DE3680223D1 - Halbleiterlaser-vorrichtung. - Google Patents

Halbleiterlaser-vorrichtung.

Info

Publication number
DE3680223D1
DE3680223D1 DE8686302086T DE3680223T DE3680223D1 DE 3680223 D1 DE3680223 D1 DE 3680223D1 DE 8686302086 T DE8686302086 T DE 8686302086T DE 3680223 T DE3680223 T DE 3680223T DE 3680223 D1 DE3680223 D1 DE 3680223D1
Authority
DE
Germany
Prior art keywords
semiconductor laser
laser device
semiconductor
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686302086T
Other languages
German (de)
English (en)
Inventor
Osamu Patents Division Matsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of DE3680223D1 publication Critical patent/DE3680223D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0202—Cleaving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
DE8686302086T 1985-03-23 1986-03-20 Halbleiterlaser-vorrichtung. Expired - Lifetime DE3680223D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985042245U JPH0419819Y2 (enExample) 1985-03-23 1985-03-23

Publications (1)

Publication Number Publication Date
DE3680223D1 true DE3680223D1 (de) 1991-08-22

Family

ID=12630639

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686302086T Expired - Lifetime DE3680223D1 (de) 1985-03-23 1986-03-20 Halbleiterlaser-vorrichtung.

Country Status (5)

Country Link
US (1) US4764931A (enExample)
EP (1) EP0196200B1 (enExample)
JP (1) JPH0419819Y2 (enExample)
KR (1) KR920002914Y1 (enExample)
DE (1) DE3680223D1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4906839A (en) * 1986-05-01 1990-03-06 Pencom International Corp. Hybrid surface emitting laser and detector
JPS63124486A (ja) * 1986-11-13 1988-05-27 Mitsubishi Electric Corp 半導体レ−ザの製造方法
US4905216A (en) * 1986-12-04 1990-02-27 Pencom International Corporation Method for constructing an optical head by varying a hologram pattern
US4945524A (en) * 1987-04-15 1990-07-31 Pioneer Electronic Corporation Compact optical pickup apparatus for optical disk player
US4999842A (en) * 1989-03-01 1991-03-12 At&T Bell Laboratories Quantum well vertical cavity laser
JPH02271586A (ja) * 1989-04-12 1990-11-06 Mitsubishi Electric Corp 半導体レーザ装置
US4980549A (en) * 1990-03-05 1990-12-25 Eastman Kodak Company Beam position sensor for a light beam scanner having emitter and detector disposed along the same optical axis
EP0510423B1 (de) * 1991-04-24 1997-01-22 Siemens Aktiengesellschaft Optoelektronische Sendevorrichtung
US5293032A (en) * 1992-02-10 1994-03-08 Sydney Urshan Digital data optical recording and playback system
US5319182A (en) * 1992-03-04 1994-06-07 Welch Allyn, Inc. Integrated solid state light emitting and detecting array and apparatus employing said array
JPH0894938A (ja) * 1994-09-21 1996-04-12 Sony Corp 共焦点顕微鏡並びに光記録再生装置
DE19742150C1 (de) * 1997-09-24 1999-04-22 Siemens Nixdorf Inf Syst Verfahren zur Herstellung einer optischen Speicherplatte und zu deren Herstellung geeigneter CD-R-Plattenrohling
US5903584A (en) * 1998-01-05 1999-05-11 Youngtek Electronics Laser diode package
JP2008004914A (ja) * 2006-05-22 2008-01-10 Toshiba Corp 半導体レーザ装置
WO2009001283A2 (en) * 2007-06-27 2008-12-31 Koninklijke Philips Electronics N.V. Optical sensor module and its manufacture
US9570648B2 (en) 2012-06-15 2017-02-14 Intersil Americas LLC Wafer level optical proximity sensors and systems including wafer level optical proximity sensors
US9721837B2 (en) 2015-04-16 2017-08-01 Intersil Americas LLC Wafer level optoelectronic device packages with crosstalk barriers and methods for making the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1073460A (en) * 1964-07-31 1967-06-28 Battelle Development Corp Semiconductor devices
GB1483849A (en) * 1974-09-21 1977-08-24 Nippon Electric Co Semiconductor laser device equipped with a silicon heat sink
DE2737345C2 (de) * 1976-08-20 1991-07-25 Canon K.K., Tokio/Tokyo Halbleiterlaser-Vorrichtung mit einem Peltier-Element
JPS6195591A (ja) * 1984-10-16 1986-05-14 Sony Corp 半導体レ−ザ

Also Published As

Publication number Publication date
JPH0419819Y2 (enExample) 1992-05-06
KR920002914Y1 (ko) 1992-05-08
JPS61158969U (enExample) 1986-10-02
EP0196200A3 (en) 1988-01-13
EP0196200B1 (en) 1991-07-17
KR860012475U (ko) 1986-10-10
EP0196200A2 (en) 1986-10-01
US4764931A (en) 1988-08-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee