EP0559934A1 - Verfahren und Vorrichtung zur Strukturerzeugung mit Bildumkehr für tiefes UV - Google Patents

Verfahren und Vorrichtung zur Strukturerzeugung mit Bildumkehr für tiefes UV Download PDF

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Publication number
EP0559934A1
EP0559934A1 EP92104161A EP92104161A EP0559934A1 EP 0559934 A1 EP0559934 A1 EP 0559934A1 EP 92104161 A EP92104161 A EP 92104161A EP 92104161 A EP92104161 A EP 92104161A EP 0559934 A1 EP0559934 A1 EP 0559934A1
Authority
EP
European Patent Office
Prior art keywords
photoresist
deep
photoresist layer
light
illuminating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP92104161A
Other languages
English (en)
French (fr)
Inventor
Holger Dipl.-Phys. Moritz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to EP92104161A priority Critical patent/EP0559934A1/de
Priority to JP5000072A priority patent/JPH07118442B2/ja
Publication of EP0559934A1 publication Critical patent/EP0559934A1/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
EP92104161A 1992-03-11 1992-03-11 Verfahren und Vorrichtung zur Strukturerzeugung mit Bildumkehr für tiefes UV Withdrawn EP0559934A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP92104161A EP0559934A1 (de) 1992-03-11 1992-03-11 Verfahren und Vorrichtung zur Strukturerzeugung mit Bildumkehr für tiefes UV
JP5000072A JPH07118442B2 (ja) 1992-03-11 1993-01-04 リソグラフィ・パターニング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP92104161A EP0559934A1 (de) 1992-03-11 1992-03-11 Verfahren und Vorrichtung zur Strukturerzeugung mit Bildumkehr für tiefes UV

Publications (1)

Publication Number Publication Date
EP0559934A1 true EP0559934A1 (de) 1993-09-15

Family

ID=8209420

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92104161A Withdrawn EP0559934A1 (de) 1992-03-11 1992-03-11 Verfahren und Vorrichtung zur Strukturerzeugung mit Bildumkehr für tiefes UV

Country Status (2)

Country Link
EP (1) EP0559934A1 (de)
JP (1) JPH07118442B2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6221777B1 (en) 1999-06-09 2001-04-24 Advanced Micro Devices, Inc. Reverse lithographic process for semiconductor vias
US6277544B1 (en) * 1999-06-09 2001-08-21 Advanced Micro Devices, Inc. Reverse lithographic process for semiconductor spaces

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101983672B1 (ko) 2012-11-07 2019-05-30 삼성전자 주식회사 반도체 장치의 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2483639A1 (fr) * 1980-06-03 1981-12-04 Du Pont Procede de traitement de matieres de reproduction photodurcissables
EP0282201A2 (de) * 1987-03-09 1988-09-14 Matsushita Electric Industrial Co., Ltd. Verfahren zur Herstellung von Mustern
EP0394738A2 (de) * 1989-04-24 1990-10-31 Siemens Aktiengesellschaft Vereinfachtes Mehrlagenphotoresistsystem
US5015559A (en) * 1988-07-26 1991-05-14 Matsushita Electric Industrial Co., Ltd. Process for forming a fine resist pattern

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715872B2 (ja) * 1983-11-30 1995-02-22 株式会社東芝 レジストパターン形成方法
JPH0715873B2 (ja) * 1983-11-30 1995-02-22 株式会社東芝 レジストパターン形成方法
JPS60157222A (ja) * 1984-01-27 1985-08-17 Toshiba Corp レジストパタ−ン形成方法及びレジスト処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2483639A1 (fr) * 1980-06-03 1981-12-04 Du Pont Procede de traitement de matieres de reproduction photodurcissables
EP0282201A2 (de) * 1987-03-09 1988-09-14 Matsushita Electric Industrial Co., Ltd. Verfahren zur Herstellung von Mustern
US5015559A (en) * 1988-07-26 1991-05-14 Matsushita Electric Industrial Co., Ltd. Process for forming a fine resist pattern
EP0394738A2 (de) * 1989-04-24 1990-10-31 Siemens Aktiengesellschaft Vereinfachtes Mehrlagenphotoresistsystem

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 007, no. 076 (E-167)(1221) 30 March 1983 & JP-A-58 004 928 ( FUJITSU K.K. ) 12 January 1983 *
PATENT ABSTRACTS OF JAPAN vol. 011, no. 049 (P-547)(2496) 14 February 1987 & JP-A-61 217 040 ( FUJITSU LTD ) 26 September 1986 *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 346 (E-956)26 July 1990 & JP-A-02 119 121 ( FUJITSU LTD ) 7 May 1990 *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 408 (E-1123)17 October 1991 & JP-A-03 169 007 ( NEC CORP. ) 22 July 1991 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6221777B1 (en) 1999-06-09 2001-04-24 Advanced Micro Devices, Inc. Reverse lithographic process for semiconductor vias
US6277544B1 (en) * 1999-06-09 2001-08-21 Advanced Micro Devices, Inc. Reverse lithographic process for semiconductor spaces

Also Published As

Publication number Publication date
JPH0684786A (ja) 1994-03-25
JPH07118442B2 (ja) 1995-12-18

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