DE3808974C2 - - Google Patents
Info
- Publication number
- DE3808974C2 DE3808974C2 DE3808974A DE3808974A DE3808974C2 DE 3808974 C2 DE3808974 C2 DE 3808974C2 DE 3808974 A DE3808974 A DE 3808974A DE 3808974 A DE3808974 A DE 3808974A DE 3808974 C2 DE3808974 C2 DE 3808974C2
- Authority
- DE
- Germany
- Prior art keywords
- reaction chamber
- layer
- gas
- reaction
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000006243 chemical reaction Methods 0.000 claims description 134
- 239000007789 gas Substances 0.000 claims description 66
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 34
- 229910052710 silicon Inorganic materials 0.000 claims description 32
- 239000010703 silicon Substances 0.000 claims description 32
- 230000005684 electric field Effects 0.000 claims description 26
- 238000000151 deposition Methods 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 25
- 239000012495 reaction gas Substances 0.000 claims description 21
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 18
- 230000008021 deposition Effects 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims 2
- 239000002178 crystalline material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 47
- 239000000203 mixture Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 15
- 238000009826 distribution Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229910052796 boron Inorganic materials 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 101100346656 Drosophila melanogaster strat gene Proteins 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 210000001520 comb Anatomy 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000033001 locomotion Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000029305 taxis Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32633—Baffles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
- H10F71/103—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
- H10F71/107—Continuous treatment of the devices, e.g. roll-to roll processes or multi-chamber deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
- H10F77/169—Thin semiconductor films on metallic or insulating substrates
- H10F77/1692—Thin semiconductor films on metallic or insulating substrates the films including only Group IV materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62061193A JPS63228676A (ja) | 1987-03-18 | 1987-03-18 | 薄膜半導体装置の製造方法 |
| JP62076384A JPS63244731A (ja) | 1987-03-31 | 1987-03-31 | プラズマ気相成長装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3808974A1 DE3808974A1 (de) | 1988-09-29 |
| DE3808974C2 true DE3808974C2 (OSRAM) | 1991-04-18 |
Family
ID=26402235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3808974A Granted DE3808974A1 (de) | 1987-03-18 | 1988-03-17 | Anordnung zum abscheiden einer materialschicht auf einem bewegten traeger |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4920917A (OSRAM) |
| DE (1) | DE3808974A1 (OSRAM) |
| FR (1) | FR2613535B1 (OSRAM) |
Families Citing this family (72)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5187115A (en) * | 1977-12-05 | 1993-02-16 | Plasma Physics Corp. | Method of forming semiconducting materials and barriers using a dual enclosure apparatus |
| US5364660A (en) * | 1989-07-21 | 1994-11-15 | Minnesota Mining And Manufacturing Company | Continuous atmospheric pressure CVD coating of fibers |
| US5578130A (en) * | 1990-12-12 | 1996-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus and method for depositing a film |
| US5090356A (en) * | 1991-06-28 | 1992-02-25 | United Solar Systems Corporation | Chemically active isolation passageway for deposition chambers |
| US5224441A (en) * | 1991-09-27 | 1993-07-06 | The Boc Group, Inc. | Apparatus for rapid plasma treatments and method |
