DE3856099D1 - Verfahren zur Herstellung von wenig dielektrischen Polyimiden - Google Patents

Verfahren zur Herstellung von wenig dielektrischen Polyimiden

Info

Publication number
DE3856099D1
DE3856099D1 DE3856099T DE3856099T DE3856099D1 DE 3856099 D1 DE3856099 D1 DE 3856099D1 DE 3856099 T DE3856099 T DE 3856099T DE 3856099 T DE3856099 T DE 3856099T DE 3856099 D1 DE3856099 D1 DE 3856099D1
Authority
DE
Germany
Prior art keywords
production
low dielectric
dielectric polyimides
polyimides
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3856099T
Other languages
English (en)
Other versions
DE3856099T2 (de
Inventor
St Clair Anne King
St Clair Terry Lee
William Paul Winfree
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Aeronautics and Space Administration NASA
Original Assignee
National Aeronautics and Space Administration NASA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Aeronautics and Space Administration NASA filed Critical National Aeronautics and Space Administration NASA
Application granted granted Critical
Publication of DE3856099D1 publication Critical patent/DE3856099D1/de
Publication of DE3856099T2 publication Critical patent/DE3856099T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Organic Insulating Materials (AREA)
  • Paints Or Removers (AREA)
DE19883856099 1987-07-15 1988-07-12 Verfahren zur Herstellung von wenig dielektrischen Polyimiden Expired - Lifetime DE3856099T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7354287A 1987-07-15 1987-07-15

Publications (2)

Publication Number Publication Date
DE3856099D1 true DE3856099D1 (de) 1998-02-12
DE3856099T2 DE3856099T2 (de) 1998-09-03

Family

ID=22114322

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19883856099 Expired - Lifetime DE3856099T2 (de) 1987-07-15 1988-07-12 Verfahren zur Herstellung von wenig dielektrischen Polyimiden

Country Status (5)

Country Link
EP (1) EP0299865B1 (de)
JP (1) JPH01118527A (de)
AU (1) AU610606B2 (de)
CA (1) CA1312990C (de)
DE (1) DE3856099T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4895972A (en) * 1988-09-01 1990-01-23 The United States Of American As Represented By The Administrator Of The National Aeronautics And Space Administration Process for lowering the dielectric constant of polyimides using diamic acid additives
JP2677911B2 (ja) * 1990-05-29 1997-11-17 日立化成工業株式会社 含フツ素ポリイミド、含フツ素ポリアミド酸及びポリイミド系樹脂の製造法
DE69127137T2 (de) * 1990-06-01 1998-02-26 Mitsui Toatsu Chemicals Leicht zu verarbeitende Polyimide und deren Herstellung
JP2851019B2 (ja) * 1990-09-28 1999-01-27 日本電信電話株式会社 全フッ素化ポリイミド，全フッ素化ポリアミド酸およびそれらの製造方法
JP2748995B2 (ja) * 1990-11-26 1998-05-13 三井東圧化学株式会社 溶融成形用ポリイミドおよびその製造方法ならびにその樹脂組成物
US5354839A (en) * 1992-04-07 1994-10-11 Mitsui Toatsu Chemicals, Incorporated Polyimide and preparation process of same
US5470943A (en) * 1994-01-07 1995-11-28 Mitsui Toatsu Chemicals, Inc. Polyimide
US5578697A (en) * 1994-03-29 1996-11-26 Kabushiki Kaisha Toshiba Polyimide precursor, bismaleimide-based cured resin precursor and electronic parts having insulating members made from these precursors
KR0126792B1 (ko) * 1994-04-11 1998-04-01 김광호 폴리이미드(Polyimide) 표면 처리방법
KR100594866B1 (ko) * 2000-02-03 2006-07-03 엘지.필립스 엘시디 주식회사 저 유전물질 제조방법
JP4831385B2 (ja) * 2001-05-11 2011-12-07 日立化成工業株式会社 フッ素含有ポリイミド共重合体、前駆体、光部品、光部品の屈折率の制御方法
KR101149459B1 (ko) * 2005-10-25 2012-05-24 히다치 가세고교 가부시끼가이샤 가요성 적층판, 그의 제조 방법, 및 가요성 인쇄 배선판
TWI435902B (zh) * 2007-08-20 2014-05-01 Kolon Inc 聚亞醯胺膜
KR101292951B1 (ko) * 2007-09-06 2013-08-05 코오롱인더스트리 주식회사 폴리이미드 수지 및 이를 이용한 필름
JP5338469B2 (ja) * 2008-05-14 2013-11-13 三菱瓦斯化学株式会社 ポリイミドおよびポリアミック酸
KR101248671B1 (ko) * 2008-09-23 2013-03-28 코오롱인더스트리 주식회사 투명전극
JP2013237762A (ja) * 2012-05-14 2013-11-28 Dexerials Corp ポリイミド、ポリイミド樹脂組成物及びポリイミドフィルム
KR102224505B1 (ko) * 2019-07-05 2021-03-09 피아이첨단소재 주식회사 폴리아믹산 조성물, 폴리아믹산 조성물의 제조 방법, 이를 포함하는 폴리이미드 및 이를 포함하는 피복물
KR102224503B1 (ko) * 2019-07-05 2021-03-09 피아이첨단소재 주식회사 폴리아믹산 조성물, 폴리아믹산 조성물의 제조 방법, 이를 포함하는 폴리이미드 및 이를 포함하는 피복물
US11753517B2 (en) 2019-12-12 2023-09-12 Raytheon Company Dispensable polyimide aerogel prepolymer, method of making the same, method of using the same, and substrate comprising patterned polyimide aerogel
CN114230791B (zh) * 2021-12-29 2023-10-24 山东华夏神舟新材料有限公司 本征型低介电含氟聚酰亚胺薄膜及其制备方法
CN115612097B (zh) * 2022-07-28 2023-10-03 江西有泽新材料科技有限公司 一种低介电和高强度的纳米复合材料及制备方法
CN115490854B (zh) * 2022-09-05 2024-01-30 江西有泽新材料科技有限公司 一种低介电、高耐热、低吸水的高性能聚酰亚胺及其制备方法和应用
CN115850699B (zh) * 2022-09-05 2024-04-26 江西有泽新材料科技有限公司 一种低介电共混聚酰亚胺及制备方法和应用
CN115449076B (zh) * 2022-10-26 2024-02-23 航天科工(长沙)新材料研究院有限公司 一种聚酰亚胺前驱体、前驱体组合物、聚酰亚胺树脂及其制备方法
CN116178714A (zh) * 2023-02-28 2023-05-30 武汉理工大学 一种含氟改性聚酰亚胺及其制备方法和应用

