FR2650714B1 - Procede pour braser des composants electriques avec une carte de circuit imprime et cadre de brasage pour la mise en oeuvre du procede - Google Patents

Procede pour braser des composants electriques avec une carte de circuit imprime et cadre de brasage pour la mise en oeuvre du procede

Info

Publication number
FR2650714B1
FR2650714B1 FR9008682A FR9008682A FR2650714B1 FR 2650714 B1 FR2650714 B1 FR 2650714B1 FR 9008682 A FR9008682 A FR 9008682A FR 9008682 A FR9008682 A FR 9008682A FR 2650714 B1 FR2650714 B1 FR 2650714B1
Authority
FR
France
Prior art keywords
implementing
circuit board
printed circuit
electrical components
soldering frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9008682A
Other languages
English (en)
French (fr)
Other versions
FR2650714A1 (fr
Inventor
Bahl Paul
Schafer Holger
Tschop Ekkehardt
Beuchel Volkmar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips GmbH
Original Assignee
BTS Broadcast Television Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BTS Broadcast Television Systems GmbH filed Critical BTS Broadcast Television Systems GmbH
Publication of FR2650714A1 publication Critical patent/FR2650714A1/fr
Application granted granted Critical
Publication of FR2650714B1 publication Critical patent/FR2650714B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
FR9008682A 1989-08-04 1990-07-09 Procede pour braser des composants electriques avec une carte de circuit imprime et cadre de brasage pour la mise en oeuvre du procede Expired - Fee Related FR2650714B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3925814A DE3925814A1 (de) 1989-08-04 1989-08-04 Verfahren zum verloeten von elektrischen bauelementen mit einer leiterplatte

Publications (2)

Publication Number Publication Date
FR2650714A1 FR2650714A1 (fr) 1991-02-08
FR2650714B1 true FR2650714B1 (fr) 1996-08-23

Family

ID=6386507

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9008682A Expired - Fee Related FR2650714B1 (fr) 1989-08-04 1990-07-09 Procede pour braser des composants electriques avec une carte de circuit imprime et cadre de brasage pour la mise en oeuvre du procede

Country Status (2)

Country Link
DE (1) DE3925814A1 (enExample)
FR (1) FR2650714B1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2719797B1 (fr) * 1994-05-16 1996-08-02 Proner Comatel Sa Installation de brasage pour composants électroniques.
JP3368451B2 (ja) * 1995-03-17 2003-01-20 富士通株式会社 回路基板の製造方法と回路検査装置
DE102011079377A1 (de) * 2011-07-19 2013-01-24 Robert Bosch Gmbh Steckermodul, insbesondere für Fensterheberantriebe, sowie Verfahren zu dessen Herstellung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7430555U (de) * 1974-12-12 Nixdorf Computer Ag Schutzkappe für einen Steckkontaktelemente tragenden Bereich zumindest einer Schaltungsplatte
DE1139902B (de) * 1959-12-15 1962-11-22 Licentia Gmbh Stecker- oder Loetanschluesse fuer bedruckte Schaltungsplatinen
JPS57190339A (en) * 1981-05-19 1982-11-22 Pioneer Electronic Corp Manufacture of printed circuit board unit
JPS60133969A (ja) * 1983-12-22 1985-07-17 Tamura Seisakusho Co Ltd はんだ付け時間測定方法
JPH0636393B2 (ja) * 1987-04-15 1994-05-11 松下電器産業株式会社 電子部品の製造方法
JPH01133668A (ja) * 1987-11-20 1989-05-25 Kenji Kondo プリント基板の保持搬送方法およびその装置

Also Published As

Publication number Publication date
DE3925814C2 (enExample) 1992-06-11
FR2650714A1 (fr) 1991-02-08
DE3925814A1 (de) 1991-02-07

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Legal Events

Date Code Title Description
ST Notification of lapse