| JP3118037B2 (ja) * | 1991-10-28 | 2000-12-18 | キヤノン株式会社 | 堆積膜形成方法および堆積膜形成装置 |
| US5393563A (en) * | 1991-10-29 | 1995-02-28 | Ellis, Jr.; Frank B. | Formation of tin oxide films on glass substrates |
| DE4324320B4 (de) * | 1992-07-24 | 2006-08-31 | Fuji Electric Co., Ltd., Kawasaki | Verfahren und Vorrichtung zur Herstellung einer als dünne Schicht ausgebildeten fotovoltaischen Umwandlungsvorrichtung |
| US6001432A (en) * | 1992-11-19 | 1999-12-14 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus for forming films on a substrate |
| US6001431A (en) * | 1992-12-28 | 1999-12-14 | Semiconductor Energy Laboratory Co., Ltd. | Process for fabricating a magnetic recording medium |
| US7264850B1 (en) | 1992-12-28 | 2007-09-04 | Semiconductor Energy Laboratory Co., Ltd. | Process for treating a substrate with a plasma |
| DE4301189C2 (de) * | 1993-01-19 | 2000-12-14 | Leybold Ag | Vorrichtung zum Beschichten von Substraten |
| JPH06280026A (ja) | 1993-03-24 | 1994-10-04 | Semiconductor Energy Lab Co Ltd | 成膜装置及び成膜方法 |
| US5796116A (en) | 1994-07-27 | 1998-08-18 | Sharp Kabushiki Kaisha | Thin-film semiconductor device including a semiconductor film with high field-effect mobility |
| US5679167A (en) * | 1994-08-18 | 1997-10-21 | Sulzer Metco Ag | Plasma gun apparatus for forming dense, uniform coatings on large substrates |
| DE19500964A1 (de) * | 1995-01-14 | 1996-07-18 | Leybold Ag | Vorrichtung zum Beschichten |
| DE19540255A1 (de) * | 1995-10-28 | 1997-04-30 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats |
| DE19540053A1 (de) * | 1995-10-27 | 1997-04-30 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten |
| DE59611403D1 (de) | 1995-10-27 | 2007-01-25 | Applied Materials Gmbh & Co Kg | Vorrichtung zum Beschichten eines Substrats |
| JP3489334B2 (ja) * | 1996-05-27 | 2004-01-19 | ソニー株式会社 | 半導体装置の酸化膜形成方法および酸化膜形成装置 |
| JP3437386B2 (ja) * | 1996-09-05 | 2003-08-18 | キヤノン株式会社 | 光起電力素子、並びにその製造方法 |
| AU756358B2 (en) * | 1996-09-05 | 2003-01-09 | Canon Kabushiki Kaisha | Photovoltaic element and method of and apparatus for manufacturing the same |
| US6159763A (en) * | 1996-09-12 | 2000-12-12 | Canon Kabushiki Kaisha | Method and device for forming semiconductor thin film, and method and device for forming photovoltaic element |
| JP3164019B2 (ja) | 1997-05-21 | 2001-05-08 | 日本電気株式会社 | 酸化シリコン膜およびその形成方法と成膜装置 |
| JPH11246971A (ja) * | 1998-03-03 | 1999-09-14 | Canon Inc | 微結晶シリコン系薄膜の作製方法及び作製装置 |
| JP4316767B2 (ja) * | 2000-03-22 | 2009-08-19 | 株式会社半導体エネルギー研究所 | 基板処理装置 |
| TW521386B (en) * | 2000-06-28 | 2003-02-21 | Mitsubishi Heavy Ind Ltd | Hexagonal boron nitride film with low dielectric constant, layer dielectric film and method of production thereof, and plasma CVD apparatus |
| US6490402B1 (en) | 2000-08-02 | 2002-12-03 | Sony Corporation | Flexible flat color display |
| US6881269B2 (en) * | 2000-08-17 | 2005-04-19 | Novartis Ag | Lens plasma coating system |
| US6719848B2 (en) * | 2001-08-16 | 2004-04-13 | First Solar, Llc | Chemical vapor deposition system |
| US7666766B2 (en) * | 2005-09-27 | 2010-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Film formation apparatus, method for forming film, and method for manufacturing photoelectric conversion device |
| US20120189846A1 (en) * | 2007-01-03 | 2012-07-26 | Lockheed Martin Corporation | Cnt-infused ceramic fiber materials and process therefor |
| US9005755B2 (en) | 2007-01-03 | 2015-04-14 | Applied Nanostructured Solutions, Llc | CNS-infused carbon nanomaterials and process therefor |
| US20100279569A1 (en) * | 2007-01-03 | 2010-11-04 | Lockheed Martin Corporation | Cnt-infused glass fiber materials and process therefor |
| US8951632B2 (en) * | 2007-01-03 | 2015-02-10 | Applied Nanostructured Solutions, Llc | CNT-infused carbon fiber materials and process therefor |
| US8158217B2 (en) * | 2007-01-03 | 2012-04-17 | Applied Nanostructured Solutions, Llc | CNT-infused fiber and method therefor |
| US8951631B2 (en) | 2007-01-03 | 2015-02-10 | Applied Nanostructured Solutions, Llc | CNT-infused metal fiber materials and process therefor |
| US20090081441A1 (en) * | 2007-09-20 | 2009-03-26 | Lockheed Martin Corporation | Fiber Tow Comprising Carbon-Nanotube-Infused Fibers |
| US20090081383A1 (en) * | 2007-09-20 | 2009-03-26 | Lockheed Martin Corporation | Carbon Nanotube Infused Composites via Plasma Processing |
| CA2750484A1 (en) | 2009-02-17 | 2010-12-16 | Applied Nanostructured Solutions, Llc | Composites comprising carbon nanotubes on fiber |
| EP2401416B1 (en) * | 2009-02-27 | 2021-03-17 | Applied NanoStructured Solutions, LLC | Low temperature carbon nanotube growth using gas-preheat method |
| US20100224129A1 (en) | 2009-03-03 | 2010-09-09 | Lockheed Martin Corporation | System and method for surface treatment and barrier coating of fibers for in situ cnt growth |
| JP5131240B2 (ja) * | 2009-04-09 | 2013-01-30 | 東京エレクトロン株式会社 | 成膜装置、成膜方法及び記憶媒体 |
| US20100260998A1 (en) * | 2009-04-10 | 2010-10-14 | Lockheed Martin Corporation | Fiber sizing comprising nanoparticles |
| EP2417286B1 (en) * | 2009-04-10 | 2015-05-20 | Applied Nanostructured Solutions, Inc. | Apparatus and method for the production of carbon nanotubes on a continuously moving substrate |
| BRPI1016244A2 (pt) | 2009-04-24 | 2016-04-26 | Applied Nanostructured Sols | compósito de proteção contra emi infundido com cnt e revestimento. |
| US9111658B2 (en) | 2009-04-24 | 2015-08-18 | Applied Nanostructured Solutions, Llc | CNS-shielded wires |
| BRPI1014711A2 (pt) | 2009-04-27 | 2016-04-12 | Applied Nanostrctured Solutions Llc | aquecimento de resistência com base em cnt para descongelar estruturas de compósito |
| EP2429945A1 (en) * | 2009-04-30 | 2012-03-21 | Applied NanoStructured Solutions, LLC | Method and system for close proximity catalysis for carbon nanotube synthesis |
| WO2011017200A1 (en) * | 2009-08-03 | 2011-02-10 | Lockheed Martin Corporation | Incorporation of nanoparticles in composite fibers |
| CA2779489A1 (en) * | 2009-11-02 | 2011-05-05 | Applied Nanostructured Solutions, Llc | Cnt-infused aramid fiber materials and process therefor |
| WO2011063422A1 (en) * | 2009-11-23 | 2011-05-26 | Applied Nanostructured Solutions, Llc | Ceramic composite materials containing carbon nanotube-infused fiber materials and methods for production thereof |
| KR20120101446A (ko) * | 2009-11-23 | 2012-09-13 | 어플라이드 나노스트럭처드 솔루션스, 엘엘씨. | Ｃｎｔ 맞춤형 복합재 육상 기반의 구조체 |
| CA2780354A1 (en) | 2009-12-14 | 2011-11-17 | Applied Nanostructured Solutions, Llc | Flame-resistant composite materials and articles containing carbon nanotube-infused fiber materials |
| US20110143019A1 (en) | 2009-12-14 | 2011-06-16 | Amprius, Inc. | Apparatus for Deposition on Two Sides of the Web |
| US9167736B2 (en) | 2010-01-15 | 2015-10-20 | Applied Nanostructured Solutions, Llc | CNT-infused fiber as a self shielding wire for enhanced power transmission line |
| EP2531558B1 (en) | 2010-02-02 | 2018-08-22 | Applied NanoStructured Solutions, LLC | Carbon nanotube-infused fiber materials containing parallel-aligned carbon nanotubes, methods for production thereof, and composite materials derived therefrom |
| EP2543052B1 (en) | 2010-03-02 | 2019-11-27 | Applied NanoStructured Solutions, LLC | Electrical devices containing carbon nanotube-infused fibers and methods for production thereof |
| WO2011109480A2 (en) | 2010-03-02 | 2011-09-09 | Applied Nanostructed Solution, Llc | Spiral wound electrical devices containing carbon nanotube-infused electrode materials and methods and apparatuses for production thereof |
| CN102244152B (zh) * | 2010-05-12 | 2013-09-04 | 吉林庆达新能源电力股份有限公司 | 一种太阳能电池生产中非晶硅薄膜的沉积方法 |
| US8780526B2 (en) | 2010-06-15 | 2014-07-15 | Applied Nanostructured Solutions, Llc | Electrical devices containing carbon nanotube-infused fibers and methods for production thereof |
| US9017854B2 (en) | 2010-08-30 | 2015-04-28 | Applied Nanostructured Solutions, Llc | Structural energy storage assemblies and methods for production thereof |
| AU2011302314A1 (en) | 2010-09-14 | 2013-02-28 | Applied Nanostructured Solutions, Llc | Glass substrates having carbon nanotubes grown thereon and methods for production thereof |
| BR112013005529A2 (pt) | 2010-09-22 | 2016-05-03 | Applied Nanostructured Sols | substratos de fibras de carbono que têm nanotubos de carbono desenvolvidos nos mesmos, e processos para a produção dos mesmos |
| JP2014508370A (ja) | 2010-09-23 | 2014-04-03 | アプライド ナノストラクチャード ソリューションズ リミテッド ライアビリティー カンパニー | 強化送電線のセルフシールドワイヤとしてのｃｎｔ浸出繊維 |
| US9085464B2 (en) | 2012-03-07 | 2015-07-21 | Applied Nanostructured Solutions, Llc | Resistance measurement system and method of using the same |
| JP5432395B1 (ja) * | 2013-02-28 | 2014-03-05 | 三井造船株式会社 | 成膜装置及び成膜方法 |
| WO2015120513A1 (en) * | 2014-02-11 | 2015-08-20 | Kenneth Scott Alexander Butcher | Electrostatic control of metal wetting layers during deposition |
| US11251019B2 (en) * | 2016-12-15 | 2022-02-15 | Toyota Jidosha Kabushiki Kaisha | Plasma device |
| WO2018153481A1 (en) * | 2017-02-24 | 2018-08-30 | Applied Materials, Inc. | Apparatus for vacuum processing |
| JP6863199B2 (ja) | 2017-09-25 | 2021-04-21 | トヨタ自動車株式会社 | プラズマ処理装置 |
| CN114622183A (zh) * | 2020-12-11 | 2022-06-14 | 湖南红太阳光电科技有限公司 | 一种制备氧化硅薄膜的方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55125681A (en) * | 1979-03-22 | 1980-09-27 | Sanyo Electric Co Ltd | Manufacture of photovoltaic device |
| JPS5694749A (en) * | 1979-12-28 | 1981-07-31 | Matsushita Electronics Corp | Plasma heaping device |
| DE3272239D1 (en) * | 1981-03-16 | 1986-09-04 | Energy Conversion Devices Inc | Apparatus including improved cathode for continuous deposition of amorphous material |
| US4438723A (en) * | 1981-09-28 | 1984-03-27 | Energy Conversion Devices, Inc. | Multiple chamber deposition and isolation system and method |
| US4492181A (en) * | 1982-03-19 | 1985-01-08 | Sovonics Solar Systems | Apparatus for continuously producing tandem amorphous photovoltaic cells |
| US4423701A (en) * | 1982-03-29 | 1984-01-03 | Energy Conversion Devices, Inc. | Glow discharge deposition apparatus including a non-horizontally disposed cathode |
| US4450787A (en) * | 1982-06-03 | 1984-05-29 | Rca Corporation | Glow discharge plasma deposition of thin films |
| US4438724A (en) * | 1982-08-13 | 1984-03-27 | Energy Conversion Devices, Inc. | Grooved gas gate |
| US4608943A (en) * | 1984-10-24 | 1986-09-02 | Sovonics Solar Systems | Cathode assembly with localized profiling capabilities |
-
1988
- 1988-03-11 US US07/166,689 patent/US4920917A/en not_active Expired - Lifetime
- 1988-03-17 DE DE3808974A patent/DE3808974A1/de active Granted
- 1988-03-18 FR FR8803589A patent/FR2613535B1/fr not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US4920917A (en) | 1990-05-01 |
| FR2613535B1 (fr) | 1996-01-12 |
| DE3808974A1 (de) | 1988-09-29 |
| FR2613535A1 (fr) | 1988-10-07 |
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| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
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| 8331 | Complete revocation |