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2429695C2 (de) * 1973-06-22 1985-09-26 General Electric Co., Schenectady, N.Y. Verfahren zum Herstellen von Polyätherimiden
US4221897A (en) * 1979-05-09 1980-09-09 General Electric Company Method for making polyetheramide acid
JPS57181146A (en) * 1981-04-30 1982-11-08 Hitachi Ltd Resin-sealed semiconductor device
JPS5891430A (ja) * 1981-11-27 1983-05-31 Hitachi Ltd 液晶表示素子
JPS58180530A (ja) * 1982-04-19 1983-10-22 Hitachi Ltd 新規なフツ素含有ポリアミドおよびポリイミド
US4595548A (en) * 1984-08-23 1986-06-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process for preparing essentially colorless polyimide film containing phenoxy-linked diamines
JP2610804B2 (ja) * 1984-10-15 1997-05-14 三井東圧化学株式会社 ポリイミドフィルムからなる耐熱性接着剤
AU576675B2 (en) * 1985-06-20 1988-09-01 National Aeronautics And Space Administration - Nasa Copolyimides
JPS62108555A (ja) * 1985-11-06 1987-05-19 Hitachi Ltd 半導体装置
JPS62127827A (ja) * 1985-11-29 1987-06-10 Hitachi Chem Co Ltd 液晶配向膜用組成物
JP2567375B2 (ja) * 1986-02-13 1996-12-25 三井東圧化学株式会社 無色ポリイミドフイルム
JPS62241923A (ja) * 1986-04-15 1987-10-22 Mitsui Toatsu Chem Inc ポリイミド
JPS62231937A (ja) * 1986-04-01 1987-10-12 Canon Inc 液晶素子
JP2585552B2 (ja) * 1986-11-19 1997-02-26 三井東圧化学株式会社 ポリイミド
JP2519228B2 (ja) * 1987-01-08 1996-07-31 日東電工株式会社 無色透明ポリイミド成形体およびその製法

Also Published As

Publication number Publication date
EP0299865A3 (de) 1991-01-02
DE3856099T2 (de) 1998-09-03
AU610606B2 (en) 1991-05-23
EP0299865A2 (de) 1989-01-18
CA1312990C (en) 1993-01-19
EP0299865B1 (de) 1998-01-07
JPH01118527A (ja) 1989-05-11
AU1895488A (en) 1989-01-19

Similar Documents

Publication Publication Date Title
DE3856099D1 (de) Verfahren zur Herstellung von wenig dielektrischen Polyimiden
DE3856483D1 (de) Verfahren zur Herstellung von Dünnschichten
DE68929012D1 (de) Verfahren zur Herstellung von Mehrschichtschaltungen
DE69132176D1 (de) Verfahren zur Herstellung von Elektroden
DE3752333D1 (de) Verfahren zur Herstellung von elektrisch leitendem Material
ATA348285A (de) Verfahren zur herstellung von suesswaren
DE69024909D1 (de) Verfahren zur Herstellung von Polyimid-Verbundstoffen
AT385282B (de) Verfahren zur kontinuierlichen herstellung von aethanol
DE3884367D1 (de) Verfahren zur Herstellung von Feinstdraht.
DE3650547D1 (de) Verfahren zur Herstellung von Halbleiterlasern
DE59206082D1 (de) Verfahren zur Herstellung von supraleitenden Drähten
DE69125588D1 (de) Verfahren zur Herstellung von Substraten mit dielektrischer Trennung
DE3854799D1 (de) Verfahren zur Herstellung von veränderten Zeolithen
DE68928398D1 (de) Verfahren zur Herstellung von Polybuten
DE3855580D1 (de) Verfahren zur Herstellung von Polyparaphenylensulfiden
DE69119552D1 (de) Verfahren zur Herstellung von Diethern
DE69016382D1 (de) Verfahren zur Herstellung von Polyimiden.
DE69213916D1 (de) Verfahren zur Herstellung von L-Ambrox
DE69217346D1 (de) Verfahren zur Herstellung von Mikroleuchtkörpern
DE3851364D1 (de) Verfahren zur Herstellung von supraleitendem Material.
DE3851588D1 (de) Verfahren zur Herstellung von Chinoloncarbonsäuren.
DE69310232D1 (de) Verfahren zur Herstellung von Organomonochlorsilan
DE69024884D1 (de) Verfahren zur Herstellung von feinem Kupferpulver
DE69025446D1 (de) Verfahren zur Herstellung von Tonern
PT77857B (de) Verfahren zur herstellung von substituierten azabicycloalkanen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition