DE3666900D1 - Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card - Google Patents
Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit cardInfo
- Publication number
- DE3666900D1 DE3666900D1 DE8686401402T DE3666900T DE3666900D1 DE 3666900 D1 DE3666900 D1 DE 3666900D1 DE 8686401402 T DE8686401402 T DE 8686401402T DE 3666900 T DE3666900 T DE 3666900T DE 3666900 D1 DE3666900 D1 DE 3666900D1
- Authority
- DE
- Germany
- Prior art keywords
- mounting
- support
- integrated circuit
- microcircuit card
- resultant device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Credit Cards Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8509733A FR2584236B1 (fr) | 1985-06-26 | 1985-06-26 | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3666900D1 true DE3666900D1 (en) | 1989-12-14 |
Family
ID=9320696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686401402T Expired DE3666900D1 (en) | 1985-06-26 | 1986-06-26 | Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0207852B1 (de) |
JP (1) | JPS6230096A (de) |
CA (1) | CA1283227C (de) |
DE (1) | DE3666900D1 (de) |
FR (1) | FR2584236B1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE1002529A6 (nl) * | 1988-09-27 | 1991-03-12 | Bell Telephone Mfg | Methode om een elektronische component te monteren en geheugen kaart waarin deze wordt toegepast. |
JPH0643107B2 (ja) * | 1989-01-06 | 1994-06-08 | オーツタイヤ株式会社 | タイヤ成形機における材料供給貼付装置 |
US5292267A (en) * | 1989-12-15 | 1994-03-08 | Kabushiki Kaisha Toshiba | Connector unit with movable connector |
EP0432803B1 (de) * | 1989-12-15 | 1998-10-07 | Kabushiki Kaisha Toshiba | Funktionserweiterungsgerät für kompakte elektronische Einrichtung |
JPH03269608A (ja) * | 1990-03-20 | 1991-12-02 | Toshiba Corp | 携帯型コンピュータの拡張ユニット |
US5057969A (en) * | 1990-09-07 | 1991-10-15 | International Business Machines Corporation | Thin film electronic device |
FR2671417B1 (fr) * | 1991-01-04 | 1995-03-24 | Solaic Sa | Procede pour la fabrication d'une carte a memoire et carte a memoire ainsi obtenue . |
CA2071381C (en) * | 1991-07-19 | 1998-12-15 | Youji Satou | Electronic apparatus, card-type electronic component used with the electronic apparatus, and electronic system with expanding apparatus for expanding function of electronic apparatus |
US5544007A (en) * | 1991-07-19 | 1996-08-06 | Kabushiiki Kaisha Toshiba | Card-shaped electronic device used with an electronic apparatus and having shield plate with conductive portion on a lateral side |
US5404271A (en) * | 1991-07-30 | 1995-04-04 | Kabushiki Kaisha Toshiba | Electronic apparatus having a card storing section formed within a body between a support frame and an upper case of the body and having functional elements mounted between the support frame and a lower case of the body |
US5504648A (en) * | 1991-09-06 | 1996-04-02 | Kabushiki Kaisha Toshiba | Electronic apparatus and electronic system with expanding apparatus having interlock, ejector, grounding, and lock mechanisms, for expanding function of electronic apparatus |
EP0530829A2 (de) * | 1991-09-06 | 1993-03-10 | Kabushiki Kaisha Toshiba | Elektronikgerätesystem mit Elektronikgeräteinheit und Erweiterungseinheit zur Erweiterung der Funktion der Elektronikgeräteinheit |
DE4424396C2 (de) * | 1994-07-11 | 1996-12-12 | Ibm | Trägerelement zum Einbau in Chipkarten oder anderen Datenträgerkarten |
DE19632113C1 (de) | 1996-08-08 | 1998-02-19 | Siemens Ag | Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte |
DE19708617C2 (de) * | 1997-03-03 | 1999-02-04 | Siemens Ag | Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte |
DE19800646C2 (de) * | 1998-01-09 | 2000-05-04 | Siemens Ag | Trägerelement für einen Halbleiterchip |
FR2805083A1 (fr) * | 2000-02-10 | 2001-08-17 | Bull Sa | Procede de montage et de fabrication de circuits integres sur un support et support en resultant |
DE10202727A1 (de) * | 2002-01-24 | 2003-08-21 | Infineon Technologies Ag | Trägersubstrat für ein Chipmodul, Chipmodul und Chipkarte |
GB0213094D0 (en) * | 2002-06-07 | 2002-07-17 | Power Innovations Ltd | Lead frame |
FR2859045B1 (fr) * | 2003-08-21 | 2005-10-21 | Commissariat Energie Atomique | Dispositif de connexion electrique entre deux plaquettes et procede de realisation d'un composant microelectronique comportant un tel dispositif |
DE102005038132B4 (de) | 2005-08-11 | 2008-04-03 | Infineon Technologies Ag | Chipmodul und Chipkarte |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5437474B1 (de) * | 1968-06-10 | 1979-11-15 | ||
US3868724A (en) * | 1973-11-21 | 1975-02-25 | Fairchild Camera Instr Co | Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier |
FR2337381A1 (fr) * | 1975-12-31 | 1977-07-29 | Honeywell Bull Soc Ind | Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte |
FR2439438A1 (fr) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux |
FR2547440B1 (fr) * | 1983-06-09 | 1986-02-07 | Flonic Sa | Procede de fabrication de cartes a memoire et cartes obtenues suivant ce procede |
-
1985
- 1985-06-26 FR FR8509733A patent/FR2584236B1/fr not_active Expired
-
1986
- 1986-06-26 DE DE8686401402T patent/DE3666900D1/de not_active Expired
- 1986-06-26 EP EP86401402A patent/EP0207852B1/de not_active Expired
- 1986-06-26 CA CA000512598A patent/CA1283227C/fr not_active Expired - Lifetime
- 1986-06-26 JP JP61150612A patent/JPS6230096A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
EP0207852B1 (de) | 1989-11-08 |
JPH054914B2 (de) | 1993-01-21 |
FR2584236A1 (fr) | 1987-01-02 |
CA1283227C (fr) | 1991-04-16 |
EP0207852A1 (de) | 1987-01-07 |
JPS6230096A (ja) | 1987-02-09 |
FR2584236B1 (fr) | 1988-04-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: CP8 TECHNOLOGIES, LOUVECIENNES, FR |