GB1361176A - Electrical devices - Google Patents

Electrical devices

Info

Publication number
GB1361176A
GB1361176A GB1585170A GB1585170A GB1361176A GB 1361176 A GB1361176 A GB 1361176A GB 1585170 A GB1585170 A GB 1585170A GB 1585170 A GB1585170 A GB 1585170A GB 1361176 A GB1361176 A GB 1361176A
Authority
GB
United Kingdom
Prior art keywords
substrate
cup
solder
platform
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1585170A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smiths Group PLC
Original Assignee
Smiths Group PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smiths Group PLC filed Critical Smiths Group PLC
Priority to GB1585170A priority Critical patent/GB1361176A/en
Publication of GB1361176A publication Critical patent/GB1361176A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings

Abstract

1361176 Soldering SMITHS INDUSTRIES Ltd 5 July 1971 [3 April 1970] 15851/70 Heading B3R [Also in Division H1] An encapsulating metal, e.g. tin cup 16 is bonded to a metal film on a circuit substrate 10 by means of solder 18 on the film around the periphery of the substrate (see Fig. 1, not shown). The cup is joined to the substrate by placing the substrate on a platform 30 which heats strip 18 to about 100‹ C. Cup 16 is then placed on top of the substrate and urged into contact with it by a spring loaded pad 33. A heated element 34 is brought down on to the upper rim of cup 16 so that the solder on strip 18 melts. Upon solidification a gas tight seal is thus formed between the cup and substrate. Platform 30 is composed of a low and high thermal conductivity sections 31, 32 respectively. The above process is performed in an inert atmosphere, e.g. of nitrogen.
GB1585170A 1971-07-05 1971-07-05 Electrical devices Expired GB1361176A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1585170A GB1361176A (en) 1971-07-05 1971-07-05 Electrical devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1585170A GB1361176A (en) 1971-07-05 1971-07-05 Electrical devices

Publications (1)

Publication Number Publication Date
GB1361176A true GB1361176A (en) 1974-07-24

Family

ID=10066676

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1585170A Expired GB1361176A (en) 1971-07-05 1971-07-05 Electrical devices

Country Status (1)

Country Link
GB (1) GB1361176A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2512316A1 (en) * 1981-09-02 1983-03-04 Burr Brown Res Corp HEATABLE PREFORM, METHOD AND APPARATUS FOR SEALING A HOUSING A HOUSING CONTAINING ELECTRONIC COMPONENTS
FR2629664A1 (en) * 1988-04-02 1989-10-06 Messerschmitt Boelkow Blohm HOUSING FOR HYBRID CIRCUITS

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2512316A1 (en) * 1981-09-02 1983-03-04 Burr Brown Res Corp HEATABLE PREFORM, METHOD AND APPARATUS FOR SEALING A HOUSING A HOUSING CONTAINING ELECTRONIC COMPONENTS
FR2629664A1 (en) * 1988-04-02 1989-10-06 Messerschmitt Boelkow Blohm HOUSING FOR HYBRID CIRCUITS

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees