DE4026353C1 - - Google Patents
Info
- Publication number
- DE4026353C1 DE4026353C1 DE4026353A DE4026353A DE4026353C1 DE 4026353 C1 DE4026353 C1 DE 4026353C1 DE 4026353 A DE4026353 A DE 4026353A DE 4026353 A DE4026353 A DE 4026353A DE 4026353 C1 DE4026353 C1 DE 4026353C1
- Authority
- DE
- Germany
- Prior art keywords
- polymeric
- flame
- ratio
- dry
- adhesive system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000004114 Ammonium polyphosphate Substances 0.000 claims abstract description 6
- 235000019826 ammonium polyphosphate Nutrition 0.000 claims abstract description 6
- 229920001276 ammonium polyphosphate Polymers 0.000 claims abstract description 6
- 239000003063 flame retardant Substances 0.000 claims description 12
- 229920001577 copolymer Polymers 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 4
- 229920003180 amino resin Polymers 0.000 claims description 4
- 239000004745 nonwoven fabric Substances 0.000 claims description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims 2
- 239000010408 film Substances 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 5
- 239000013039 cover film Substances 0.000 abstract description 4
- 239000010419 fine particle Substances 0.000 abstract 2
- 125000005396 acrylic acid ester group Chemical group 0.000 abstract 1
- 239000004744 fabric Substances 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920005789 ACRONAL® acrylic binder Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 159000000032 aromatic acids Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010382 chemical cross-linking Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- GUSFEBGYPWJUSS-UHFFFAOYSA-N pentaazanium;[oxido(phosphonatooxy)phosphoryl] phosphate Chemical compound [NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[O-]P([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O GUSFEBGYPWJUSS-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Paper (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4026353A DE4026353C1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-08-21 | 1990-08-21 | |
| ES91109776T ES2062618T3 (es) | 1990-08-21 | 1991-06-14 | Lamina de cubierta para placas flexibles de circuitos. |
| DE59103098T DE59103098D1 (de) | 1990-08-21 | 1991-06-14 | Abdeckfolie für flexible Leiterplatten. |
| AT91109776T ATE112334T1 (de) | 1990-08-21 | 1991-06-14 | Abdeckfolie für flexible leiterplatten. |
| DK91109776.4T DK0471936T3 (da) | 1990-08-21 | 1991-06-14 | Beskyttelsesfolie til fleksible kredsløbsplader |
| EP91109776A EP0471936B1 (de) | 1990-08-21 | 1991-06-14 | Abdeckfolie für flexible Leiterplatten |
| JP3209200A JP2927994B2 (ja) | 1990-08-21 | 1991-08-21 | 可撓印刷回路板のための防炎被覆シート |
| US07/748,690 US5229192A (en) | 1990-08-21 | 1991-08-21 | Flame-resistant cover film for flexible circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4026353A DE4026353C1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-08-21 | 1990-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE4026353C1 true DE4026353C1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-12-12 |
Family
ID=6412582
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE4026353A Expired - Lifetime DE4026353C1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-08-21 | 1990-08-21 | |
| DE59103098T Expired - Fee Related DE59103098D1 (de) | 1990-08-21 | 1991-06-14 | Abdeckfolie für flexible Leiterplatten. |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE59103098T Expired - Fee Related DE59103098D1 (de) | 1990-08-21 | 1991-06-14 | Abdeckfolie für flexible Leiterplatten. |
Country Status (7)
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9119795D0 (en) * | 1991-09-17 | 1991-10-30 | Albright & Wilson | Flame retardant plastics material |
| CH684479A5 (de) * | 1992-06-30 | 1994-09-30 | Cerberus Ag | Schutzüberzug für elektronische Baugruppen auf einer Leiterplatte, sowie Verfahren zu dessen Herstellung. |
| DE4419169A1 (de) * | 1994-06-01 | 1995-12-07 | Beiersdorf Ag | Gewebeklebeband |
