DE3604075A1 - Verpackung von leistungsbauelementen - Google Patents

Verpackung von leistungsbauelementen

Info

Publication number
DE3604075A1
DE3604075A1 DE19863604075 DE3604075A DE3604075A1 DE 3604075 A1 DE3604075 A1 DE 3604075A1 DE 19863604075 DE19863604075 DE 19863604075 DE 3604075 A DE3604075 A DE 3604075A DE 3604075 A1 DE3604075 A1 DE 3604075A1
Authority
DE
Germany
Prior art keywords
power component
base body
component according
cover
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19863604075
Other languages
German (de)
English (en)
Inventor
Dieter Dipl Phys Seipler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19863604075 priority Critical patent/DE3604075A1/de
Priority to IT19214/87A priority patent/IT1202453B/it
Priority to JP62024919A priority patent/JPS62193157A/ja
Publication of DE3604075A1 publication Critical patent/DE3604075A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE19863604075 1986-02-08 1986-02-08 Verpackung von leistungsbauelementen Ceased DE3604075A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE19863604075 DE3604075A1 (de) 1986-02-08 1986-02-08 Verpackung von leistungsbauelementen
IT19214/87A IT1202453B (it) 1986-02-08 1987-01-30 Confezione per componenti di potenza
JP62024919A JPS62193157A (ja) 1986-02-08 1987-02-06 パワー素子パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863604075 DE3604075A1 (de) 1986-02-08 1986-02-08 Verpackung von leistungsbauelementen

Publications (1)

Publication Number Publication Date
DE3604075A1 true DE3604075A1 (de) 1987-08-13

Family

ID=6293754

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863604075 Ceased DE3604075A1 (de) 1986-02-08 1986-02-08 Verpackung von leistungsbauelementen

Country Status (3)

Country Link
JP (1) JPS62193157A (enExample)
DE (1) DE3604075A1 (enExample)
IT (1) IT1202453B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5434449A (en) * 1992-02-06 1995-07-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device in a single package with high wiring density and a heat sink
RU2118585C1 (ru) * 1997-09-11 1998-09-10 Воеводин Григорий Леонидович Способ монтажа деталей полупроводникового прибора к основанию и полупроводниковый прибор, полученный этим способом
US20120127670A1 (en) * 2007-10-30 2012-05-24 Ronny Ludwig Module housing and method for manufacturing a module housing
RU2641601C2 (ru) * 2016-02-24 2018-01-18 Акционерное Общество "Новосибирский Завод Полупроводниковых Приборов С Окб" (Ао "Нзпп С Окб") Способ пайки силовых полупроводниковых приборов

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2819287A1 (de) * 1977-05-05 1978-11-09 Fierkens Richardus Verfahren zum einkapseln von mikroelektronischen elementen
EP0153618A2 (en) * 1984-02-24 1985-09-04 Kabushiki Kaisha Toshiba Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same
DE3127457C2 (de) * 1981-07-11 1985-09-12 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul
US4556899A (en) * 1981-06-05 1985-12-03 Hitachi, Ltd. Insulated type semiconductor devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60178647A (ja) * 1984-02-27 1985-09-12 Toshiba Corp 半導体装置
JPS6135539A (ja) * 1984-07-27 1986-02-20 Nec Corp 半導体装置
JPS61150351A (ja) * 1984-12-25 1986-07-09 Toshiba Corp Ｉｃパツケ−ジ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2819287A1 (de) * 1977-05-05 1978-11-09 Fierkens Richardus Verfahren zum einkapseln von mikroelektronischen elementen
US4556899A (en) * 1981-06-05 1985-12-03 Hitachi, Ltd. Insulated type semiconductor devices
DE3127457C2 (de) * 1981-07-11 1985-09-12 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul
EP0153618A2 (en) * 1984-02-24 1985-09-04 Kabushiki Kaisha Toshiba Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5434449A (en) * 1992-02-06 1995-07-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device in a single package with high wiring density and a heat sink
RU2118585C1 (ru) * 1997-09-11 1998-09-10 Воеводин Григорий Леонидович Способ монтажа деталей полупроводникового прибора к основанию и полупроводниковый прибор, полученный этим способом
US20120127670A1 (en) * 2007-10-30 2012-05-24 Ronny Ludwig Module housing and method for manufacturing a module housing
RU2641601C2 (ru) * 2016-02-24 2018-01-18 Акционерное Общество "Новосибирский Завод Полупроводниковых Приборов С Окб" (Ао "Нзпп С Окб") Способ пайки силовых полупроводниковых приборов

Also Published As

Publication number Publication date
IT8719214A0 (it) 1987-01-30
JPS62193157A (ja) 1987-08-25
IT1202453B (it) 1989-02-09
JPH0519984B2 (enExample) 1993-03-18

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8131 Rejection