JPS5437474B1 - - Google Patents

Info

Publication number
JPS5437474B1
JPS5437474B1 JP4007168A JP4007168A JPS5437474B1 JP S5437474 B1 JPS5437474 B1 JP S5437474B1 JP 4007168 A JP4007168 A JP 4007168A JP 4007168 A JP4007168 A JP 4007168A JP S5437474 B1 JPS5437474 B1 JP S5437474B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4007168A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4007168A priority Critical patent/JPS5437474B1/ja
Priority to US831041A priority patent/US3670404A/en
Publication of JPS5437474B1 publication Critical patent/JPS5437474B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W40/10—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H10P95/00—
    • H10W72/60—
    • H10W72/07236—
    • H10W72/877—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Dicing (AREA)
JP4007168A 1968-06-10 1968-06-10 Pending JPS5437474B1 (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP4007168A JPS5437474B1 (enExample) 1968-06-10 1968-06-10
US831041A US3670404A (en) 1968-06-10 1969-06-06 Method of fabricating a semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4007168A JPS5437474B1 (enExample) 1968-06-10 1968-06-10

Publications (1)

Publication Number Publication Date
JPS5437474B1 true JPS5437474B1 (enExample) 1979-11-15

Family

ID=12570681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4007168A Pending JPS5437474B1 (enExample) 1968-06-10 1968-06-10

Country Status (2)

Country Link
US (1) US3670404A (enExample)
JP (1) JPS5437474B1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3846825A (en) * 1971-02-05 1974-11-05 Philips Corp Semiconductor device having conducting pins and cooling member
US4004955A (en) * 1973-05-24 1977-01-25 General Motors Corporation Positive selective nickel alignment system
US3895429A (en) * 1974-05-09 1975-07-22 Rca Corp Method of making a semiconductor device
US3936866A (en) * 1974-06-14 1976-02-03 Northrop Corporation Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate
US3995310A (en) * 1974-12-23 1976-11-30 General Electric Company Semiconductor assembly including mounting plate with recessed periphery
US4023260A (en) * 1976-03-05 1977-05-17 Bell Telephone Laboratories, Incorporated Method of manufacturing semiconductor diodes for use in millimeter-wave circuits
US4023258A (en) * 1976-03-05 1977-05-17 Bell Telephone Laboratories, Incorporated Method of manufacturing semiconductor diodes for use in millimeter-wave circuits
US4357540A (en) * 1980-12-19 1982-11-02 International Business Machines Corporation Semiconductor device array mask inspection method and apparatus
US4534804A (en) * 1984-06-14 1985-08-13 International Business Machines Corporation Laser process for forming identically positioned alignment marks on the opposite sides of a semiconductor wafer
FR2584236B1 (fr) * 1985-06-26 1988-04-29 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
US5504338A (en) * 1993-06-30 1996-04-02 The United States Of America As Represented By The Secretary Of The Navy Apparatus and method using low-voltage and/or low-current scanning probe lithography
US5942805A (en) * 1996-12-20 1999-08-24 Intel Corporation Fiducial for aligning an integrated circuit die

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3447235A (en) * 1967-07-21 1969-06-03 Raytheon Co Isolated cathode array semiconductor

Also Published As

Publication number Publication date
US3670404A (en) 1972-06-20

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