DE3750684T2 - Verfahren zur Herstellung von keramischen Mehrschichtstrukturen mit interner Anordnung von Kupferleitern. - Google Patents

Verfahren zur Herstellung von keramischen Mehrschichtstrukturen mit interner Anordnung von Kupferleitern.

Info

Publication number
DE3750684T2
DE3750684T2 DE3750684T DE3750684T DE3750684T2 DE 3750684 T2 DE3750684 T2 DE 3750684T2 DE 3750684 T DE3750684 T DE 3750684T DE 3750684 T DE3750684 T DE 3750684T DE 3750684 T2 DE3750684 T2 DE 3750684T2
Authority
DE
Germany
Prior art keywords
production
ceramic multilayer
multilayer structures
copper conductors
internal arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3750684T
Other languages
English (en)
Other versions
DE3750684D1 (de
Inventor
Herbert Anderson
Renuka Shastri Divakaruni
Joseph Michael Dynys
Steven Michael Kandetzke
Daniel Patrick Kirby
Raj Navinchandra Master
Jon Alfred Casey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3750684D1 publication Critical patent/DE3750684D1/de
Publication of DE3750684T2 publication Critical patent/DE3750684T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Conductive Materials (AREA)
DE3750684T 1986-05-01 1987-03-10 Verfahren zur Herstellung von keramischen Mehrschichtstrukturen mit interner Anordnung von Kupferleitern. Expired - Fee Related DE3750684T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/858,488 US4885038A (en) 1986-05-01 1986-05-01 Method of making multilayered ceramic structures having an internal distribution of copper-based conductors

Publications (2)

Publication Number Publication Date
DE3750684D1 DE3750684D1 (de) 1994-12-01
DE3750684T2 true DE3750684T2 (de) 1995-05-18

Family

ID=25328430

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3750684T Expired - Fee Related DE3750684T2 (de) 1986-05-01 1987-03-10 Verfahren zur Herstellung von keramischen Mehrschichtstrukturen mit interner Anordnung von Kupferleitern.

Country Status (7)

Country Link
US (1) US4885038A (de)
EP (1) EP0243626B1 (de)
JP (1) JPS62261197A (de)
BR (1) BR8701784A (de)
CA (1) CA1326789C (de)
DE (1) DE3750684T2 (de)
ES (1) ES2062972T3 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5147484A (en) * 1987-10-19 1992-09-15 International Business Machines Corporation Method for producing multi-layer ceramic substrates with oxidation resistant metalization
JPH0728128B2 (ja) * 1988-03-11 1995-03-29 松下電器産業株式会社 セラミック多層配線基板とその製造方法
US5194294A (en) * 1989-02-20 1993-03-16 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Process for preparing electrical connection means, in particular interconnection substances of hybrid circuits
US5208066A (en) * 1989-03-18 1993-05-04 Hitachi, Ltd. Process of forming a patterned polyimide film and articles including such a film
EP0444216A4 (en) * 1989-09-19 1992-04-08 Fujitsu Limited Via-forming ceramics composition
US5326643A (en) * 1991-10-07 1994-07-05 International Business Machines Corporation Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
US5682018A (en) * 1991-10-18 1997-10-28 International Business Machines Corporation Interface regions between metal and ceramic in a metal/ceramic substrate
JP3422233B2 (ja) * 1997-09-26 2003-06-30 株式会社村田製作所 バイアホール用導電性ペースト、およびそれを用いた積層セラミック基板の製造方法
JP2000244123A (ja) * 1999-02-19 2000-09-08 Hitachi Ltd 多層セラミック回路基板
DE10033588C2 (de) * 2000-07-11 2002-05-16 Bosch Gmbh Robert Keramisches Mehrlagenbauteil und Verfahren zu dessen Herstellung
GB2374205B (en) * 2001-04-04 2004-12-22 Rolls Royce Plc An electrical conductor winding and a method of manufacturing an electrical conductor winding
WO2008140786A1 (en) 2007-05-11 2008-11-20 Sdc Materials, Inc. Method and apparatus for making uniform and ultrasmall nanoparticles
US8481449B1 (en) 2007-10-15 2013-07-09 SDCmaterials, Inc. Method and system for forming plug and play oxide catalysts
US8557727B2 (en) 2009-12-15 2013-10-15 SDCmaterials, Inc. Method of forming a catalyst with inhibited mobility of nano-active material
US8652992B2 (en) 2009-12-15 2014-02-18 SDCmaterials, Inc. Pinning and affixing nano-active material
US9149797B2 (en) 2009-12-15 2015-10-06 SDCmaterials, Inc. Catalyst production method and system
US9119309B1 (en) 2009-12-15 2015-08-25 SDCmaterials, Inc. In situ oxide removal, dispersal and drying
US8545652B1 (en) 2009-12-15 2013-10-01 SDCmaterials, Inc. Impact resistant material
US9126191B2 (en) 2009-12-15 2015-09-08 SDCmaterials, Inc. Advanced catalysts for automotive applications
US8470112B1 (en) 2009-12-15 2013-06-25 SDCmaterials, Inc. Workflow for novel composite materials
US8803025B2 (en) 2009-12-15 2014-08-12 SDCmaterials, Inc. Non-plugging D.C. plasma gun
US8669202B2 (en) 2011-02-23 2014-03-11 SDCmaterials, Inc. Wet chemical and plasma methods of forming stable PtPd catalysts
AU2012299065B2 (en) 2011-08-19 2015-06-04 SDCmaterials, Inc. Coated substrates for use in catalysis and catalytic converters and methods of coating substrates with washcoat compositions
US9511352B2 (en) 2012-11-21 2016-12-06 SDCmaterials, Inc. Three-way catalytic converter using nanoparticles
US9156025B2 (en) 2012-11-21 2015-10-13 SDCmaterials, Inc. Three-way catalytic converter using nanoparticles
EP3024571B1 (de) 2013-07-25 2020-05-27 Umicore AG & Co. KG Reinigungsbeschichtungen und beschichtete substrate für katalytische wandler
WO2015061477A1 (en) 2013-10-22 2015-04-30 SDCmaterials, Inc. Catalyst design for heavy-duty diesel combustion engines
EP3068517A4 (de) 2013-10-22 2017-07-05 SDCMaterials, Inc. Zusammensetzungen aus mager-nox-falle
CN106470752A (zh) 2014-03-21 2017-03-01 Sdc材料公司 用于被动nox吸附(pna)系统的组合物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079156A (en) * 1975-03-07 1978-03-14 Uop Inc. Conductive metal pigments
JPS559643A (en) * 1978-07-07 1980-01-23 Asahi Chem Ind Co Ltd Production of heat-resistant resin paste
US4234367A (en) * 1979-03-23 1980-11-18 International Business Machines Corporation Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
DE3011047C2 (de) * 1979-03-23 1982-12-16 Nippondenso Co., Ltd., Kariya, Aichi Wärmebeständiger, isolierter elektrischer Leitungsdraht und Verfahren zu dessen Herstellung
US4517155A (en) * 1982-05-18 1985-05-14 Union Carbide Corporation Copper base metal termination for multilayer ceramic capacitors
JPS59995A (ja) * 1982-06-16 1984-01-06 富士通株式会社 銅導体多層構造体の製造方法
US4474731A (en) * 1983-03-28 1984-10-02 International Business Machines Corporation Process for the removal of carbon residues during sintering of ceramics
US4511601A (en) * 1983-05-13 1985-04-16 North American Philips Corporation Copper metallization for dielectric materials
US4671928A (en) * 1984-04-26 1987-06-09 International Business Machines Corporation Method of controlling the sintering of metal particles
JPS60250686A (ja) * 1984-05-25 1985-12-11 日本碍子株式会社 セラミツク配線基板の製造方法
JPS60254697A (ja) * 1984-05-31 1985-12-16 富士通株式会社 多層セラミック回路基板および製法

Also Published As

Publication number Publication date
ES2062972T3 (es) 1995-01-01
BR8701784A (pt) 1988-02-09
JPS62261197A (ja) 1987-11-13
EP0243626A2 (de) 1987-11-04
CA1326789C (en) 1994-02-08
EP0243626B1 (de) 1994-10-26
EP0243626A3 (en) 1989-11-08
JPH0567077B2 (de) 1993-09-24
DE3750684D1 (de) 1994-12-01
US4885038A (en) 1989-12-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee