GB1361176A - Electrical devices - Google Patents
Electrical devicesInfo
- Publication number
- GB1361176A GB1361176A GB1585170A GB1585170A GB1361176A GB 1361176 A GB1361176 A GB 1361176A GB 1585170 A GB1585170 A GB 1585170A GB 1585170 A GB1585170 A GB 1585170A GB 1361176 A GB1361176 A GB 1361176A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- cup
- solder
- platform
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
Abstract
1361176 Soldering SMITHS INDUSTRIES Ltd 5 July 1971 [3 April 1970] 15851/70 Heading B3R [Also in Division H1] An encapsulating metal, e.g. tin cup 16 is bonded to a metal film on a circuit substrate 10 by means of solder 18 on the film around the periphery of the substrate (see Fig. 1, not shown). The cup is joined to the substrate by placing the substrate on a platform 30 which heats strip 18 to about 100‹ C. Cup 16 is then placed on top of the substrate and urged into contact with it by a spring loaded pad 33. A heated element 34 is brought down on to the upper rim of cup 16 so that the solder on strip 18 melts. Upon solidification a gas tight seal is thus formed between the cup and substrate. Platform 30 is composed of a low and high thermal conductivity sections 31, 32 respectively. The above process is performed in an inert atmosphere, e.g. of nitrogen.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1585170A GB1361176A (en) | 1971-07-05 | 1971-07-05 | Electrical devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1585170A GB1361176A (en) | 1971-07-05 | 1971-07-05 | Electrical devices |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1361176A true GB1361176A (en) | 1974-07-24 |
Family
ID=10066676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1585170A Expired GB1361176A (en) | 1971-07-05 | 1971-07-05 | Electrical devices |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1361176A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2512316A1 (en) * | 1981-09-02 | 1983-03-04 | Burr Brown Res Corp | HEATABLE PREFORM, METHOD AND APPARATUS FOR SEALING A HOUSING A HOUSING CONTAINING ELECTRONIC COMPONENTS |
FR2629664A1 (en) * | 1988-04-02 | 1989-10-06 | Messerschmitt Boelkow Blohm | HOUSING FOR HYBRID CIRCUITS |
-
1971
- 1971-07-05 GB GB1585170A patent/GB1361176A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2512316A1 (en) * | 1981-09-02 | 1983-03-04 | Burr Brown Res Corp | HEATABLE PREFORM, METHOD AND APPARATUS FOR SEALING A HOUSING A HOUSING CONTAINING ELECTRONIC COMPONENTS |
FR2629664A1 (en) * | 1988-04-02 | 1989-10-06 | Messerschmitt Boelkow Blohm | HOUSING FOR HYBRID CIRCUITS |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |