DE3525177A1 - Verfahren und vorrichtung fuer das erschmelzen und fuer das aufdampfen von hochreinem silizium - Google Patents

Verfahren und vorrichtung fuer das erschmelzen und fuer das aufdampfen von hochreinem silizium

Info

Publication number
DE3525177A1
DE3525177A1 DE19853525177 DE3525177A DE3525177A1 DE 3525177 A1 DE3525177 A1 DE 3525177A1 DE 19853525177 DE19853525177 DE 19853525177 DE 3525177 A DE3525177 A DE 3525177A DE 3525177 A1 DE3525177 A1 DE 3525177A1
Authority
DE
Germany
Prior art keywords
silicon
electrodes
arc
melt
silicon body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19853525177
Other languages
German (de)
English (en)
Inventor
Eduard Mount Vernon N.Y. Pinkhasov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vapor Technologies Inc
Original Assignee
Wedtech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wedtech Corp filed Critical Wedtech Corp
Publication of DE3525177A1 publication Critical patent/DE3525177A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/10—Crucibles or containers for supporting the melt
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/14—Heating of the melt or the crystallised materials
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C30B23/06—Heating of the deposition chamber, the substrate or the materials to be evaporated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B7/00—Heating by electric discharge
    • H05B7/18—Heating by arc discharge
    • H05B7/20—Direct heating by arc discharge, i.e. where at least one end of the arc directly acts on the material to be heated, including additional resistance heating by arc current flowing through the material to be heated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Silicon Compounds (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Vapour Deposition (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
DE19853525177 1984-07-20 1985-07-15 Verfahren und vorrichtung fuer das erschmelzen und fuer das aufdampfen von hochreinem silizium Withdrawn DE3525177A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/633,124 US4548670A (en) 1984-07-20 1984-07-20 Silicon melting and evaporation method for high purity applications

Publications (1)

Publication Number Publication Date
DE3525177A1 true DE3525177A1 (de) 1986-01-23

Family

ID=24538365

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853525177 Withdrawn DE3525177A1 (de) 1984-07-20 1985-07-15 Verfahren und vorrichtung fuer das erschmelzen und fuer das aufdampfen von hochreinem silizium

Country Status (9)

Country Link
US (1) US4548670A ( )
JP (1) JPS6163513A ( )
CA (1) CA1240482A ( )
DE (1) DE3525177A1 ( )
FR (1) FR2567918A1 ( )
GB (1) GB2162766B ( )
IL (1) IL75715A ( )
IT (1) IT1185287B ( )
SE (1) SE8503405L ( )

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010052522A1 (de) 2009-11-24 2011-06-01 Forschungsverbund Berlin E.V. Verfahren und Vorrichtung zur Herstellung von Einkristallen aus Halbleitermaterial

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2248852A (en) * 1990-10-16 1992-04-22 Secr Defence Vapour deposition
JP2792483B2 (ja) * 1995-10-26 1998-09-03 日本電気株式会社 半導体製造装置
US6126742A (en) * 1996-09-20 2000-10-03 Forshungszentrum Karlsruhe Gmbh Method of drawing single crystals
DE19638563C2 (de) * 1996-09-20 1999-07-08 Karlsruhe Forschzent Verfahren zum Ziehen von Einkristallen
US6632277B2 (en) 1999-07-14 2003-10-14 Seh America, Inc. Optimized silicon wafer gettering for advanced semiconductor devices
US6454852B2 (en) 1999-07-14 2002-09-24 Seh America, Inc. High efficiency silicon wafer optimized for advanced semiconductor devices
US6395085B2 (en) 1999-07-14 2002-05-28 Seh America, Inc. Purity silicon wafer for use in advanced semiconductor devices
US6228165B1 (en) * 1999-07-28 2001-05-08 Seh America, Inc. Method of manufacturing crystal of silicon using an electric potential
JP2007010501A (ja) * 2005-06-30 2007-01-18 Herzog Japan Ltd ガラスビード作製装置及び方法
US20100050932A1 (en) * 2008-08-27 2010-03-04 Bp Corporation North America Inc. Apparatus and Method of Direct Electric Melting a Feedstock
WO2011099110A1 (ja) * 2010-02-09 2011-08-18 Kaneko Kyojiro シリコン真空溶解法
CN102275927A (zh) * 2011-06-01 2011-12-14 邓小宝 燃气电弧双热式蓄热余热废气回燃环保节能高效炼硅炉
DE102013205225A1 (de) * 2013-03-25 2014-09-25 Wacker Chemie Ag Herstellung von Silicium enthaltenden nano- und mikrometerskaligen Partikeln

