DE3790315T - - Google Patents

Info

Publication number
DE3790315T
DE3790315T DE19873790315 DE3790315T DE3790315T DE 3790315 T DE3790315 T DE 3790315T DE 19873790315 DE19873790315 DE 19873790315 DE 3790315 T DE3790315 T DE 3790315T DE 3790315 T DE3790315 T DE 3790315T
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19873790315
Other languages
German (de)
Other versions
DE3790315C2 (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DE3790315T publication Critical patent/DE3790315T/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/006—Casings specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/34—PCB in box or housing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
DE19873790315 1986-06-20 1987-06-18 Pending DE3790315T (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61145239A JPH0669120B2 (ja) 1986-06-20 1986-06-20 シ−ルド装置

Publications (1)

Publication Number Publication Date
DE3790315T true DE3790315T (OSRAM) 1988-08-04

Family

ID=15380547

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19873790315 Pending DE3790315T (OSRAM) 1986-06-20 1987-06-18
DE3790315A Expired DE3790315C2 (OSRAM) 1986-06-20 1987-06-18

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE3790315A Expired DE3790315C2 (OSRAM) 1986-06-20 1987-06-18

Country Status (5)

Country Link
US (1) US4861941A (OSRAM)
JP (1) JPH0669120B2 (OSRAM)
DE (2) DE3790315T (OSRAM)
GB (1) GB2200253B (OSRAM)
WO (1) WO1987007998A1 (OSRAM)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT8819772A0 (it) * 1988-03-15 1988-03-15 Honeywell Bull Spa Dispositivo selettivo a terra per apparecchiature elettroniche.
DE3837206C2 (de) * 1988-11-02 1998-07-23 Bosch Gmbh Robert Elektrisches Schaltgerät
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
US5034856A (en) * 1989-10-24 1991-07-23 Hewlett-Packard Company Modular housing assembly for two incompatible circuits
FR2654891A1 (fr) * 1989-11-20 1991-05-24 Alcatel Radiotelephone Blindage pour circuit radiofrequence.
US5092035A (en) * 1990-09-10 1992-03-03 Codex Corporation Method of making printed circuit board assembly
US5160903A (en) * 1990-12-03 1992-11-03 Motorola, Inc. High isolation packaging technology
US5222294A (en) * 1990-12-03 1993-06-29 Motorola, Inc. High isolation packaging method
WO1992016095A1 (en) * 1991-03-04 1992-09-17 Motorola, Inc. Shielding apparatus for non-conductive electronic circuit package
FI915242L (fi) * 1991-11-06 1993-05-07 Nokia Mobile Phones Ltd Rf-skaermning av kretskort
DE9300868U1 (de) * 1993-01-22 1994-05-26 Siemens AG, 80333 München Einstückiges Isolierteil, insbesondere Spritzgießteil
DE4344193C2 (de) * 1993-12-23 1996-09-05 Foerster Inst Dr Friedrich Verfahren zur Anbringung einer Schutzschicht und Schutzelement
JPH07183683A (ja) * 1993-12-24 1995-07-21 Nec Corp シールド構造
JP2731719B2 (ja) * 1994-03-08 1998-03-25 八木アンテナ株式会社 低雑音高周波増幅装置
JPH08111580A (ja) * 1994-10-12 1996-04-30 Yagi Antenna Co Ltd シールドケースの基板はんだ付け方法
SE509938C2 (sv) * 1996-07-09 1999-03-29 Ericsson Telefon Ab L M Förfarande och anordning vid mönsterkort
JPH11330766A (ja) 1998-05-11 1999-11-30 Alps Electric Co Ltd 電子機器
US7081050B2 (en) * 1999-04-23 2006-07-25 Colepat, Llc Method of playing a multi-player game
EP1087651A1 (en) * 1999-09-21 2001-03-28 Lucent Technologies Inc. Screen on circuit board, and process for its production
US6490173B2 (en) * 2000-12-19 2002-12-03 Thomson Licensing, S.A. Method and apparatus for providing electromagnetic shielding
US6475558B2 (en) 2001-02-26 2002-11-05 Volvo Trucks North America, Inc. Vehicle electrical ground and process
US6730860B2 (en) * 2001-09-13 2004-05-04 Intel Corporation Electronic assembly and a method of constructing an electronic assembly
US7005323B2 (en) * 2001-09-27 2006-02-28 Rfstream Corporation Method and apparatus for shielding integrated circuits
US7359693B2 (en) * 2003-05-23 2008-04-15 Rfstream Corporation Enclosure and substrate structure for a tuner module
US7120398B2 (en) * 2003-09-18 2006-10-10 Kyocera Wireless Corp. Mobile communication devices having high frequency noise reduction and methods of making such devices
WO2006099119A2 (en) * 2005-03-11 2006-09-21 Rfstream Corporation An integrated circuit layout for a television tuner
TWM380706U (en) * 2009-12-10 2010-05-11 Wistron Corp Metal shielding casing and the combination thereof with circuit board
US9113549B2 (en) 2011-12-01 2015-08-18 Triquint Semiconductor, Inc. Enclosure for a multi-channel modulator driver
KR102214512B1 (ko) * 2014-07-04 2021-02-09 삼성전자 주식회사 인쇄회로기판 및 이를 이용한 반도체 패키지

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7810941U1 (de) * 1978-04-12 1978-07-27 Rohde & Schwarz, 8000 Muenchen Hochfrequenzdichte Baugruppe für Geräte der elektrischen Nachrichtentechnik
GB2101811B (en) * 1981-06-30 1985-01-03 Racal Dana Instr Ltd Improvements in and relating to the screening of electrical circuit arrangements
JPS599591A (ja) * 1982-07-08 1984-01-18 石川島播磨重工業株式会社 原子炉圧力容器ペデスタルの据え付け方法
JPS599591U (ja) * 1982-07-09 1984-01-21 株式会社日立製作所 チユ−ナのシ−ルド板構造
JPS599592U (ja) * 1982-07-09 1984-01-21 株式会社日立製作所 チユ−ナのシ−ルド板構造
JPS599592A (ja) * 1982-07-09 1984-01-18 財団法人電力中央研究所 原子炉のル−フスラブにおける回転プラグ装着部構造
JPS59182975A (ja) * 1983-03-31 1984-10-17 Nippon Steel Corp 表面品質を損なわないステンレス鋼板の表面部分精整方法
JPS59182975U (ja) * 1983-05-20 1984-12-06 松下電器産業株式会社 印刷配線板
GB8322473D0 (en) * 1983-08-20 1983-09-21 Int Computers Ltd Printed circuit boards
JPS60109362U (ja) * 1983-12-28 1985-07-25 アルプス電気株式会社 多層プリント基板のア−ス構造
JPS60154600A (ja) * 1984-01-24 1985-08-14 株式会社東芝 シ−ルドケ−ス取付方法
US4642735A (en) * 1984-02-27 1987-02-10 General Electric Company Frequency synthesizer module
US4626963A (en) * 1985-02-28 1986-12-02 Rca Corporation Wave solderable RF shield member for a printed circuit board
JPH0627995Y2 (ja) * 1986-03-20 1994-07-27 株式会社東芝 シ−ルド構造
JPH108502A (ja) * 1996-06-24 1998-01-13 Sumitomo Constr Mach Co Ltd 油圧掘削機の多段式伸縮アーム用油圧回路

Also Published As

Publication number Publication date
JPH0669120B2 (ja) 1994-08-31
WO1987007998A1 (en) 1987-12-30
GB2200253B (en) 1990-03-07
GB8803234D0 (en) 1988-03-30
DE3790315C2 (OSRAM) 1989-11-23
US4861941A (en) 1989-08-29
GB2200253A (en) 1988-07-27
JPS631099A (ja) 1988-01-06

Similar Documents

Publication Publication Date Title
IN165244B (OSRAM)
IN171368B (OSRAM)
IN172083B (OSRAM)
IN168915B (OSRAM)
DE3790865T (OSRAM)
IN169661B (OSRAM)
DE3790341T1 (OSRAM)
AU7354491A (OSRAM)
AU6562586A (OSRAM)
AU5644686A (OSRAM)
AU4375585A (OSRAM)
AU6019186A (OSRAM)
AU5767086A (OSRAM)
AU5130385A (OSRAM)
AU5173485A (OSRAM)
AU6011386A (OSRAM)
AU6161186A (OSRAM)
AU5703286A (OSRAM)
AU4910985A (OSRAM)
AU5724586A (OSRAM)
BE905178A (OSRAM)
AU5655786A (OSRAM)
IN165283B (OSRAM)
AU5783386A (OSRAM)
BE905236A (OSRAM)