DE3810151C2 - - Google Patents

Info

Publication number
DE3810151C2
DE3810151C2 DE19883810151 DE3810151A DE3810151C2 DE 3810151 C2 DE3810151 C2 DE 3810151C2 DE 19883810151 DE19883810151 DE 19883810151 DE 3810151 A DE3810151 A DE 3810151A DE 3810151 C2 DE3810151 C2 DE 3810151C2
Authority
DE
Germany
Prior art keywords
printing
stencil
circuit board
openings
landing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE19883810151
Other languages
German (de)
English (en)
Other versions
DE3810151A1 (de
Inventor
Klaus 5990 Altena De Schubert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leopold Kostal GmbH and Co KG
Original Assignee
Leopold Kostal GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leopold Kostal GmbH and Co KG filed Critical Leopold Kostal GmbH and Co KG
Priority to DE19883810151 priority Critical patent/DE3810151A1/de
Publication of DE3810151A1 publication Critical patent/DE3810151A1/de
Application granted granted Critical
Publication of DE3810151C2 publication Critical patent/DE3810151C2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Plates And Materials Therefor (AREA)
DE19883810151 1988-03-25 1988-03-25 Druckschablone Granted DE3810151A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19883810151 DE3810151A1 (de) 1988-03-25 1988-03-25 Druckschablone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19883810151 DE3810151A1 (de) 1988-03-25 1988-03-25 Druckschablone

Publications (2)

Publication Number Publication Date
DE3810151A1 DE3810151A1 (de) 1989-10-05
DE3810151C2 true DE3810151C2 (enrdf_load_stackoverflow) 1992-05-21

Family

ID=6350699

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19883810151 Granted DE3810151A1 (de) 1988-03-25 1988-03-25 Druckschablone

Country Status (1)

Country Link
DE (1) DE3810151A1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4016992A1 (de) * 1990-05-26 1991-11-28 Bosch Gmbh Robert Drucksieb fuer den siebdruck von elektrischen elementen und strukturen auf einer traegerplatte mit unebenheiten
DE4142658A1 (de) * 1991-12-19 1993-06-24 Siemens Ag Verfahren zum aufbringen von lot auf eine leiterplatte

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4004602A1 (de) * 1990-02-15 1991-08-29 Asea Brown Boveri Verfahren zum vorbeloten eines substrats
DE4015292A1 (de) * 1990-05-12 1991-11-14 Bosch Gmbh Robert Drucksieb fuer den siebdruck von elektrischen elementen und strukturen auf einer traegerplatte mit unebenheiten
DE19733123A1 (de) * 1997-07-31 1998-10-29 Siemens Nixdorf Inf Syst Verfahren zum Erzeugen eines Lotpastendrucks mit feinen und allerfeinsten Strukturen und Schablone zur Durchführung des Verfahrens
EP1198164A1 (en) * 2000-10-11 2002-04-17 Telefonaktiebolaget L M Ericsson (Publ) A method of making a gasket on a PCB and a PCB.
WO2002032203A1 (en) * 2000-10-11 2002-04-18 Telefonaktiebolaget L M Ericsson (Publ) A method of making a gasket on a pcb and a pcb
DE102012112546A1 (de) * 2012-12-18 2014-06-18 Endress + Hauser Gmbh + Co. Kg Verfahren zur Herstellung von mischbestückten Leiterplatten

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3516155A (en) * 1967-02-02 1970-06-23 Bunker Ramo Method and apparatus for assembling electrical components
US4088825A (en) * 1976-08-04 1978-05-09 General Electric Company Electric furnace wall construction
JPS55138294A (en) * 1979-04-11 1980-10-28 Matsushita Electric Ind Co Ltd Method of forming through hole connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4016992A1 (de) * 1990-05-26 1991-11-28 Bosch Gmbh Robert Drucksieb fuer den siebdruck von elektrischen elementen und strukturen auf einer traegerplatte mit unebenheiten
DE4016992C2 (de) * 1990-05-26 1999-05-12 Bosch Gmbh Robert Druckschablone für den Siebdruck von elektrischen Bauelementen und Strukturen auf einer Trägerplatte mit Unebenheiten
DE4142658A1 (de) * 1991-12-19 1993-06-24 Siemens Ag Verfahren zum aufbringen von lot auf eine leiterplatte

Also Published As

Publication number Publication date
DE3810151A1 (de) 1989-10-05

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8320 Willingness to grant licenses declared (paragraph 23)
8339 Ceased/non-payment of the annual fee