JPS55156349A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55156349A
JPS55156349A JP6381779A JP6381779A JPS55156349A JP S55156349 A JPS55156349 A JP S55156349A JP 6381779 A JP6381779 A JP 6381779A JP 6381779 A JP6381779 A JP 6381779A JP S55156349 A JPS55156349 A JP S55156349A
Authority
JP
Japan
Prior art keywords
water
leakage
electrodes
semiconductor device
indicator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6381779A
Other languages
Japanese (ja)
Inventor
Shigeo Kobayashi
Hideki Takahashi
Kazuo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6381779A priority Critical patent/JPS55156349A/en
Publication of JPS55156349A publication Critical patent/JPS55156349A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)

Abstract

PURPOSE:To prevent accidents in a water cooled semiconductor device by providing the junction section of water pipes with a pair of electrodes wherein a leakage of water is sensed by providing water sensing elements across electrodes. CONSTITUTION:Water sensing elements 12, 12' such as a paper fiber indicator are provided across metal flanges 10, 10' and electrodes 11, 11' of insulating water pipes 9, 9'. Resistors R1-R3 are connected across the flanges and the electrodes as fixed respectively and a DC power source is connected to drive a semiconductor device 1. If a leakage of water is found at the junction section of the water pipes 9, 9', the water flows to either water sensing element 12 or 12' and the resistant value Rx remarkably decreases and the terminal voltage V1 in an indicator In becomes high and the indicator In is lit to indicate the leakage of water. This constitution permits to work out an immediate measure to counter the leakage of water. Therefore, accidents in the semiconductor device will be prevented.
JP6381779A 1979-05-25 1979-05-25 Semiconductor device Pending JPS55156349A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6381779A JPS55156349A (en) 1979-05-25 1979-05-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6381779A JPS55156349A (en) 1979-05-25 1979-05-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS55156349A true JPS55156349A (en) 1980-12-05

Family

ID=13240293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6381779A Pending JPS55156349A (en) 1979-05-25 1979-05-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55156349A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147257U (en) * 1982-03-26 1983-10-03 関西電力株式会社 Thyristor valve cooling device
US4870477A (en) * 1986-05-23 1989-09-26 Hitachi, Ltd. Integrated circuit chips cooling module having coolant leakage prevention device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147257U (en) * 1982-03-26 1983-10-03 関西電力株式会社 Thyristor valve cooling device
US4870477A (en) * 1986-05-23 1989-09-26 Hitachi, Ltd. Integrated circuit chips cooling module having coolant leakage prevention device

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