DE3811313C2 - - Google Patents

Info

Publication number
DE3811313C2
DE3811313C2 DE3811313A DE3811313A DE3811313C2 DE 3811313 C2 DE3811313 C2 DE 3811313C2 DE 3811313 A DE3811313 A DE 3811313A DE 3811313 A DE3811313 A DE 3811313A DE 3811313 C2 DE3811313 C2 DE 3811313C2
Authority
DE
Germany
Prior art keywords
substrate
housing
thick
metal layer
film pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3811313A
Other languages
German (de)
English (en)
Other versions
DE3811313A1 (de
Inventor
Horst Dipl.-Ing. 8206 Bruckmuehl De Riedelbauch
Siegfried 8016 Feldkirchen De Guber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Messerschmitt Bolkow Blohm AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Messerschmitt Bolkow Blohm AG filed Critical Messerschmitt Bolkow Blohm AG
Priority to DE3811313A priority Critical patent/DE3811313A1/de
Priority to FR8900216A priority patent/FR2629664B1/fr
Publication of DE3811313A1 publication Critical patent/DE3811313A1/de
Application granted granted Critical
Publication of DE3811313C2 publication Critical patent/DE3811313C2/de
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0091Housing specially adapted for small components
    • H05K5/0095Housing specially adapted for small components hermetically-sealed
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H10W70/611
    • H10W70/635
    • H10W76/153
    • H10W90/00
    • H10W72/5449
    • H10W74/00
    • H10W90/754

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Casings For Electric Apparatus (AREA)
DE3811313A 1988-04-02 1988-04-02 Gehaeuse fuer hybrid-schaltungen Granted DE3811313A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE3811313A DE3811313A1 (de) 1988-04-02 1988-04-02 Gehaeuse fuer hybrid-schaltungen
FR8900216A FR2629664B1 (fr) 1988-04-02 1989-01-10 Boitier pour circuits hybrides

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3811313A DE3811313A1 (de) 1988-04-02 1988-04-02 Gehaeuse fuer hybrid-schaltungen

Publications (2)

Publication Number Publication Date
DE3811313A1 DE3811313A1 (de) 1989-10-19
DE3811313C2 true DE3811313C2 (enExample) 1992-12-10

Family

ID=6351355

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3811313A Granted DE3811313A1 (de) 1988-04-02 1988-04-02 Gehaeuse fuer hybrid-schaltungen

Country Status (2)

Country Link
DE (1) DE3811313A1 (enExample)
FR (1) FR2629664B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19516548A1 (de) * 1995-05-05 1996-11-14 Blaupunkt Werke Gmbh Abdeckkappe für elektronisches Bauelement

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2654891A1 (fr) * 1989-11-20 1991-05-24 Alcatel Radiotelephone Blindage pour circuit radiofrequence.
DE3941680A1 (de) * 1989-12-18 1991-06-20 Telefunken Electronic Gmbh Kunststoffgehaeuse fuer elektronische bauteile
US5177595A (en) * 1990-10-29 1993-01-05 Hewlett-Packard Company Microchip with electrical element in sealed cavity
FI109960B (fi) * 1991-09-19 2002-10-31 Nokia Corp Elektroninen laite
DE4345594B4 (de) * 1993-06-14 2011-08-11 EMI-tec Elektronische Materialien GmbH, 12277 Verfahren zur Herstellung eines eine Abschirmung gegen elektromagnetische Abstrahlung aufweisenden Gehäuses
DE4436903C2 (de) * 1994-10-15 2003-10-30 Daimler Chrysler Ag Anordnung zur elektromagnetischen Abschirmung von elektronischen Schaltungen und Verfahren zur Herstellung einer solchen Anordnung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1361176A (en) * 1971-07-05 1974-07-24 Smiths Industries Ltd Electrical devices
CH660258A5 (de) * 1983-01-20 1987-03-31 Landis & Gyr Ag Keramikgehaeuse fuer einen hybridschaltkreis.
DE3527818A1 (de) * 1985-08-02 1987-02-26 Rose Elektrotech Gmbh Gehaeuse fuer einen hybridschaltkreis
DE3604882A1 (de) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung des moduls

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19516548A1 (de) * 1995-05-05 1996-11-14 Blaupunkt Werke Gmbh Abdeckkappe für elektronisches Bauelement

Also Published As

Publication number Publication date
DE3811313A1 (de) 1989-10-19
FR2629664B1 (fr) 1993-12-03
FR2629664A1 (fr) 1989-10-06

Similar Documents

Publication Publication Date Title
US4608592A (en) Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage
DE69027781T2 (de) Packung mit metallstiftmuster und dielektrischer polymerdichtung
JP6837432B2 (ja) 高周波モジュール
US6262477B1 (en) Ball grid array electronic package
DE68910512T2 (de) Bei niedriger temperatur zusammengebrannte keramische packungen für integrierte mikrowellen- und millimeterwellen-galliumarsenid-schaltungen.
EP0302165B1 (de) Verfahren zum Einkapseln von mikroelektronischen Halbleiter- und Schichtschaltungen
DE10013255B4 (de) Harzgekapselte elektronische Vorrichtung zur Verwendung in Brennkraftmaschinen
EP1652232B1 (de) Multichip-Schaltungsmodul und Verfahren zur Herstellung hierzu
DE69028311T2 (de) Mehrlagenleiterrahmen für integrierte schaltungspackungen
EP0642166B1 (de) Auf Leiterplatten oberflächenmontierbares Multichip-Modul
DE102008028757B4 (de) Verfahren zur Herstellung einer Halbleiterchipanordnung
DE19601372A1 (de) Halbleitermodul
DE69923374T2 (de) Halbleitervorrichtung
CA2024784C (en) Stackable multilayer substrate for mounting integrated circuits
DE2248303C2 (de) Halbleiterbauelement
DE3811313C2 (enExample)
EP0592938A1 (de) Verfahren zur Montage und Kontaktierung von elektronischen Bauelementen auf einem isolierenden Träger
DE10329329A1 (de) Kostengünstiges Hochfrequenz-Package
US4818821A (en) Brazed leaded package
DE1952789A1 (de) Luftdichte Kapselung fuer elektronische Bauelemente
JP2009295661A (ja) セラミック配線基板およびその製造方法
DE10303103A1 (de) Mikroelektronisches Bauteil
DE10029269B4 (de) Verfahren zur Herstellung eines elektronischen Bauteiles aus gehäusebildenden Substraten
DE3412296C2 (enExample)
EP2033219A1 (de) Leistungsgehäuse für halbleiterchips und deren anordnung zur wärmeabfuhr

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8327 Change in the person/name/address of the patent owner

Owner name: DEUTSCHE AEROSPACE AG, 8000 MUENCHEN, DE

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILB

8339 Ceased/non-payment of the annual fee