DE3884367D1 - Verfahren zur Herstellung von Feinstdraht. - Google Patents

Verfahren zur Herstellung von Feinstdraht.

Info

Publication number
DE3884367D1
DE3884367D1 DE88121785T DE3884367T DE3884367D1 DE 3884367 D1 DE3884367 D1 DE 3884367D1 DE 88121785 T DE88121785 T DE 88121785T DE 3884367 T DE3884367 T DE 3884367T DE 3884367 D1 DE3884367 D1 DE 3884367D1
Authority
DE
Germany
Prior art keywords
production
fine wire
fine
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88121785T
Other languages
English (en)
Other versions
DE3884367T2 (de
Inventor
Masato Koide
Takuro Iwamura
Tsugio Koya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of DE3884367D1 publication Critical patent/DE3884367D1/de
Application granted granted Critical
Publication of DE3884367T2 publication Critical patent/DE3884367T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
    • C21D8/06—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of rods or wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
    • B21C1/003—Drawing materials of special alloys so far as the composition of the alloy requires or permits special drawing methods or sequences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
    • B21C37/047—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire of fine wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/745—Apparatus for manufacturing wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Metal Extraction Processes (AREA)
DE88121785T 1987-12-28 1988-12-28 Verfahren zur Herstellung von Feinstdraht. Expired - Fee Related DE3884367T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62335842A JPH084837B2 (ja) 1987-12-28 1987-12-28 極細線の製造方法

Publications (2)

Publication Number Publication Date
DE3884367D1 true DE3884367D1 (de) 1993-10-28
DE3884367T2 DE3884367T2 (de) 1994-02-24

Family

ID=18293007

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88121785T Expired - Fee Related DE3884367T2 (de) 1987-12-28 1988-12-28 Verfahren zur Herstellung von Feinstdraht.

Country Status (5)

Country Link
US (1) US4901550A (de)
EP (1) EP0322889B1 (de)
JP (1) JPH084837B2 (de)
KR (1) KR950004433B1 (de)
DE (1) DE3884367T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111659750A (zh) * 2020-05-22 2020-09-15 李鑫 一种高耐用性镍铬电阻丝的制备工艺

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19517803A1 (de) * 1995-05-15 1996-11-21 Linde Ag Verfahren und Vorrichtung zum Verformen von kältezähem, metallischem Material
WO2001085368A1 (en) 2000-05-09 2001-11-15 Usf Filtration And Separations Group, Inc. Apparatus and method for drawing continuous fiber
JP3765778B2 (ja) * 2002-08-29 2006-04-12 ローム株式会社 ワイヤボンディング用キャピラリ及びこれを用いたワイヤボンディング方法
US8617965B1 (en) 2004-02-19 2013-12-31 Partial Assignment to University of Central Florida Apparatus and method of forming high crystalline quality layer
US7618880B1 (en) * 2004-02-19 2009-11-17 Quick Nathaniel R Apparatus and method for transformation of substrate
US7268063B1 (en) * 2004-06-01 2007-09-11 University Of Central Florida Process for fabricating semiconductor component
US7419887B1 (en) * 2004-07-26 2008-09-02 Quick Nathaniel R Laser assisted nano deposition
US7951632B1 (en) 2005-01-26 2011-05-31 University Of Central Florida Optical device and method of making
US7811914B1 (en) 2006-04-20 2010-10-12 Quick Nathaniel R Apparatus and method for increasing thermal conductivity of a substrate
US8617669B1 (en) 2006-04-20 2013-12-31 Partial Assignment to University of Central Florida Laser formation of graphene
US8067303B1 (en) 2006-09-12 2011-11-29 Partial Assignment University of Central Florida Solid state energy conversion device
US8114693B1 (en) 2007-09-18 2012-02-14 Partial Assignment University of Central Florida Method of fabricating solid state gas dissociating device by laser doping
US20100269961A1 (en) * 2007-10-03 2010-10-28 Ke Han Method and apparatus for making high strength metals with a face-centered-cubic structure
CA2745634A1 (en) * 2008-12-02 2010-06-10 University Of Central Florida Energy conversion device
TW201028240A (en) * 2009-01-23 2010-08-01 jun-de Li Composite bonding wire manufacturing method and product thereof
KR101253822B1 (ko) 2010-05-06 2013-04-12 주식회사 포스코 초미세립 고강도 고인성 선재 및 그 제조방법
KR101359114B1 (ko) * 2012-06-25 2014-02-06 주식회사 포스코 고탄소 강선 제조장치 및 제조방법
US9059079B1 (en) 2012-09-26 2015-06-16 Ut-Battelle, Llc Processing of insulators and semiconductors
US9620667B1 (en) 2013-12-10 2017-04-11 AppliCote Associates LLC Thermal doping of materials
US9601641B1 (en) 2013-12-10 2017-03-21 AppliCote Associates, LLC Ultra-high pressure doping of materials
JP6524444B2 (ja) * 2015-09-28 2019-06-05 日本製鉄株式会社 鋼伸線材の冷却方法、鋼伸線材の冷却装置及び鋼線材の伸線装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1008808A (en) * 1911-06-23 1911-11-14 Karl Farkas Method of drawing fine wires of refractory metals.
US2165056A (en) * 1937-11-27 1939-07-04 Westinghouse Electric & Mfg Co Method for drawing small diameter wires
US2203064A (en) * 1938-04-18 1940-06-04 Continental Steel Corp Method of and apparatus for treating and drawing wire
US2974778A (en) * 1951-09-12 1961-03-14 Bell Telephone Labor Inc Low temperature drawing of metal wires
US3826690A (en) * 1971-02-25 1974-07-30 Western Electric Co Method of processing aluminum electrical conductors
SU515805A1 (ru) * 1972-05-04 1976-05-30 Волгоградский Сталепроволоччно-Канатный Завод Способ изготовлени проволоки из углеродистых сталей
SU534812A1 (ru) * 1974-06-06 1976-11-05 Государственное Специальное Конструкторское Бюро Теплофизического Приборостроения Способ изготовлени ветвей термоэлементов
US3941619A (en) * 1975-05-12 1976-03-02 Olin Corporation Process for improving the elongation of grain refined copper base alloys containing zinc and aluminum
US4204885A (en) * 1979-03-21 1980-05-27 Union Carbide Corporation Method for providing strong wire
DE2931939C2 (de) * 1979-08-07 1982-07-08 Felten & Guilleaume Carlswerk AG, 5000 Köln Verfahren und Vorrichtung zur Herstellung stark verzinnter Kupferdrähte, insbesondere Schaltdrähte
US4574604A (en) * 1984-11-13 1986-03-11 Essex Group, Inc. Process and apparatus for high speed fabrication of copper wire

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111659750A (zh) * 2020-05-22 2020-09-15 李鑫 一种高耐用性镍铬电阻丝的制备工艺
CN111659750B (zh) * 2020-05-22 2022-01-25 深圳市霆茂电子有限公司 一种高耐用性镍铬电阻丝的制备工艺

Also Published As

Publication number Publication date
KR890010938A (ko) 1989-08-11
JPH01180717A (ja) 1989-07-18
EP0322889B1 (de) 1993-09-22
EP0322889A3 (en) 1990-09-12
EP0322889A2 (de) 1989-07-05
DE3884367T2 (de) 1994-02-24
JPH084837B2 (ja) 1996-01-24
US4901550A (en) 1990-02-20
KR950004433B1 (ko) 1995-05-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee