JPS5639188A - Welding methos of vessel - Google Patents

Welding methos of vessel

Info

Publication number
JPS5639188A
JPS5639188A JP11281379A JP11281379A JPS5639188A JP S5639188 A JPS5639188 A JP S5639188A JP 11281379 A JP11281379 A JP 11281379A JP 11281379 A JP11281379 A JP 11281379A JP S5639188 A JPS5639188 A JP S5639188A
Authority
JP
Japan
Prior art keywords
flange
projection
welding
base
vessel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11281379A
Other languages
Japanese (ja)
Other versions
JPS577835B2 (en
Inventor
Ken Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11281379A priority Critical patent/JPS5639188A/en
Publication of JPS5639188A publication Critical patent/JPS5639188A/en
Publication of JPS577835B2 publication Critical patent/JPS577835B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To enable laser beam welding in excellent manner, by providing the butt part in which the flange is inserted to the base outer circumference, in welding the cover shape vessel having flange for lower end to the base. CONSTITUTION:The crack produced when the cover of vessel shape is laser-beam- welded to the base having the glass hermetic part and the lead wire, is avoided. For example, the ring shape projection 9 is provided for the base 3. The inner diameter of the projection 9 is taken slightly greater than the outer diameter of the ring shape flange 5. The cover 4 is inserted inside the projection 9 and the laser oscillator 6 and the condenser lens 8 are located so that the laser beam 7 vertically radiates on the boundary between the flange 5 and the projection 9. The heat incoming to the base 3 by welding is kept low at the projection 9 and excellent welding can be made. Further, the ring shape concave groove 10 can be formed in place of flange 5.
JP11281379A 1979-09-05 1979-09-05 Welding methos of vessel Granted JPS5639188A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11281379A JPS5639188A (en) 1979-09-05 1979-09-05 Welding methos of vessel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11281379A JPS5639188A (en) 1979-09-05 1979-09-05 Welding methos of vessel

Publications (2)

Publication Number Publication Date
JPS5639188A true JPS5639188A (en) 1981-04-14
JPS577835B2 JPS577835B2 (en) 1982-02-13

Family

ID=14596167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11281379A Granted JPS5639188A (en) 1979-09-05 1979-09-05 Welding methos of vessel

Country Status (1)

Country Link
JP (1) JPS5639188A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5793551A (en) * 1980-12-03 1982-06-10 Nec Corp Electronic device
JPS58201325A (en) * 1982-05-20 1983-11-24 Fujitsu Ltd Sealing method of ceramic package
JPS594060A (en) * 1982-06-30 1984-01-10 Fujitsu Ltd Semiconductor device
JPS60137583A (en) * 1983-12-27 1985-07-22 Fujitsu Ltd Production of aluminum alloy package
JP2016136642A (en) * 2011-04-07 2016-07-28 エイヴィーエックス コーポレイション Housing configuration for solid electrolytic capacitor assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5127414A (en) * 1974-08-30 1976-03-08 Toyo Electric Mfg Co Ltd

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5127414A (en) * 1974-08-30 1976-03-08 Toyo Electric Mfg Co Ltd

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5793551A (en) * 1980-12-03 1982-06-10 Nec Corp Electronic device
JPS58201325A (en) * 1982-05-20 1983-11-24 Fujitsu Ltd Sealing method of ceramic package
JPH0419708B2 (en) * 1982-05-20 1992-03-31 Fujitsu Ltd
JPS594060A (en) * 1982-06-30 1984-01-10 Fujitsu Ltd Semiconductor device
JPS60137583A (en) * 1983-12-27 1985-07-22 Fujitsu Ltd Production of aluminum alloy package
JP2016136642A (en) * 2011-04-07 2016-07-28 エイヴィーエックス コーポレイション Housing configuration for solid electrolytic capacitor assembly

Also Published As

Publication number Publication date
JPS577835B2 (en) 1982-02-13

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