DE552278T1 - Flammhemmende epoxydharzformmasse, verfahren und eingekapselte vorrichtung. - Google Patents

Flammhemmende epoxydharzformmasse, verfahren und eingekapselte vorrichtung.

Info

Publication number
DE552278T1
DE552278T1 DE91919492T DE91919492T DE552278T1 DE 552278 T1 DE552278 T1 DE 552278T1 DE 91919492 T DE91919492 T DE 91919492T DE 91919492 T DE91919492 T DE 91919492T DE 552278 T1 DE552278 T1 DE 552278T1
Authority
DE
Germany
Prior art keywords
weight
molding compound
retardant epoxy
epoxy
hardener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE91919492T
Other languages
English (en)
Inventor
Anthony Gallo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DEXTER ELECTRONIC MATERIALS DI
Original Assignee
DEXTER ELECTRONIC MATERIALS DI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DEXTER ELECTRONIC MATERIALS DI filed Critical DEXTER ELECTRONIC MATERIALS DI
Publication of DE552278T1 publication Critical patent/DE552278T1/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K3/2279—Oxides; Hydroxides of metals of antimony
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Details Of Resistors (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE91919492T 1990-09-28 1991-09-27 Flammhemmende epoxydharzformmasse, verfahren und eingekapselte vorrichtung. Pending DE552278T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/590,247 US5104604A (en) 1989-10-05 1990-09-28 Flame retardant epoxy molding compound, method and encapsulated device method of encapsulating a semiconductor device with a flame retardant epoxy molding compound

Publications (1)

Publication Number Publication Date
DE552278T1 true DE552278T1 (de) 1994-02-03

Family

ID=24361469

Family Applications (2)

Application Number Title Priority Date Filing Date
DE91919492T Pending DE552278T1 (de) 1990-09-28 1991-09-27 Flammhemmende epoxydharzformmasse, verfahren und eingekapselte vorrichtung.
DE69121107T Expired - Fee Related DE69121107T2 (de) 1990-09-28 1991-09-27 FLAMMHEMMENDE EPOXYDHARZFORMMASSE, UND Verfahren zur Herstellung einer eingekapselten Vorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69121107T Expired - Fee Related DE69121107T2 (de) 1990-09-28 1991-09-27 FLAMMHEMMENDE EPOXYDHARZFORMMASSE, UND Verfahren zur Herstellung einer eingekapselten Vorrichtung

Country Status (8)

Country Link
US (2) US5104604A (de)
EP (1) EP0552278B1 (de)
JP (1) JP3286976B2 (de)
AT (1) ATE140716T1 (de)
DE (2) DE552278T1 (de)
ES (1) ES2059284T1 (de)
GR (1) GR930300122T1 (de)
WO (1) WO1992006138A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10048179C1 (de) * 2000-05-25 2002-03-14 Ind Tech Res Inst Epoxidharzzusammensetzung mit halogenfreiem, phosphorfreiem Flammschutzmittel

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476716A (en) * 1988-10-17 1995-12-19 The Dexter Corporation Flame retardant epoxy molding compound, method and encapsulated device
DE69333484T2 (de) * 1992-09-24 2005-03-24 Novartis Ag Umgestaltete monoklonale Antikörper gegen ein Immunglobulinisotyp
GB9224854D0 (en) * 1992-11-27 1993-01-13 Ciba Geigy Ag Moulding process
EP0703613A3 (de) * 1994-09-26 1996-06-05 Motorola Inc Schutz elektronischer Bauelemente in saurer und basischer Umgebung
JPH08302161A (ja) * 1995-05-10 1996-11-19 Hitachi Chem Co Ltd 樹脂組成物及びその樹脂組成物をケミカルエッチングする方法
US7163973B2 (en) * 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
ES2701849T3 (es) * 2013-09-27 2019-02-26 Stora Enso Oyj Una composición que comprende compuesto de lignina y epoxi para recubrimiento y método para su fabricación y su uso
KR102466597B1 (ko) 2014-12-04 2022-11-11 미쯔비시 케미컬 주식회사 테트라메틸비페놀형 에폭시 수지, 에폭시 수지 조성물, 경화물 및 반도체 봉지재

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ZA718662B (en) * 1971-02-12 1972-09-27 Cities Service Co Fire retardant compositions
USRE31214E (en) * 1971-12-27 1983-04-19 Colloidal sol antimony pentaoxide flameproofing compositions
BE792125A (fr) * 1971-12-27 1973-03-16 Petrow Henry G Sol colloidal d'oxyde d'antimoine, son procede de preparation et son utilisation
US3915926A (en) * 1972-03-10 1975-10-28 Gen Electric Flame retardant thermoplastic compositions
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US3912792A (en) * 1972-08-04 1975-10-14 M & T Chemicals Inc Flame retardant compositions
US3950456A (en) * 1972-08-18 1976-04-13 Cities Service Company Flame-retardant composition
US3856890A (en) * 1973-05-23 1974-12-24 Nat Distillers Chem Corp Flame retardant compositions
US3983185A (en) * 1973-07-30 1976-09-28 Hooker Chemicals & Plastics Corporation Halogen containing polyester resins having improved smoke-resistance
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US4075154A (en) * 1974-11-29 1978-02-21 Shin-Etsu Chemical Co., Ltd. Room-temperature curing organopolysiloxane compositions
US4155949A (en) * 1975-01-21 1979-05-22 Mitsubishi Gas Chemical Company, Inc. Fire retardant polycarbonate resin composition
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10048179C1 (de) * 2000-05-25 2002-03-14 Ind Tech Res Inst Epoxidharzzusammensetzung mit halogenfreiem, phosphorfreiem Flammschutzmittel

Also Published As

Publication number Publication date
WO1992006138A1 (en) 1992-04-16
DE69121107D1 (de) 1996-08-29
US5420178A (en) 1995-05-30
US5104604A (en) 1992-04-14
JP3286976B2 (ja) 2002-05-27
EP0552278A1 (de) 1993-07-28
ATE140716T1 (de) 1996-08-15
EP0552278A4 (de) 1993-05-19
ES2059284T1 (es) 1994-11-16
DE69121107T2 (de) 1997-02-06
JPH06508857A (ja) 1994-10-06
GR930300122T1 (en) 1993-12-30
EP0552278B1 (de) 1996-07-24

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