedeckt und Öffnungen darin aufweist, die die ersten Kontaktpads freilegen; und
einer Vielzahl von zweiten Kontaktpads, die auf der Isolationsschicht angeordnet sind und die ersten Pads durch die Öffnungen kontaktieren.
6. Integrierte Schaltungsvorrichtung nach Anspruch 5, wobei die Isolationsschicht eine Dicke von über 10 · 10"7 mm (10.000 Angström) hat.
7. Integrierte Schaltungsvorrichtung nach Anspruch 6, wobei die Dicke der zweiten Pads über 20 · 10"3 mm (20 Micron) liegt.
8. Integrierte Schaltungsvorrichtung nach Anspruch 7, wobei die integrierte Schaltungsvorrichtung die Signalerzeugungsschaltkreise der Transpondervorrichtung bildet.
9. Integrierte Schaltungsvorrichtung nach Anspruch 8, weiterhin mit einer Einrichtung, die eine elektromagnetische Antenne mit Anschlußdrähten bildet, die auf die zweiten Pads bondiert sind.
10. Integrierte Schaltungsvorrichtung nach einem der Ansprüche 5 bis 9, weiterhin mit einer Verkapselungseinrichtung, die den Chip und die Antenne gemeinsam verkapselt unter Ausbildung einer Transpondervorrichtung.
11. Integrierte Schaltungsvorrichtung nach Anspruch 10, wobei die Verkapselungseinrichtung ein wärmeschrumpfendes Kunststoffmaterial aufweist.
12. Integrierte Schaltungsvorrichtung nach Anspruch 11, wobei das Kunststoffmaterial inert und geeignet zur Verwendung in einem lebenden Körper ist. .
. Integrierte Schaltungsvorrichtung nach Anspruch 12, wobei die Verkapselungseinrichtung eine Glaskapsel aufweist, um die das wärmeschrumpfende Kunststoffmaterial geformt ist.
14. Anschlußloser passiver Transponder, mit:
einem Signalgenerator, einem Signalsender und einer Koppeleinrichtung zur induktiven Kopplung an ein Kraftfeld, so daß eine Veränderung des Kraftfeldes relativ zu der Koppeleinrichtung einen elektrischen Strom zumindest innerhalb des Generators erzeugt;
wobei der gesamte Transponder in einem wärmegeschrumpften Material verkapselt ist.
15. Transponder nach Anspruch 14, wobei der Transponder zuerst in einer Glaskapsel und danach in dem wärmegeschrumpften Material verkapselt wird.
16. Transponder nach Anspruch 14 oder Anspruch 15, wobei das wärmegeschrumpfte Material vor der Aufbringung zur Verkapselung des Transponders in der Form eines hohlen Rohres vorliegt, welches an einem Ende geschlossen ist.
17. Transponder nach Anspruch 16, wobei das Rohr einen thermischen Kunststoff aufweist, der bei Aufbringung von Wärme auf das Rohr unter Abdichtung des offenen Endes des Rohrs fließt.
18. Verfahren zum Verkapseln eines anschlußlosen passiven Transponders, wobei der Transponder eine Koppeleinrichtung, die den Transponder im Einsatz induktiv mit einem Kraftfeld koppelt, so daß eine Veränderung des Kraftfeldes relativ zu dem Transponder ein elektrisches Signal im Inneren des Transponders generiert, einen Signalgenerator und einen Signalsender aufweist, wobei das Verfahren die Schritte aufweist:
Anordnen des Transponders in einer Hülle aus wärmeschrumpfbarem Material; und
Aufbringen von Wärme auf das wärmeschrumpf bare Material, um den Transponder in der Umhüllung zu verkapseln.
19. Verfahren nach Anspruch 18, wobei die Hülle vor der Aufbringung von Wärme auf das wärmeschrumpfbare Material in der Form eines Rohres vorliegt, welches an einem Ende geschlossen ist.
20. Verfahren nach Anspruch 19, wobei das Rohr einen thermischen Kunststoff aufweist, der bei Aufbringung von Wärme unter Abdichtung des offenen Endes des Rohrs fließt.
DE0588944T 1991-06-05 1992-06-05 Verbesserter miniaturtransponder. Pending DE588944T1 (de)

Applications Claiming Priority (3)

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US07/710,786 US5281855A (en) 1991-06-05 1991-06-05 Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die
US07/787,828 US5223851A (en) 1991-06-05 1991-11-05 Apparatus for facilitating interconnection of antenna lead wires to an integrated circuit and encapsulating the assembly to form an improved miniature transponder device
PCT/US1992/004731 WO1992022827A1 (en) 1991-06-05 1992-06-05 An improved miniature transponder device

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EP0588944A1 (de) 1994-03-30
US5223851A (en) 1993-06-29
WO1992022827A1 (en) 1992-12-23
EP0588944B1 (de) 2003-01-02
AU2190292A (en) 1993-01-12
JP2782558B2 (ja) 1998-08-06
JPH06510364A (ja) 1994-11-17
DE69222526D1 (de) 1997-11-06
EP0588944A4 (en) 1994-09-21
DE69222526T2 (de) 2004-05-13

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