DE3850151D1 - Verfahren zur Herstellung von Mustern. - Google Patents
Verfahren zur Herstellung von Mustern.Info
- Publication number
- DE3850151D1 DE3850151D1 DE3850151T DE3850151T DE3850151D1 DE 3850151 D1 DE3850151 D1 DE 3850151D1 DE 3850151 T DE3850151 T DE 3850151T DE 3850151 T DE3850151 T DE 3850151T DE 3850151 D1 DE3850151 D1 DE 3850151D1
- Authority
- DE
- Germany
- Prior art keywords
- samples
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62053302A JP2553545B2 (ja) | 1987-03-09 | 1987-03-09 | パタ−ン形成方法 |
JP62309055A JP2653072B2 (ja) | 1987-12-07 | 1987-12-07 | パターン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3850151D1 true DE3850151D1 (de) | 1994-07-21 |
DE3850151T2 DE3850151T2 (de) | 1995-01-12 |
Family
ID=26394017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3850151T Expired - Fee Related DE3850151T2 (de) | 1987-03-09 | 1988-02-24 | Verfahren zur Herstellung von Mustern. |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0282201B1 (de) |
KR (1) | KR920003315B1 (de) |
DE (1) | DE3850151T2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0394738A3 (de) * | 1989-04-24 | 1991-03-27 | Siemens Aktiengesellschaft | Vereinfachtes Mehrlagenphotoresistsystem |
JP2544006B2 (ja) * | 1990-06-14 | 1996-10-16 | 株式会社東芝 | 半導体装置の製造方法 |
EP0559934A1 (de) * | 1992-03-11 | 1993-09-15 | International Business Machines Corporation | Verfahren und Vorrichtung zur Strukturerzeugung mit Bildumkehr für tiefes UV |
KR0172237B1 (ko) * | 1995-06-26 | 1999-03-30 | 김주용 | 반도체 소자의 미세패턴 형성방법 |
JP2004283065A (ja) * | 2003-03-20 | 2004-10-14 | Ushio Inc | 化学走性機能制御膜の製造方法および人工材料並びに人工材料の製造方法 |
CN101312113B (zh) * | 2007-05-23 | 2010-06-16 | 中芯国际集成电路制造(上海)有限公司 | 图形的形成方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3784378A (en) * | 1971-10-18 | 1974-01-08 | Du Pont | Double-exposure method for producing reverse images in photopolymers |
DE3248246A1 (de) * | 1982-12-28 | 1984-06-28 | Basf Ag, 6700 Ludwigshafen | Positiv arbeitendes verfahren zur herstellung von relief- und druckformen |
JPH0715870B2 (ja) * | 1983-11-12 | 1995-02-22 | 富士通株式会社 | パターン形成方法 |
DE3582491D1 (de) * | 1984-08-13 | 1991-05-16 | Ncr Co | Verfahren zur herstellung von dessinierten photoschutzlackschichten. |
US4810601A (en) * | 1984-12-07 | 1989-03-07 | International Business Machines Corporation | Top imaged resists |
-
1988
- 1988-02-24 DE DE3850151T patent/DE3850151T2/de not_active Expired - Fee Related
- 1988-02-24 EP EP88301564A patent/EP0282201B1/de not_active Expired - Lifetime
- 1988-03-08 KR KR1019880002382A patent/KR920003315B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0282201A2 (de) | 1988-09-14 |
EP0282201A3 (de) | 1991-04-10 |
DE3850151T2 (de) | 1995-01-12 |
EP0282201B1 (de) | 1994-06-15 |
KR920003315B1 (ko) | 1992-04-27 |
KR880011900A (ko) | 1988-10-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |