DE3769009D1 - Kuehlmodul fuer chips mit integrierten schaltungen mit einer anordnung zur verhinderung von kuehlmittel-lecks. - Google Patents

Kuehlmodul fuer chips mit integrierten schaltungen mit einer anordnung zur verhinderung von kuehlmittel-lecks.

Info

Publication number
DE3769009D1
DE3769009D1 DE8787107481T DE3769009T DE3769009D1 DE 3769009 D1 DE3769009 D1 DE 3769009D1 DE 8787107481 T DE8787107481 T DE 8787107481T DE 3769009 T DE3769009 T DE 3769009T DE 3769009 D1 DE3769009 D1 DE 3769009D1
Authority
DE
Germany
Prior art keywords
chips
arrangement
integrated circuits
cooling module
coolant leaks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787107481T
Other languages
English (en)
Inventor
Keiichirou Hitachi D Nakanishi
Minoru Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3769009D1 publication Critical patent/DE3769009D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8787107481T 1986-05-23 1987-05-22 Kuehlmodul fuer chips mit integrierten schaltungen mit einer anordnung zur verhinderung von kuehlmittel-lecks. Expired - Lifetime DE3769009D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61117415A JPH0797617B2 (ja) 1986-05-23 1986-05-23 冷媒漏洩防止装置

Publications (1)

Publication Number Publication Date
DE3769009D1 true DE3769009D1 (de) 1991-05-08

Family

ID=14711078

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787107481T Expired - Lifetime DE3769009D1 (de) 1986-05-23 1987-05-22 Kuehlmodul fuer chips mit integrierten schaltungen mit einer anordnung zur verhinderung von kuehlmittel-lecks.

Country Status (4)

Country Link
US (1) US4870477A (de)
EP (1) EP0246657B1 (de)
JP (1) JPH0797617B2 (de)
DE (1) DE3769009D1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989009958A1 (en) * 1988-04-08 1989-10-19 Hitachi, Ltd. Semiconductor module, its cooling system and computer using the cooling system
JPH0636421B2 (ja) * 1988-09-21 1994-05-11 株式会社日立製作所 半導体モジュール及びそれを用いた電子計算機
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
JP2728105B2 (ja) * 1991-10-21 1998-03-18 日本電気株式会社 集積回路用冷却装置
CA2088821C (en) * 1992-02-05 1999-09-07 Hironobu Ikeda Cooling structure for integrated circuit
US5218515A (en) * 1992-03-13 1993-06-08 The United States Of America As Represented By The United States Department Of Energy Microchannel cooling of face down bonded chips
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
JP3494188B2 (ja) * 1994-03-17 2004-02-03 富士通株式会社 集積回路素子用冷却装置
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
US5390077A (en) * 1994-07-14 1995-02-14 At&T Global Information Solutions Company Integrated circuit cooling device having internal baffle
US6333849B1 (en) 1996-07-01 2001-12-25 Compaq Computer Corporation Apparatus for liquid cooling of specific computer components
US20030033346A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for managing multiple resources in a system
US20030033398A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for generating and using configuration policies
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US7133907B2 (en) * 2001-10-18 2006-11-07 Sun Microsystems, Inc. Method, system, and program for configuring system resources
US6965559B2 (en) * 2001-10-19 2005-11-15 Sun Microsystems, Inc. Method, system, and program for discovering devices communicating through a switch
US20030135609A1 (en) * 2002-01-16 2003-07-17 Sun Microsystems, Inc. Method, system, and program for determining a modification of a system resource configuration
US7103889B2 (en) 2002-07-23 2006-09-05 Sun Microsystems, Inc. Method, system, and article of manufacture for agent processing
US20040024887A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for generating information on components within a network
US20040022200A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for providing information on components within a network
US7143615B2 (en) 2002-07-31 2006-12-05 Sun Microsystems, Inc. Method, system, and program for discovering components within a network
US20040052052A1 (en) * 2002-09-18 2004-03-18 Rivera Rudy A. Circuit cooling apparatus
US6953227B2 (en) * 2002-12-05 2005-10-11 Sun Microsystems, Inc. High-power multi-device liquid cooling
US6826948B1 (en) 2003-10-09 2004-12-07 Delphi Technologies, Inc. Leak detection apparatus for a liquid circulation cooling system
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
US9869983B2 (en) 2014-12-05 2018-01-16 International Business Machines Corporation Cooling system leak detection
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
US10856446B2 (en) * 2018-02-08 2020-12-01 Juniper Networks, Inc. Cooling for slot mounted electrical modules
TWI725422B (zh) * 2018-05-31 2021-04-21 技嘉科技股份有限公司 液冷導熱裝置、液冷循環系統以及漏液偵測方法
US11934213B2 (en) * 2021-02-18 2024-03-19 Asia Vital Components (China) Co., Ltd. Liquid-cooling device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1817880C3 (de) * 1967-12-28 1978-12-21 Packo, Joseph John, Fort Lauderdale, Fla. (V.St.A.) Verfahren zur Anzeige des Vorhandenseins eines unsichtbaren Gases
ZA783081B (en) * 1978-09-15 1980-08-27 J Grobler The sealing of leaks in tanks and the like
US4304805A (en) * 1978-12-04 1981-12-08 Joseph J. Packo Sealing leaks by polymerization of volatilized aminosilane monomers
JPS55156349A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Semiconductor device
JPS58106852A (ja) * 1981-12-18 1983-06-25 Mitsubishi Electric Corp 電力用半導体装置
JPS59200495A (ja) * 1983-04-27 1984-11-13 株式会社日立製作所 マルチチツプ・モジユ−ル
JPH0673364B2 (ja) * 1983-10-28 1994-09-14 株式会社日立製作所 集積回路チップ冷却装置
JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式
JPS6197953A (ja) * 1984-10-19 1986-05-16 Fujitsu Ltd 集積回路部品パツケ−ジの伝導冷却構造
JPH06101523B2 (ja) * 1985-03-04 1994-12-12 株式会社日立製作所 集積回路チツプ冷却装置

Also Published As

Publication number Publication date
EP0246657B1 (de) 1991-04-03
JPH0797617B2 (ja) 1995-10-18
JPS62274757A (ja) 1987-11-28
US4870477A (en) 1989-09-26
EP0246657A3 (en) 1988-01-07
EP0246657A2 (de) 1987-11-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee