JPS5793551A - Electronic device - Google Patents

Electronic device

Info

Publication number
JPS5793551A
JPS5793551A JP17041980A JP17041980A JPS5793551A JP S5793551 A JPS5793551 A JP S5793551A JP 17041980 A JP17041980 A JP 17041980A JP 17041980 A JP17041980 A JP 17041980A JP S5793551 A JPS5793551 A JP S5793551A
Authority
JP
Japan
Prior art keywords
container
cover member
sealed
welding
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17041980A
Other languages
Japanese (ja)
Inventor
Masato Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP17041980A priority Critical patent/JPS5793551A/en
Publication of JPS5793551A publication Critical patent/JPS5793551A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Abstract

PURPOSE:To provide an electronic device adapted for a laser beam having good workability capable of uniformly and stably welding without defecting an element sealed in the device contained in a metallic container sealed by a laser beam welding. CONSTITUTION:A container member 210 has a stem side wall 202, and an externally led lead 203 is sealed to a stem substrate via a glass insulator 204. A hybrid integrated circuit 140 carrying a hybrid integrated circuit board 131 with an electronic part 132 is bonded fixedly to the center of the container material, and the circuit is connected via a fine lead wire 133 to the lead 203. A cover member 220 of a container is contacted via a step 270 with the inner surface. Accordingly, the cover member 220 and the side wall 202 are formed in the same plane on the upper surfaces, and the welding lines are all directed in the same direction. The cover member and the container material are welded here.
JP17041980A 1980-12-03 1980-12-03 Electronic device Pending JPS5793551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17041980A JPS5793551A (en) 1980-12-03 1980-12-03 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17041980A JPS5793551A (en) 1980-12-03 1980-12-03 Electronic device

Publications (1)

Publication Number Publication Date
JPS5793551A true JPS5793551A (en) 1982-06-10

Family

ID=15904569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17041980A Pending JPS5793551A (en) 1980-12-03 1980-12-03 Electronic device

Country Status (1)

Country Link
JP (1) JPS5793551A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594060A (en) * 1982-06-30 1984-01-10 Fujitsu Ltd Semiconductor device
JPH06152296A (en) * 1992-11-13 1994-05-31 Nikko Electron Kk Production of piezo-electric device
JP2003500840A (en) * 1999-05-12 2003-01-07 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Electrical equipment
JP2013185604A (en) * 2012-03-06 2013-09-19 Fuji Koki Corp Control valve
CN103515327A (en) * 2013-09-30 2014-01-15 安徽华东光电技术研究所 Kovar metal structure for laser seal welding and laser welding method
JP2020056759A (en) * 2018-10-04 2020-04-09 カシオ計算機株式会社 Case and watch

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5323586A (en) * 1976-08-17 1978-03-04 Seikosha Kk Airtight terminal
JPS5639188A (en) * 1979-09-05 1981-04-14 Toshiba Corp Welding methos of vessel
JPS5636144B2 (en) * 1977-08-17 1981-08-21

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5323586A (en) * 1976-08-17 1978-03-04 Seikosha Kk Airtight terminal
JPS5636144B2 (en) * 1977-08-17 1981-08-21
JPS5639188A (en) * 1979-09-05 1981-04-14 Toshiba Corp Welding methos of vessel

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594060A (en) * 1982-06-30 1984-01-10 Fujitsu Ltd Semiconductor device
EP0098176A2 (en) * 1982-06-30 1984-01-11 Fujitsu Limited The packaging of semiconductor chips
EP0098176A3 (en) * 1982-06-30 1985-09-25 Fujitsu Limited The packaging of semiconductor chips
JPH06152296A (en) * 1992-11-13 1994-05-31 Nikko Electron Kk Production of piezo-electric device
JP2003500840A (en) * 1999-05-12 2003-01-07 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Electrical equipment
JP2013185604A (en) * 2012-03-06 2013-09-19 Fuji Koki Corp Control valve
CN103515327A (en) * 2013-09-30 2014-01-15 安徽华东光电技术研究所 Kovar metal structure for laser seal welding and laser welding method
JP2020056759A (en) * 2018-10-04 2020-04-09 カシオ計算機株式会社 Case and watch

Similar Documents

Publication Publication Date Title
JPS56105643A (en) Method of assembling container with semiconductor device
JPS5793551A (en) Electronic device
GB2111746B (en) Semiconductor package
DE69018077T2 (en) SODIUM / SULFUR CELL WITH A CERAMIC AND A METALLIC PART CONNECTED.
JPS5618448A (en) Composite electronic part
JPS5632749A (en) Manufacture of semiconductor device
FR2629664B1 (en) HOUSING FOR HYBRID CIRCUITS
JPS6450595A (en) Connection of semiconductor device
JPS6489350A (en) Package for containing semiconductor element
JPS59132633A (en) Semiconductor device
JPS5623755A (en) Assembly of semiconductor device
JPS6489356A (en) Hybrid integrated circuit
JPS644053A (en) Semiconductor device
JPS5852718Y2 (en) airtight enclosure
JPS646562A (en) Airtight sealing
JPS57100751A (en) Metallic container for semiconductor device
JPS56101761A (en) Airtight package for integrated circuit
JPS57112054A (en) Semiconductor device
JPS6421945A (en) Electronic element mounting module
JPS5758370A (en) Photo device
SU1170530A2 (en) Container for encapsulating semiconductor devices
JPS572537A (en) Semiconductor device
JPS5633863A (en) Semiconductor device
LUCE Delidding and resealing hybrid microelectronic packages[Final Report, 15 Feb. 1980- 15 Dec. 1981]
JPS5730354A (en) Enclosure for semiconductor device