DE3666900D1 - Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card - Google Patents

Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card

Info

Publication number
DE3666900D1
DE3666900D1 DE8686401402T DE3666900T DE3666900D1 DE 3666900 D1 DE3666900 D1 DE 3666900D1 DE 8686401402 T DE8686401402 T DE 8686401402T DE 3666900 T DE3666900 T DE 3666900T DE 3666900 D1 DE3666900 D1 DE 3666900D1
Authority
DE
Germany
Prior art keywords
mounting
support
integrated circuit
microcircuit card
resultant device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8686401402T
Other languages
German (de)
English (en)
Inventor
Gerard Dehaine
Alain Peytavy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CP8 Technologies SA
Original Assignee
Bull SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull SAS filed Critical Bull SAS
Application granted granted Critical
Publication of DE3666900D1 publication Critical patent/DE3666900D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
DE8686401402T 1985-06-26 1986-06-26 Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card Expired DE3666900D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8509733A FR2584236B1 (fr) 1985-06-26 1985-06-26 Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques

Publications (1)

Publication Number Publication Date
DE3666900D1 true DE3666900D1 (en) 1989-12-14

Family

ID=9320696

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686401402T Expired DE3666900D1 (en) 1985-06-26 1986-06-26 Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card

Country Status (5)

Country Link
EP (1) EP0207852B1 (enExample)
JP (1) JPS6230096A (enExample)
CA (1) CA1283227C (enExample)
DE (1) DE3666900D1 (enExample)
FR (1) FR2584236B1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1002529A6 (nl) * 1988-09-27 1991-03-12 Bell Telephone Mfg Methode om een elektronische component te monteren en geheugen kaart waarin deze wordt toegepast.
JPH0643107B2 (ja) * 1989-01-06 1994-06-08 オーツタイヤ株式会社 タイヤ成形機における材料供給貼付装置
US5292267A (en) * 1989-12-15 1994-03-08 Kabushiki Kaisha Toshiba Connector unit with movable connector
US5182698A (en) * 1989-12-15 1993-01-26 Kabushiki Kaisha Toshiba Function expanding apparatus for compact electronic device
JPH03269608A (ja) * 1990-03-20 1991-12-02 Toshiba Corp 携帯型コンピュータの拡張ユニット
US5057969A (en) * 1990-09-07 1991-10-15 International Business Machines Corporation Thin film electronic device
FR2671417B1 (fr) * 1991-01-04 1995-03-24 Solaic Sa Procede pour la fabrication d'une carte a memoire et carte a memoire ainsi obtenue .
US5544007A (en) * 1991-07-19 1996-08-06 Kabushiiki Kaisha Toshiba Card-shaped electronic device used with an electronic apparatus and having shield plate with conductive portion on a lateral side
CA2071381C (en) * 1991-07-19 1998-12-15 Youji Satou Electronic apparatus, card-type electronic component used with the electronic apparatus, and electronic system with expanding apparatus for expanding function of electronic apparatus
US5404271A (en) * 1991-07-30 1995-04-04 Kabushiki Kaisha Toshiba Electronic apparatus having a card storing section formed within a body between a support frame and an upper case of the body and having functional elements mounted between the support frame and a lower case of the body
US5504648A (en) * 1991-09-06 1996-04-02 Kabushiki Kaisha Toshiba Electronic apparatus and electronic system with expanding apparatus having interlock, ejector, grounding, and lock mechanisms, for expanding function of electronic apparatus
EP0530829A2 (en) * 1991-09-06 1993-03-10 Kabushiki Kaisha Toshiba Electronic apparatus system having an electronic apparatus unit and an expansion unit for expanding the function of the electronic apparatus unit
DE4424396C2 (de) * 1994-07-11 1996-12-12 Ibm Trägerelement zum Einbau in Chipkarten oder anderen Datenträgerkarten
DE19632113C1 (de) * 1996-08-08 1998-02-19 Siemens Ag Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte
DE19708617C2 (de) * 1997-03-03 1999-02-04 Siemens Ag Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte
DE19800646C2 (de) * 1998-01-09 2000-05-04 Siemens Ag Trägerelement für einen Halbleiterchip
FR2805083A1 (fr) * 2000-02-10 2001-08-17 Bull Sa Procede de montage et de fabrication de circuits integres sur un support et support en resultant
DE10202727A1 (de) * 2002-01-24 2003-08-21 Infineon Technologies Ag Trägersubstrat für ein Chipmodul, Chipmodul und Chipkarte
GB0213094D0 (en) * 2002-06-07 2002-07-17 Power Innovations Ltd Lead frame
FR2859045B1 (fr) * 2003-08-21 2005-10-21 Commissariat Energie Atomique Dispositif de connexion electrique entre deux plaquettes et procede de realisation d'un composant microelectronique comportant un tel dispositif
DE102005038132B4 (de) 2005-08-11 2008-04-03 Infineon Technologies Ag Chipmodul und Chipkarte

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437474B1 (enExample) * 1968-06-10 1979-11-15
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
FR2547440B1 (fr) * 1983-06-09 1986-02-07 Flonic Sa Procede de fabrication de cartes a memoire et cartes obtenues suivant ce procede

Also Published As

Publication number Publication date
FR2584236B1 (fr) 1988-04-29
EP0207852A1 (fr) 1987-01-07
JPS6230096A (ja) 1987-02-09
EP0207852B1 (fr) 1989-11-08
FR2584236A1 (fr) 1987-01-02
CA1283227C (fr) 1991-04-16
JPH054914B2 (enExample) 1993-01-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: CP8 TECHNOLOGIES, LOUVECIENNES, FR