| US5499444A (en) * | 1994-08-02 | 1996-03-19 | Coesen, Inc. | Method of manufacturing a rigid flex printed circuit board |
| US6245696B1 (en) | 1999-06-25 | 2001-06-12 | Honeywell International Inc. | Lasable bond-ply materials for high density printed wiring boards |
| US6224965B1 (en) | 1999-06-25 | 2001-05-01 | Honeywell International Inc. | Microfiber dielectrics which facilitate laser via drilling |
| JP2001210919A (ja) * | 1999-11-17 | 2001-08-03 | Sharp Corp | フレキシブル配線板およびそれを用いた電子機器 |
| US6327155B1 (en) | 1999-12-16 | 2001-12-04 | Nortel Networks Limited | Method and apparatus for preventing flamespread in an equipment assembly |
| US6495244B1 (en) * | 2000-09-07 | 2002-12-17 | Oak-Mitsui, Inc. | Manufacturing fire retardant circuit boards without the use of fire retardant resin additives |
| US6519162B1 (en) * | 2001-08-30 | 2003-02-11 | Adc Telecommunications, Inc. | Protective panel for a splitter chassis or other device for holding electronic cards |
| US20060019102A1 (en) * | 2004-07-26 | 2006-01-26 | Kuppsuamy Kanakarajan | Flame-retardant halogen-free polyimide films useful as thermal insulation in aircraft applications and methods relating thereto |
| US20070149001A1 (en) * | 2005-12-22 | 2007-06-28 | Uka Harshad K | Flexible circuit |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4075420A (en) * | 1975-08-28 | 1978-02-21 | Burroughs Corporation | Cover layer for flexible circuits |
| US4311749A (en) * | 1977-09-06 | 1982-01-19 | Nippondenso Co., Ltd. | Flame-proof flexible printed circuit board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4195997A (en) * | 1978-01-23 | 1980-04-01 | E. I. Du Pont De Nemours And Company | Photopolymerizable compositions containing selected cellulose acetate butyrate as a binder |
| JPS5831753B2 (ja) * | 1979-02-02 | 1983-07-08 | 鐘淵化学工業株式会社 | 電気用絶縁積層板及び印刷回路用金属箔張り積層板 |
| US4291087A (en) * | 1979-06-12 | 1981-09-22 | Rohm And Haas Company | Non-woven fabrics bonded by radiation-curable, hazard-free binders |
| FR2494314A1 (fr) * | 1980-11-19 | 1982-05-21 | Rhone Poulenc Ind | Nontisses et notamment voiles a usage hygienique |
| DE3200072A1 (de) * | 1981-01-14 | 1982-08-12 | Basf Ag, 6700 Ludwigshafen | Verfahren zur herstellung tiefziehbarer, gebundener nadelvliese fuer kraftfahrzeug-innenausstattungen mit verminderter neigung zum schrumpfen |
| JPH01163256A (ja) * | 1987-12-21 | 1989-06-27 | Nippon Oil Co Ltd | 積層板用樹脂組成物 |
-
1990
- 1990-08-21 DE DE4026353A patent/DE4026353C1/de not_active Expired - Lifetime
-
1991
- 1991-06-14 AT AT91109776T patent/ATE112334T1/de not_active IP Right Cessation
- 1991-06-14 DE DE59103098T patent/DE59103098D1/de not_active Expired - Fee Related
- 1991-06-14 DK DK91109776.4T patent/DK0471936T3/da active
- 1991-06-14 ES ES91109776T patent/ES2062618T3/es not_active Expired - Lifetime
- 1991-06-14 EP EP91109776A patent/EP0471936B1/de not_active Expired - Lifetime
- 1991-08-21 JP JP3209200A patent/JP2927994B2/ja not_active Expired - Fee Related
- 1991-08-21 US US07/748,690 patent/US5229192A/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4075420A (en) * | 1975-08-28 | 1978-02-21 | Burroughs Corporation | Cover layer for flexible circuits |
| US4311749A (en) * | 1977-09-06 | 1982-01-19 | Nippondenso Co., Ltd. | Flame-proof flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04233791A (ja) | 1992-08-21 |
| ES2062618T3 (es) | 1994-12-16 |
| EP0471936A1 (de) | 1992-02-26 |
| ATE112334T1 (de) | 1994-10-15 |
| EP0471936B1 (de) | 1994-09-28 |
| JP2927994B2 (ja) | 1999-07-28 |
| DE59103098D1 (de) | 1994-11-03 |
| DK0471936T3 (da) | 1994-10-24 |
| US5229192A (en) | 1993-07-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8100 | Publication of patent without earlier publication of application | ||
| D1 | Grant (no unexamined application published) patent law 81 | ||
| 8364 | No opposition during term of opposition | ||
| 8330 | Complete renunciation |