DE3925814A1 - Verfahren zum verloeten von elektrischen bauelementen mit einer leiterplatte - Google Patents

Verfahren zum verloeten von elektrischen bauelementen mit einer leiterplatte

Info

Publication number
DE3925814A1
DE3925814A1 DE3925814A DE3925814A DE3925814A1 DE 3925814 A1 DE3925814 A1 DE 3925814A1 DE 3925814 A DE3925814 A DE 3925814A DE 3925814 A DE3925814 A DE 3925814A DE 3925814 A1 DE3925814 A1 DE 3925814A1
Authority
DE
Germany
Prior art keywords
soldering
solder
circuit board
frame
mounted devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3925814A
Other languages
German (de)
English (en)
Other versions
DE3925814C2 (enExample
Inventor
Paul Bahl
Holger Schaefer
Ekkehart Dipl Ing Tschoep
Volkmar Beuchel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips GmbH
Original Assignee
BTS Broadcast Television Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BTS Broadcast Television Systems GmbH filed Critical BTS Broadcast Television Systems GmbH
Priority to DE3925814A priority Critical patent/DE3925814A1/de
Priority to FR9008682A priority patent/FR2650714B1/fr
Publication of DE3925814A1 publication Critical patent/DE3925814A1/de
Application granted granted Critical
Publication of DE3925814C2 publication Critical patent/DE3925814C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE3925814A 1989-08-04 1989-08-04 Verfahren zum verloeten von elektrischen bauelementen mit einer leiterplatte Granted DE3925814A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE3925814A DE3925814A1 (de) 1989-08-04 1989-08-04 Verfahren zum verloeten von elektrischen bauelementen mit einer leiterplatte
FR9008682A FR2650714B1 (fr) 1989-08-04 1990-07-09 Procede pour braser des composants electriques avec une carte de circuit imprime et cadre de brasage pour la mise en oeuvre du procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3925814A DE3925814A1 (de) 1989-08-04 1989-08-04 Verfahren zum verloeten von elektrischen bauelementen mit einer leiterplatte

Publications (2)

Publication Number Publication Date
DE3925814A1 true DE3925814A1 (de) 1991-02-07
DE3925814C2 DE3925814C2 (enExample) 1992-06-11

Family

ID=6386507

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3925814A Granted DE3925814A1 (de) 1989-08-04 1989-08-04 Verfahren zum verloeten von elektrischen bauelementen mit einer leiterplatte

Country Status (2)

Country Link
DE (1) DE3925814A1 (enExample)
FR (1) FR2650714B1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2719797A1 (fr) * 1994-05-16 1995-11-17 Proner Comatel Sa Installation de brasage pour composants électroniques.
FR2731869A1 (fr) * 1995-03-17 1996-09-20 Fujitsu Ltd Carte de circuit et procede de fabrication de cette carte de circuit
WO2013010836A3 (de) * 2011-07-19 2014-04-24 Robert Bosch Gmbh Steckermodul, insbesondere für fensterheberantriebe, sowie verfahren zu dessen herstellung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1139902B (de) * 1959-12-15 1962-11-22 Licentia Gmbh Stecker- oder Loetanschluesse fuer bedruckte Schaltungsplatinen
DE7430555U (de) * 1974-12-12 Nixdorf Computer Ag Schutzkappe für einen Steckkontaktelemente tragenden Bereich zumindest einer Schaltungsplatte
EP0317213A2 (en) * 1987-11-20 1989-05-24 Nihon Den-Netsu Keiki Co., Ltd. Device for transferring printed circuit board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57190339A (en) * 1981-05-19 1982-11-22 Pioneer Electronic Corp Manufacture of printed circuit board unit
JPS60133969A (ja) * 1983-12-22 1985-07-17 Tamura Seisakusho Co Ltd はんだ付け時間測定方法
JPH0636393B2 (ja) * 1987-04-15 1994-05-11 松下電器産業株式会社 電子部品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7430555U (de) * 1974-12-12 Nixdorf Computer Ag Schutzkappe für einen Steckkontaktelemente tragenden Bereich zumindest einer Schaltungsplatte
DE1139902B (de) * 1959-12-15 1962-11-22 Licentia Gmbh Stecker- oder Loetanschluesse fuer bedruckte Schaltungsplatinen
EP0317213A2 (en) * 1987-11-20 1989-05-24 Nihon Den-Netsu Keiki Co., Ltd. Device for transferring printed circuit board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE-Firmenprospekt: ZEVATRON, Tauchlötmaschine, Typ TL 4 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2719797A1 (fr) * 1994-05-16 1995-11-17 Proner Comatel Sa Installation de brasage pour composants électroniques.
EP0683006A1 (fr) * 1994-05-16 1995-11-22 PRONER COMATEL (Société Anonyme) Installation de brasage pour composants électroniques
FR2731869A1 (fr) * 1995-03-17 1996-09-20 Fujitsu Ltd Carte de circuit et procede de fabrication de cette carte de circuit
US5940964A (en) * 1995-03-17 1999-08-24 Fujitsu Limited Fabrication process for circuit substrate having interconnection leads
WO2013010836A3 (de) * 2011-07-19 2014-04-24 Robert Bosch Gmbh Steckermodul, insbesondere für fensterheberantriebe, sowie verfahren zu dessen herstellung
CN103797692A (zh) * 2011-07-19 2014-05-14 罗伯特·博世有限公司 插头模块、特别是用于车窗玻璃升降器驱动装置的插头模块及其制造方法
CN103797692B (zh) * 2011-07-19 2016-11-09 罗伯特·博世有限公司 插头模块、电气驱动装置和用于制造插头模块的方法

Also Published As

Publication number Publication date
FR2650714A1 (fr) 1991-02-08
FR2650714B1 (fr) 1996-08-23
DE3925814C2 (enExample) 1992-06-11

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PHILIPS BROADCAST TELEVISION SYSTEMS GMBH, 64347 G

8339 Ceased/non-payment of the annual fee