DE452369C - Einrichtung zur Herstellung eines metallischen UEberzugs von Draehten - Google Patents
Einrichtung zur Herstellung eines metallischen UEberzugs von DraehtenInfo
- Publication number
 - DE452369C DE452369C DEP52516D DEP0052516D DE452369C DE 452369 C DE452369 C DE 452369C DE P52516 D DEP52516 D DE P52516D DE P0052516 D DEP0052516 D DE P0052516D DE 452369 C DE452369 C DE 452369C
 - Authority
 - DE
 - Germany
 - Prior art keywords
 - anode
 - turns
 - vessel
 - tub
 - plates
 - Prior art date
 - Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
 - Expired
 
Links
Classifications
- 
        
- C—CHEMISTRY; METALLURGY
 - C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
 - C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
 - C25D7/00—Electroplating characterised by the article coated
 - C25D7/06—Wires; Strips; Foils
 
 - 
        
- B—PERFORMING OPERATIONS; TRANSPORTING
 - B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
 - B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
 - B21C47/00—Winding-up, coiling or winding-off metal wire, metal band or other flexible metal material characterised by features relevant to metal processing only
 - B21C47/26—Special arrangements with regard to simultaneous or subsequent treatment of the material
 - B21C47/265—"helicofil" systems
 
 
Landscapes
- Engineering & Computer Science (AREA)
 - Chemical & Material Sciences (AREA)
 - Mechanical Engineering (AREA)
 - Chemical Kinetics & Catalysis (AREA)
 - Electrochemistry (AREA)
 - Materials Engineering (AREA)
 - Metallurgy (AREA)
 - Organic Chemistry (AREA)
 - Electroplating Methods And Accessories (AREA)
 - Wire Processing (AREA)
 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| GB13490/25A GB254067A (en) | 1925-05-23 | 1925-05-23 | Improved process and apparatus for the electro-deposition of metals on wire or narrow strip | 
Publications (1)
| Publication Number | Publication Date | 
|---|---|
| DE452369C true DE452369C (de) | 1927-11-10 | 
Family
ID=10023901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| DEP52516D Expired DE452369C (de) | 1925-05-23 | 1926-03-24 | Einrichtung zur Herstellung eines metallischen UEberzugs von Draehten | 
Country Status (5)
| Country | Link | 
|---|---|
| US (1) | US1601642A (enEXAMPLES) | 
| BE (1) | BE333311A (enEXAMPLES) | 
| DE (1) | DE452369C (enEXAMPLES) | 
| FR (1) | FR615849A (enEXAMPLES) | 
| GB (1) | GB254067A (enEXAMPLES) | 
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US2495695A (en) * | 1944-05-08 | 1950-01-31 | Kenmore Metals Corp | Electroplating apparatus | 
| US2680710A (en) * | 1950-09-14 | 1954-06-08 | Kenmore Metal Corp | Method and apparatus for continuously electroplating heavy wire and similar strip material | 
| BE512758A (enEXAMPLES) * | 1951-07-13 | |||
| BE523457A (enEXAMPLES) * | 1952-10-29 | |||
| US3073773A (en) * | 1957-12-05 | 1963-01-15 | Nat Standard Co | Electrolytic plating | 
| US3109783A (en) * | 1958-11-20 | 1963-11-05 | Nat Standard Co | Electrolytic plating | 
| EP1052062A1 (en) | 1999-05-03 | 2000-11-15 | Applied Materials, Inc. | Pré-conditioning fixed abrasive articles | 
| US7059948B2 (en) | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates | 
| US7670468B2 (en) | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing | 
| US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing | 
| US7029365B2 (en) * | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing | 
| US6991528B2 (en) | 2000-02-17 | 2006-01-31 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing | 
| US7303462B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process | 
| US6962524B2 (en) | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing | 
| US6979248B2 (en) | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing | 
| US7374644B2 (en) | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing | 
| US7125477B2 (en) | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing | 
| US7066800B2 (en) * | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing | 
| US7303662B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Contacts for electrochemical processing | 
| US7678245B2 (en) | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing | 
| US7137879B2 (en) | 2001-04-24 | 2006-11-21 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing | 
| US7344432B2 (en) | 2001-04-24 | 2008-03-18 | Applied Materials, Inc. | Conductive pad with ion exchange membrane for electrochemical mechanical polishing | 
| US7084064B2 (en) | 2004-09-14 | 2006-08-01 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing | 
| US7520968B2 (en) | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact | 
| US7427340B2 (en) | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad | 
| US20070096315A1 (en) * | 2005-11-01 | 2007-05-03 | Applied Materials, Inc. | Ball contact cover for copper loss reduction and spike reduction | 
- 
        0
        
- BE BE333311D patent/BE333311A/xx unknown
 
 - 
        1925
        
- 1925-05-23 GB GB13490/25A patent/GB254067A/en not_active Expired
 
 - 
        1926
        
- 1926-03-19 US US95961A patent/US1601642A/en not_active Expired - Lifetime
 - 1926-03-24 DE DEP52516D patent/DE452369C/de not_active Expired
 - 1926-05-10 FR FR615849D patent/FR615849A/fr not_active Expired
 
 
Also Published As
| Publication number | Publication date | 
|---|---|
| US1601642A (en) | 1926-09-28 | 
| BE333311A (enEXAMPLES) | |
| GB254067A (en) | 1926-07-01 | 
| FR615849A (fr) | 1927-01-17 | 
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