DE3585115D1 - Verfahren zur herstellung und einstellung von eingegrabenen schichten. - Google Patents

Verfahren zur herstellung und einstellung von eingegrabenen schichten.

Info

Publication number
DE3585115D1
DE3585115D1 DE8585901701T DE3585115T DE3585115D1 DE 3585115 D1 DE3585115 D1 DE 3585115D1 DE 8585901701 T DE8585901701 T DE 8585901701T DE 3585115 T DE3585115 T DE 3585115T DE 3585115 D1 DE3585115 D1 DE 3585115D1
Authority
DE
Germany
Prior art keywords
substrate
recesses
epitaxial layer
adjusting
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585901701T
Other languages
English (en)
Inventor
W Hatcher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of DE3585115D1 publication Critical patent/DE3585115D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/975—Substrate or mask aligning feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Glass Compositions (AREA)
DE8585901701T 1984-03-19 1985-03-04 Verfahren zur herstellung und einstellung von eingegrabenen schichten. Expired - Lifetime DE3585115D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/590,678 US4487653A (en) 1984-03-19 1984-03-19 Process for forming and locating buried layers
PCT/US1985/000355 WO1985004134A1 (en) 1984-03-19 1985-03-04 Process for forming and locating buried layers

Publications (1)

Publication Number Publication Date
DE3585115D1 true DE3585115D1 (de) 1992-02-20

Family

ID=24363228

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585901701T Expired - Lifetime DE3585115D1 (de) 1984-03-19 1985-03-04 Verfahren zur herstellung und einstellung von eingegrabenen schichten.

Country Status (6)

Country Link
US (1) US4487653A (de)
EP (1) EP0174986B1 (de)
JP (1) JPS61501483A (de)
AT (1) ATE71476T1 (de)
DE (1) DE3585115D1 (de)
WO (1) WO1985004134A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4632724A (en) * 1985-08-19 1986-12-30 International Business Machines Corporation Visibility enhancement of first order alignment marks
US4737468A (en) * 1987-04-13 1988-04-12 Motorola Inc. Process for developing implanted buried layer and/or key locators
JP2897248B2 (ja) * 1989-04-18 1999-05-31 富士通株式会社 半導体装置の製造方法
US5249016A (en) * 1989-12-15 1993-09-28 Canon Kabushiki Kaisha Semiconductor device manufacturing system
US6171966B1 (en) * 1996-08-15 2001-01-09 Applied Materials, Inc. Delineation pattern for epitaxial depositions
US6207966B1 (en) 1998-12-04 2001-03-27 Advanced Micro Devices, Inc Mark protection with transparent film
US6576529B1 (en) * 1999-12-07 2003-06-10 Agere Systems Inc. Method of forming an alignment feature in or on a multilayered semiconductor structure
US6573151B1 (en) * 2000-08-22 2003-06-03 Advanced Micro Devices, Inc. Method of forming zero marks
DE10047152B4 (de) * 2000-09-22 2006-07-06 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Hochvolt-Diode und Verfahren zu deren Herstellung
US7247952B2 (en) * 2003-10-30 2007-07-24 Hewlett-Packard Development Company, L.P. Optical targets
KR101001875B1 (ko) 2006-09-30 2010-12-17 엘지이노텍 주식회사 등방성 에칭을 이용한 미세 패턴 형성방법 및 이를 이용하여 제조된 미세패턴이 형성된 반도체 기판 면상 부재
CN101852985B (zh) * 2009-03-30 2013-01-09 鸿富锦精密工业（深圳）有限公司 一种基板对位标记的制作方法
US8628677B2 (en) * 2011-03-31 2014-01-14 Fujifilm Corporation Forming curved features using a shadow mask
CN113540040B (zh) * 2021-07-15 2023-04-11 长江存储科技有限责任公司 一种半导体结构的制造方法及其测试方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3600241A (en) * 1968-09-09 1971-08-17 Ibm Method of fabricating semiconductor devices by diffusion
JPS51147179A (en) * 1975-06-12 1976-12-17 Fujitsu Ltd Method of munufacturing of semiconductor device
GB1520925A (en) * 1975-10-06 1978-08-09 Mullard Ltd Semiconductor device manufacture
US4170501A (en) * 1978-02-15 1979-10-09 Rca Corporation Method of making a semiconductor integrated circuit device utilizing simultaneous outdiffusion and autodoping during epitaxial deposition
JPS5534442A (en) * 1978-08-31 1980-03-11 Fujitsu Ltd Preparation of semiconductor device
US4251300A (en) * 1979-05-14 1981-02-17 Fairchild Camera And Instrument Corporation Method for forming shaped buried layers in semiconductor devices utilizing etching, epitaxial deposition and oxide formation
JPS5645294A (en) * 1979-09-19 1981-04-24 Toshiba Corp End cock welding method for covering tube of atomic fuel
US4309813A (en) * 1979-12-26 1982-01-12 Harris Corporation Mask alignment scheme for laterally and totally dielectrically isolated integrated circuits
US4351892A (en) * 1981-05-04 1982-09-28 Fairchild Camera & Instrument Corp. Alignment target for electron-beam write system

Also Published As

Publication number Publication date
EP0174986A1 (de) 1986-03-26
JPS61501483A (ja) 1986-07-17
EP0174986B1 (de) 1992-01-08
WO1985004134A1 (en) 1985-09-26
EP0174986A4 (de) 1989-06-14
ATE71476T1 (de) 1992-01-15
US4487653A (en) 1984-12-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee