DE3811313C2 - - Google Patents
Info
- Publication number
- DE3811313C2 DE3811313C2 DE3811313A DE3811313A DE3811313C2 DE 3811313 C2 DE3811313 C2 DE 3811313C2 DE 3811313 A DE3811313 A DE 3811313A DE 3811313 A DE3811313 A DE 3811313A DE 3811313 C2 DE3811313 C2 DE 3811313C2
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- housing
- thick
- metal layer
- film pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H10W70/611—
-
- H10W70/635—
-
- H10W76/153—
-
- H10W90/00—
-
- H10W72/5449—
-
- H10W74/00—
-
- H10W90/754—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3811313A DE3811313A1 (de) | 1988-04-02 | 1988-04-02 | Gehaeuse fuer hybrid-schaltungen |
| FR8900216A FR2629664B1 (fr) | 1988-04-02 | 1989-01-10 | Boitier pour circuits hybrides |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3811313A DE3811313A1 (de) | 1988-04-02 | 1988-04-02 | Gehaeuse fuer hybrid-schaltungen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3811313A1 DE3811313A1 (de) | 1989-10-19 |
| DE3811313C2 true DE3811313C2 (enExample) | 1992-12-10 |
Family
ID=6351355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3811313A Granted DE3811313A1 (de) | 1988-04-02 | 1988-04-02 | Gehaeuse fuer hybrid-schaltungen |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE3811313A1 (enExample) |
| FR (1) | FR2629664B1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19516548A1 (de) * | 1995-05-05 | 1996-11-14 | Blaupunkt Werke Gmbh | Abdeckkappe für elektronisches Bauelement |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2654891A1 (fr) * | 1989-11-20 | 1991-05-24 | Alcatel Radiotelephone | Blindage pour circuit radiofrequence. |
| DE3941680A1 (de) * | 1989-12-18 | 1991-06-20 | Telefunken Electronic Gmbh | Kunststoffgehaeuse fuer elektronische bauteile |
| US5177595A (en) * | 1990-10-29 | 1993-01-05 | Hewlett-Packard Company | Microchip with electrical element in sealed cavity |
| FI109960B (fi) * | 1991-09-19 | 2002-10-31 | Nokia Corp | Elektroninen laite |
| DE4345594B4 (de) * | 1993-06-14 | 2011-08-11 | EMI-tec Elektronische Materialien GmbH, 12277 | Verfahren zur Herstellung eines eine Abschirmung gegen elektromagnetische Abstrahlung aufweisenden Gehäuses |
| DE4436903C2 (de) * | 1994-10-15 | 2003-10-30 | Daimler Chrysler Ag | Anordnung zur elektromagnetischen Abschirmung von elektronischen Schaltungen und Verfahren zur Herstellung einer solchen Anordnung |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1361176A (en) * | 1971-07-05 | 1974-07-24 | Smiths Industries Ltd | Electrical devices |
| CH660258A5 (de) * | 1983-01-20 | 1987-03-31 | Landis & Gyr Ag | Keramikgehaeuse fuer einen hybridschaltkreis. |
| DE3527818A1 (de) * | 1985-08-02 | 1987-02-26 | Rose Elektrotech Gmbh | Gehaeuse fuer einen hybridschaltkreis |
| DE3604882A1 (de) * | 1986-02-15 | 1987-08-20 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul und verfahren zur herstellung des moduls |
-
1988
- 1988-04-02 DE DE3811313A patent/DE3811313A1/de active Granted
-
1989
- 1989-01-10 FR FR8900216A patent/FR2629664B1/fr not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19516548A1 (de) * | 1995-05-05 | 1996-11-14 | Blaupunkt Werke Gmbh | Abdeckkappe für elektronisches Bauelement |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3811313A1 (de) | 1989-10-19 |
| FR2629664B1 (fr) | 1993-12-03 |
| FR2629664A1 (fr) | 1989-10-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4608592A (en) | Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage | |
| DE69027781T2 (de) | Packung mit metallstiftmuster und dielektrischer polymerdichtung | |
| JP6837432B2 (ja) | 高周波モジュール | |
| US6262477B1 (en) | Ball grid array electronic package | |
| DE68910512T2 (de) | Bei niedriger temperatur zusammengebrannte keramische packungen für integrierte mikrowellen- und millimeterwellen-galliumarsenid-schaltungen. | |
| EP0302165B1 (de) | Verfahren zum Einkapseln von mikroelektronischen Halbleiter- und Schichtschaltungen | |
| DE10013255B4 (de) | Harzgekapselte elektronische Vorrichtung zur Verwendung in Brennkraftmaschinen | |
| EP1652232B1 (de) | Multichip-Schaltungsmodul und Verfahren zur Herstellung hierzu | |
| DE69028311T2 (de) | Mehrlagenleiterrahmen für integrierte schaltungspackungen | |
| EP0642166B1 (de) | Auf Leiterplatten oberflächenmontierbares Multichip-Modul | |
| DE102008028757B4 (de) | Verfahren zur Herstellung einer Halbleiterchipanordnung | |
| DE19601372A1 (de) | Halbleitermodul | |
| DE69923374T2 (de) | Halbleitervorrichtung | |
| CA2024784C (en) | Stackable multilayer substrate for mounting integrated circuits | |
| DE2248303C2 (de) | Halbleiterbauelement | |
| DE3811313C2 (enExample) | ||
| EP0592938A1 (de) | Verfahren zur Montage und Kontaktierung von elektronischen Bauelementen auf einem isolierenden Träger | |
| DE10329329A1 (de) | Kostengünstiges Hochfrequenz-Package | |
| US4818821A (en) | Brazed leaded package | |
| DE1952789A1 (de) | Luftdichte Kapselung fuer elektronische Bauelemente | |
| JP2009295661A (ja) | セラミック配線基板およびその製造方法 | |
| DE10303103A1 (de) | Mikroelektronisches Bauteil | |
| DE10029269B4 (de) | Verfahren zur Herstellung eines elektronischen Bauteiles aus gehäusebildenden Substraten | |
| DE3412296C2 (enExample) | ||
| EP2033219A1 (de) | Leistungsgehäuse für halbleiterchips und deren anordnung zur wärmeabfuhr |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: DEUTSCHE AEROSPACE AG, 8000 MUENCHEN, DE |
|
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILB |
|
| 8339 | Ceased/non-payment of the annual fee |