DE3412296C2 - - Google Patents

Info

Publication number
DE3412296C2
DE3412296C2 DE3412296A DE3412296A DE3412296C2 DE 3412296 C2 DE3412296 C2 DE 3412296C2 DE 3412296 A DE3412296 A DE 3412296A DE 3412296 A DE3412296 A DE 3412296A DE 3412296 C2 DE3412296 C2 DE 3412296C2
Authority
DE
Germany
Prior art keywords
film
hybrid circuit
components
plastic
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3412296A
Other languages
German (de)
English (en)
Other versions
DE3412296A1 (de
Inventor
Conrad Dipl.-Phys. Dr. 6901 Gaiberg De Schmidt
Henning Dipl.-Phys. Dr. 6922 Mauer De Oetzmann
Hartwig Dipl.-Phys. 6806 Viernheim De Gernoth
Hans-Joachim Dipl.-Phys. Dr. 6907 Nussloch De Krokoszinski
Dieter Dipl.-Ing. 6840 Lampertheim De Gilbers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB AG Germany
Original Assignee
Asea Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Brown Boveri AG Germany filed Critical Asea Brown Boveri AG Germany
Priority to DE19843412296 priority Critical patent/DE3412296A1/de
Publication of DE3412296A1 publication Critical patent/DE3412296A1/de
Application granted granted Critical
Publication of DE3412296C2 publication Critical patent/DE3412296C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H10W72/536—
    • H10W72/5363—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE19843412296 1984-04-03 1984-04-03 Hybridschaltung in multilayer-technik Granted DE3412296A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843412296 DE3412296A1 (de) 1984-04-03 1984-04-03 Hybridschaltung in multilayer-technik

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843412296 DE3412296A1 (de) 1984-04-03 1984-04-03 Hybridschaltung in multilayer-technik

Publications (2)

Publication Number Publication Date
DE3412296A1 DE3412296A1 (de) 1985-10-03
DE3412296C2 true DE3412296C2 (enExample) 1989-07-06

Family

ID=6232405

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843412296 Granted DE3412296A1 (de) 1984-04-03 1984-04-03 Hybridschaltung in multilayer-technik

Country Status (1)

Country Link
DE (1) DE3412296A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3629976A1 (de) * 1986-09-03 1988-04-07 Hueco Gmbh Fabrik Fuer Interna Spannungsregler fuer generatoren
DE3813565A1 (de) * 1988-04-22 1989-11-02 Bosch Gmbh Robert Elektrischer anschluss von hybridbaugruppen
DE4012180C1 (enExample) * 1990-04-14 1991-08-01 Robert Bosch Gmbh, 7000 Stuttgart, De
DE4105152A1 (de) * 1991-02-20 1992-09-03 Export Contor Aussenhandel Elektronische schaltungsanordnung
JP3198796B2 (ja) * 1993-06-25 2001-08-13 富士電機株式会社 モールドモジュール

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2150695B2 (de) * 1971-10-12 1977-09-15 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum isolierten aufbau von halbleiterelementen, gedruckten und/ oder monolithisch und/oder hybrid integrierten schaltungen
GB1574699A (en) * 1975-10-10 1980-09-10 Luc Technologies Ltd Conductive connections
DE7822999U1 (de) * 1978-08-01 1980-01-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Schichtschaltungsmodul

Also Published As

Publication number Publication date
DE3412296A1 (de) 1985-10-03

Similar Documents

Publication Publication Date Title
DE10336171B3 (de) Multichip-Schaltungsmodul und Verfahren zur Herstellung hierzu
EP0805494B1 (de) Halbleiterleistungsmodul hoher Packungsdichte in Mehrschichtbauweise
EP0221399B1 (de) Leistungshalbleitermodul
DE69632003T2 (de) Starre-flexible Leiterplatte mit einer Öffnung für einen isolierten Montierungsbereich
DE102004018469B3 (de) Leistungshalbleiterschaltung
DE19601372A1 (de) Halbleitermodul
WO2009132922A2 (de) Substrat-schaltungsmodul mit bauteilen in mehreren kontaktierungsebenen
EP2936556A1 (de) Elektronikmodul mit einer mit kunststoff umhüllten elektronische schaltung und verfahren zu dessen herstellung
EP1841299A2 (de) Verbindungseinrichtung für elektronishche Bauelemente
JPS6037610A (ja) 容量性多層導体バーおよびその製造法
EP2514282A1 (de) Leiterplatte mit mehreren übereinander angeordneten leiterplattenlagen mit einer bare-die-montage für den einsatz als getriebesteuerung
EP0597144A1 (de) Hybride leistungselektronische Anordnung
DE19509441A1 (de) Hybrid-integrierte Leistungsschaltungsvorrichtung
DE19859739A1 (de) Kühlvorrichtung, insbesondere zur Verwendung in einem elektronischen Steuergerät
DE102011101052A1 (de) Substrat mit elektrisch neutralem Bereich
EP0219627B1 (de) Mehrschichtige gedruckte Schaltungsplatte
DE3412296C2 (enExample)
DE102016214607B4 (de) Elektronisches Modul und Verfahren zu seiner Herstellung
DE102014209690B4 (de) Kommutierungszelle
DE10303103B4 (de) Halbleiterbauteil, insbesondere Leistungshalbleiterbauteil
DE19924991A1 (de) Intelligentes Leistungsmodul in Sandwich-Bauweise
DE102008026347B4 (de) Leistungselektronische Anordnung mit einem Substrat und einem Grundkörper
DE3811313C2 (enExample)
DE10042839B4 (de) Elektronisches Bauteil mit Wärmesenke und Verfahren zu seiner Herstellung
DE102008040290A1 (de) Hybridschaltungsstruktur mit keramischen Schaltungsträgern

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: BBC BROWN BOVERI AG, 6800 MANNHEIM, DE

8127 New person/name/address of the applicant

Owner name: ASEA BROWN BOVERI AG, 6800 MANNHEIM, DE

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee