DE4202455C1 - - Google Patents

Info

Publication number
DE4202455C1
DE4202455C1 DE4202455A DE4202455A DE4202455C1 DE 4202455 C1 DE4202455 C1 DE 4202455C1 DE 4202455 A DE4202455 A DE 4202455A DE 4202455 A DE4202455 A DE 4202455A DE 4202455 C1 DE4202455 C1 DE 4202455C1
Authority
DE
Germany
Prior art keywords
self
supporting layer
substrate wafer
layer
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4202455A
Other languages
German (de)
English (en)
Inventor
Volker Dr. 8000 Muenchen De Lehmann
Wolfgang Dr. 8025 Unterhaching De Hoenlein
Reinhard Dr. 8901 Stadtbergen De Stengl
Josef Dr. 8012 Riemerling De Willer
Hermann Dr. 8011 Neukeferloh De Wendt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE4202455A priority Critical patent/DE4202455C1/de
Priority to DE59203585T priority patent/DE59203585D1/de
Priority to EP92121409A priority patent/EP0553464B1/de
Priority to US07/998,611 priority patent/US5306647A/en
Priority to JP5031199A priority patent/JPH05275724A/ja
Application granted granted Critical
Publication of DE4202455C1 publication Critical patent/DE4202455C1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/121—The active layers comprising only Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/10—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising photovoltaic cells in arrays in a single semiconductor substrate, the photovoltaic cells having vertical junctions or V-groove junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
    • H10F77/148—Shapes of potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/61—Electrolytic etching
    • H10P50/613—Electrolytic etching of Group IV materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Photovoltaic Devices (AREA)
  • Weting (AREA)
DE4202455A 1992-01-29 1992-01-29 Expired - Fee Related DE4202455C1 (enExample)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE4202455A DE4202455C1 (enExample) 1992-01-29 1992-01-29
DE59203585T DE59203585D1 (de) 1992-01-29 1992-12-16 Verfahren zur Herstellung einer Solarzelle aus einer Substratscheibe.
EP92121409A EP0553464B1 (de) 1992-01-29 1992-12-16 Verfahren zur Herstellung einer Solarzelle aus einer Substratscheibe
US07/998,611 US5306647A (en) 1992-01-29 1992-12-30 Method for manufacturing a solar cell from a substrate wafer
JP5031199A JPH05275724A (ja) 1992-01-29 1993-01-27 ソーラーセルの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4202455A DE4202455C1 (enExample) 1992-01-29 1992-01-29

Publications (1)

Publication Number Publication Date
DE4202455C1 true DE4202455C1 (enExample) 1993-08-19

Family

ID=6450504

Family Applications (2)

Application Number Title Priority Date Filing Date
DE4202455A Expired - Fee Related DE4202455C1 (enExample) 1992-01-29 1992-01-29
DE59203585T Expired - Fee Related DE59203585D1 (de) 1992-01-29 1992-12-16 Verfahren zur Herstellung einer Solarzelle aus einer Substratscheibe.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE59203585T Expired - Fee Related DE59203585D1 (de) 1992-01-29 1992-12-16 Verfahren zur Herstellung einer Solarzelle aus einer Substratscheibe.

Country Status (4)

Country Link
US (1) US5306647A (enExample)
EP (1) EP0553464B1 (enExample)
JP (1) JPH05275724A (enExample)
DE (2) DE4202455C1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4310206A1 (de) * 1993-03-29 1994-10-06 Siemens Ag Verfahren zur Herstellung einer Solarzelle aus einer Substratscheibe
DE10032579A1 (de) * 2000-07-05 2002-01-24 Bosch Gmbh Robert Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement
DE102009053262A1 (de) 2009-11-13 2011-05-19 Institut Für Solarenergieforschung Gmbh Verfahren zum Bilden von dünnen Halbleiterschichtsubstraten sowie Verfahren zum Herstellen eines Halbleiterbauelements, insbesondere einer Solarzelle, mit einem solchen Halbleiterschichtsubstrat

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5454915A (en) * 1992-10-06 1995-10-03 Kulite Semiconductor Products, Inc. Method of fabricating porous silicon carbide (SiC)
US5348627A (en) * 1993-05-12 1994-09-20 Georgia Tech Reserach Corporation Process and system for the photoelectrochemical etching of silicon in an anhydrous environment
EP0645621A3 (de) * 1993-09-28 1995-11-08 Siemens Ag Sensoranordnung.
JP3347203B2 (ja) * 1993-12-27 2002-11-20 富士通株式会社 微細空洞形成方法及び微細空洞を有する微小装置
EP0666595B1 (de) * 1994-02-07 1998-08-19 Siemens Aktiengesellschaft Verfahren zur Herstellung einer kubisch integrierten Schaltungsanordnung
WO1999016123A1 (de) * 1997-09-22 1999-04-01 Siemens Aktiengesellschaft Verfahren zur herstellung einer dotierten schicht in einem aus einem halbleiter bestehenden erzeugnis, sowie entsprechendes erzeugnis
JP3619058B2 (ja) * 1998-06-18 2005-02-09 キヤノン株式会社 半導体薄膜の製造方法
KR20010041742A (ko) 1999-01-13 2001-05-25 다니구찌 이찌로오, 기타오카 다카시 실리콘 디바이스의 제조방법
KR100468252B1 (ko) * 2000-05-24 2005-01-27 미쓰비시덴키 가부시키가이샤 광 조사식 전기 화학 에칭 장치 및 그 방법
AUPR174800A0 (en) 2000-11-29 2000-12-21 Australian National University, The Semiconductor processing
CA2370731A1 (en) * 2001-02-07 2002-08-07 Ebara Corporation Solar cell and method of manufacturing same
KR20040068928A (ko) * 2001-11-29 2004-08-02 오리진 에너지 솔라 피티와이 리미티드 반도체 가공 방법
JP4301950B2 (ja) * 2001-12-04 2009-07-22 オリジン エナジー ソーラー ピーティーワイ リミテッド 太陽電池用の薄いシリコンシートを製造する方法
AU2002349175B2 (en) * 2001-12-04 2008-11-06 The Australian National University Method of making thin silicon sheets for solar cells
US7357877B2 (en) * 2002-11-18 2008-04-15 Koninklijke Philips Electronics N.V. Dispersion of nanowires of semiconductor material
US7507318B2 (en) * 2004-09-17 2009-03-24 Uchicago Argonne, Llc Devices using resin wafers and applications thereof
EP1691421A1 (en) * 2005-02-10 2006-08-16 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO Process for preparing a metal film on a substrate
EP2304803A1 (en) * 2008-06-11 2011-04-06 Solar Implant Technologies Inc. Solar cell fabrication using implantation
SG186005A1 (en) * 2009-03-20 2012-12-28 Intevac Inc Advanced high efficiency crystalline solar cell fabrication method
EP2256820A3 (en) * 2009-05-25 2011-04-20 Nxp B.V. Photo-electronic device comprising a vertical p-n or p-i-n junction and manufacturing method thereof
US8749053B2 (en) 2009-06-23 2014-06-10 Intevac, Inc. Plasma grid implant system for use in solar cell fabrications
EP2777069A4 (en) 2011-11-08 2015-01-14 Intevac Inc SUBSTRATE PROCESSING SYSTEM AND METHOD
MY178951A (en) 2012-12-19 2020-10-23 Intevac Inc Grid for plasma ion implant
ITUB20152429A1 (it) * 2015-07-23 2017-01-23 Enea Agenzia Naz Per Le Nuove Tecnologie Lenergia E Lo Sviluppo Economico Sostenibile Cella solare ultra-sottile in silicio cristallino poroso.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4137123A (en) * 1975-12-31 1979-01-30 Motorola, Inc. Texture etching of silicon: method
DE3122771A1 (de) * 1980-06-16 1982-05-06 Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven "verfahren zur herstellung von sonnenzellen"
EP0296348A1 (de) * 1987-05-27 1988-12-28 Siemens Aktiengesellschaft Ätzverfahren zum Erzeugen von Lochöffnungen oder Gräben in n-dotiertem Silizium
US5081049A (en) * 1988-07-18 1992-01-14 Unisearch Limited Sculpted solar cell surfaces

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Publication number Priority date Publication date Assignee Title
US3969746A (en) * 1973-12-10 1976-07-13 Texas Instruments Incorporated Vertical multijunction solar cell
US4255208A (en) * 1979-05-25 1981-03-10 Ramot University Authority For Applied Research And Industrial Development Ltd. Method of producing monocrystalline semiconductor films utilizing an intermediate water dissolvable salt layer
EP0191505A3 (en) * 1980-04-10 1986-09-10 Massachusetts Institute Of Technology Method of producing sheets of crystalline material
US4303463A (en) * 1980-09-29 1981-12-01 Cook Melvin S Method of peeling thin films using directional heat flow
US4338481A (en) * 1980-10-02 1982-07-06 Joseph Mandelkorn Very thin silicon wafer base solar cell
DE3107596A1 (de) * 1981-02-27 1982-10-21 Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen "verfahren zur herstellung von halbleiterscheiben"
US4527183A (en) * 1981-07-10 1985-07-02 General Electric Company Drilled, diffused radiation detector
US4425408A (en) * 1981-08-07 1984-01-10 Texas Instruments Incorporated Production of single crystal semiconductors
DE3132776A1 (de) * 1981-08-19 1983-03-03 Heliotronic Gmbh Verfahren zur herstellung grob- bis einkristalliner folien aus halbleitermaterial
US4409423A (en) * 1982-03-09 1983-10-11 The United States Of America As Represented By The Secretary Of The Air Force Hole matrix vertical junction solar cell
JPS5993000A (ja) * 1982-11-17 1984-05-29 Yoshihiro Hamakawa 単結晶薄膜製造用基板
US4824489A (en) * 1988-02-02 1989-04-25 Sera Solar Corporation Ultra-thin solar cell and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4137123A (en) * 1975-12-31 1979-01-30 Motorola, Inc. Texture etching of silicon: method
DE3122771A1 (de) * 1980-06-16 1982-05-06 Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven "verfahren zur herstellung von sonnenzellen"
EP0296348A1 (de) * 1987-05-27 1988-12-28 Siemens Aktiengesellschaft Ätzverfahren zum Erzeugen von Lochöffnungen oder Gräben in n-dotiertem Silizium
US5081049A (en) * 1988-07-18 1992-01-14 Unisearch Limited Sculpted solar cell surfaces

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE-Z.: Physikalische Blätter, Bd. 47, Nr. 12, 1991, S. 1075-1076 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4310206A1 (de) * 1993-03-29 1994-10-06 Siemens Ag Verfahren zur Herstellung einer Solarzelle aus einer Substratscheibe
DE10032579A1 (de) * 2000-07-05 2002-01-24 Bosch Gmbh Robert Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement
US7479232B2 (en) 2000-07-05 2009-01-20 Robert Bosch Gmbh Method for producing a semiconductor component and a semiconductor component produced according to the method
US8123963B2 (en) 2000-07-05 2012-02-28 Robert Bosch Gmbh Method for producing a semiconductor component and a semiconductor component produced according to the method
USRE44995E1 (en) 2000-07-05 2014-07-08 Robert Bosch Gmbh Method for producing a semiconductor component and a semiconductor component produced according to the method
DE10032579B4 (de) 2000-07-05 2020-07-02 Robert Bosch Gmbh Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement
DE102009053262A1 (de) 2009-11-13 2011-05-19 Institut Für Solarenergieforschung Gmbh Verfahren zum Bilden von dünnen Halbleiterschichtsubstraten sowie Verfahren zum Herstellen eines Halbleiterbauelements, insbesondere einer Solarzelle, mit einem solchen Halbleiterschichtsubstrat
WO2011058106A2 (de) 2009-11-13 2011-05-19 Institut Für Solarenergieforschung Gmbh Verfahren zum bilden von dünnen halbleiterschichtsubstraten zum herstellen von solarzellen
WO2011058106A3 (de) * 2009-11-13 2012-06-07 Institut Für Solarenergieforschung Gmbh Verfahren zum bilden von dünnen halbleiterschichtsubstraten zum herstellen von solarzellen
CN102640305A (zh) * 2009-11-13 2012-08-15 太阳能研究所股份有限公司 用于形成用于制造太阳能电池的薄半导体层衬底的方法

Also Published As

Publication number Publication date
DE59203585D1 (de) 1995-10-12
EP0553464A1 (de) 1993-08-04
US5306647A (en) 1994-04-26
JPH05275724A (ja) 1993-10-22
EP0553464B1 (de) 1995-09-06

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Legal Events

Date Code Title Description
8100 Publication of patent without earlier publication of application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee