JPH0519984B2 - - Google Patents

Info

Publication number
JPH0519984B2
JPH0519984B2 JP62024919A JP2491987A JPH0519984B2 JP H0519984 B2 JPH0519984 B2 JP H0519984B2 JP 62024919 A JP62024919 A JP 62024919A JP 2491987 A JP2491987 A JP 2491987A JP H0519984 B2 JPH0519984 B2 JP H0519984B2
Authority
JP
Japan
Prior art keywords
power element
power
base body
substrate
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62024919A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62193157A (ja
Inventor
Zaipuraa Deiitaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPS62193157A publication Critical patent/JPS62193157A/ja
Publication of JPH0519984B2 publication Critical patent/JPH0519984B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/114—
    • H10W70/479—
    • H10W70/481—
    • H10W70/692—
    • H10W72/50—
    • H10W72/5363—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP62024919A 1986-02-08 1987-02-06 パワー素子パッケージ Granted JPS62193157A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19863604075 DE3604075A1 (de) 1986-02-08 1986-02-08 Verpackung von leistungsbauelementen
DE3604075.4 1986-02-08

Publications (2)

Publication Number Publication Date
JPS62193157A JPS62193157A (ja) 1987-08-25
JPH0519984B2 true JPH0519984B2 (enExample) 1993-03-18

Family

ID=6293754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62024919A Granted JPS62193157A (ja) 1986-02-08 1987-02-06 パワー素子パッケージ

Country Status (3)

Country Link
JP (1) JPS62193157A (enExample)
DE (1) DE3604075A1 (enExample)
IT (1) IT1202453B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218233A (ja) * 1992-02-06 1993-08-27 Mitsubishi Electric Corp 半導体装置およびその製造方法
RU2118585C1 (ru) * 1997-09-11 1998-09-10 Воеводин Григорий Леонидович Способ монтажа деталей полупроводникового прибора к основанию и полупроводниковый прибор, полученный этим способом
DE102007051870A1 (de) * 2007-10-30 2009-05-07 Robert Bosch Gmbh Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses
RU2641601C2 (ru) * 2016-02-24 2018-01-18 Акционерное Общество "Новосибирский Завод Полупроводниковых Приборов С Окб" (Ао "Нзпп С Окб") Способ пайки силовых полупроводниковых приборов

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL189379C (nl) * 1977-05-05 1993-03-16 Richardus Henricus Johannes Fi Werkwijze voor inkapselen van micro-elektronische elementen.
JPS6038867B2 (ja) * 1981-06-05 1985-09-03 株式会社日立製作所 絶縁型半導体装置
DE3127457C2 (de) * 1981-07-11 1985-09-12 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul
JPH0810710B2 (ja) * 1984-02-24 1996-01-31 株式会社東芝 良熱伝導性基板の製造方法
JPS60178647A (ja) * 1984-02-27 1985-09-12 Toshiba Corp 半導体装置
JPS6135539A (ja) * 1984-07-27 1986-02-20 Nec Corp 半導体装置
JPS61150351A (ja) * 1984-12-25 1986-07-09 Toshiba Corp Ｉｃパツケ−ジ

Also Published As

Publication number Publication date
JPS62193157A (ja) 1987-08-25
DE3604075A1 (de) 1987-08-13
IT1202453B (it) 1989-02-09
IT8719214A0 (it) 1987-01-30

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