FR2629664B1 - Boitier pour circuits hybrides - Google Patents

Boitier pour circuits hybrides

Info

Publication number
FR2629664B1
FR2629664B1 FR8900216A FR8900216A FR2629664B1 FR 2629664 B1 FR2629664 B1 FR 2629664B1 FR 8900216 A FR8900216 A FR 8900216A FR 8900216 A FR8900216 A FR 8900216A FR 2629664 B1 FR2629664 B1 FR 2629664B1
Authority
FR
France
Prior art keywords
housing
substrate
circuits
thick
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8900216A
Other languages
English (en)
French (fr)
Other versions
FR2629664A1 (fr
Inventor
Riedelbauch Horst
Guber Siegfried
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Defence and Space GmbH
Original Assignee
Messerschmitt Bolkow Blohm AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Messerschmitt Bolkow Blohm AG filed Critical Messerschmitt Bolkow Blohm AG
Publication of FR2629664A1 publication Critical patent/FR2629664A1/fr
Application granted granted Critical
Publication of FR2629664B1 publication Critical patent/FR2629664B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H10W70/611—
    • H10W70/635—
    • H10W76/153—
    • H10W90/00—
    • H10W72/5449—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Casings For Electric Apparatus (AREA)
FR8900216A 1988-04-02 1989-01-10 Boitier pour circuits hybrides Expired - Fee Related FR2629664B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3811313A DE3811313A1 (de) 1988-04-02 1988-04-02 Gehaeuse fuer hybrid-schaltungen

Publications (2)

Publication Number Publication Date
FR2629664A1 FR2629664A1 (fr) 1989-10-06
FR2629664B1 true FR2629664B1 (fr) 1993-12-03

Family

ID=6351355

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8900216A Expired - Fee Related FR2629664B1 (fr) 1988-04-02 1989-01-10 Boitier pour circuits hybrides

Country Status (2)

Country Link
DE (1) DE3811313A1 (enExample)
FR (1) FR2629664B1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2654891A1 (fr) * 1989-11-20 1991-05-24 Alcatel Radiotelephone Blindage pour circuit radiofrequence.
DE3941680A1 (de) * 1989-12-18 1991-06-20 Telefunken Electronic Gmbh Kunststoffgehaeuse fuer elektronische bauteile
US5177595A (en) * 1990-10-29 1993-01-05 Hewlett-Packard Company Microchip with electrical element in sealed cavity
FI109960B (fi) * 1991-09-19 2002-10-31 Nokia Corp Elektroninen laite
DE4345594B4 (de) * 1993-06-14 2011-08-11 EMI-tec Elektronische Materialien GmbH, 12277 Verfahren zur Herstellung eines eine Abschirmung gegen elektromagnetische Abstrahlung aufweisenden Gehäuses
DE4436903C2 (de) * 1994-10-15 2003-10-30 Daimler Chrysler Ag Anordnung zur elektromagnetischen Abschirmung von elektronischen Schaltungen und Verfahren zur Herstellung einer solchen Anordnung
DE19516548A1 (de) * 1995-05-05 1996-11-14 Blaupunkt Werke Gmbh Abdeckkappe für elektronisches Bauelement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1361176A (en) * 1971-07-05 1974-07-24 Smiths Industries Ltd Electrical devices
CH660258A5 (de) * 1983-01-20 1987-03-31 Landis & Gyr Ag Keramikgehaeuse fuer einen hybridschaltkreis.
DE3527818A1 (de) * 1985-08-02 1987-02-26 Rose Elektrotech Gmbh Gehaeuse fuer einen hybridschaltkreis
DE3604882A1 (de) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung des moduls

Also Published As

Publication number Publication date
DE3811313A1 (de) 1989-10-19
FR2629664A1 (fr) 1989-10-06
DE3811313C2 (enExample) 1992-12-10

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Legal Events

Date Code Title Description
CA Change of address
CD Change of name or company name
ST Notification of lapse
CA Change of address
CD Change of name or company name