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE542056A ( ) * 1954-10-15
US3160497A (en) * 1962-11-15 1964-12-08 Loung Pai Yen Method of melting refractory metals using a double heating process
DE1243641B (de) * 1962-12-12 1967-07-06 Siemens Ag Verfahren zur Herstellung von Halbleiterstaeben durch Ziehen aus der Schmelze
US3392056A (en) * 1964-10-26 1968-07-09 Irc Inc Method of making single crystal films and the product resulting therefrom
US3625660A (en) * 1968-03-18 1971-12-07 Massachusetts Inst Technology Method and structure for growing crystals
US4165361A (en) * 1975-11-28 1979-08-21 Milstein Joseph B Process and apparatus for preparation of single crystals and textured polycrystals

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010052522A1 (de) 2009-11-24 2011-06-01 Forschungsverbund Berlin E.V. Verfahren und Vorrichtung zur Herstellung von Einkristallen aus Halbleitermaterial
WO2011063795A1 (de) 2009-11-24 2011-06-03 Forschungsverbund Berlin E. V. Verfahren und vorrichtung zur herstellung von einkristallen aus halbleitermaterial
US9422636B2 (en) 2009-11-24 2016-08-23 Forschungsverbund Berlin E.V. Method and apparatus for producing single crystals composed of semiconductor material

Also Published As

Publication number Publication date
SE8503405D0 (sv) 1985-07-09
IT8521642A0 (it) 1985-07-19
GB2162766B (en) 1987-10-28
IT1185287B (it) 1987-11-04
JPH0116765B2 ( ) 1989-03-27
GB8518400D0 (en) 1985-08-29
FR2567918A1 (fr) 1986-01-24
JPS6163513A (ja) 1986-04-01
IL75715A (en) 1989-06-30
GB2162766A (en) 1986-02-12
IL75715A0 (en) 1985-11-29
SE8503405L (sv) 1986-01-21
CA1240482A (en) 1988-08-16
US4548670A (en) 1985-10-22

Similar Documents

Publication Publication Date Title
DE976899C (de) Gasentladungsanlage zur Herstellung eines Stabes aus hochreinem Silicium
DE19607098C2 (de) Verfahren und Vorrichtung zum gerichteten Erstarren einer Schmelze aus Silizium zu einem Block in einem bodenlosen metallischen Kaltwandtiegel
DE69731199T2 (de) Verfahren und einrichtung zur berührungslose behandlung eines scheiben förmiges halbleitersubstrats
DE3525177A1 (de) Verfahren und vorrichtung fuer das erschmelzen und fuer das aufdampfen von hochreinem silizium
DE944209C (de) Verfahren zur Herstellung von Halbleiterkoerpern
EP2379783B1 (de) Verfahren und vorrichtung zur herstellung von siliziumdünnstäben
DE3417462A1 (de) Verfahren und vorrichtung fuer die beschichtung einer traeger- oder grundschicht mit einem material, das elektrisch in die dampfphase gebracht wird
DE102010024010B4 (de) Verfahren und Vorrichtung zum Herstellen von polykristallinen Siliziumblöcken
DE1132097B (de) Vorrichtung zum Ziehen von Kristallen aus einer Schmelze
DE112006002595T5 (de) Herstellungsvorrichtung und Herstellungsverfahren für ein Einkristall-Halbleiter
DE3523090A1 (de) Verfahren und vorrichtung zum aufbringen von schutzbeschichtungen auf quarztiegel
DE1298085B (de) Verfahren zur Herstellung von Einkristallen hoher Kristallguete durch Zonenschmelzen
DE2432021A1 (de) Verfahren zur herstellung eines speisers und vorrichtung zur durchfuehrung des verfahrens
DE3017016A1 (de) Verfahren und vorrichtung zur herstellung von monokristallinem silicium in bandform
DE3519632A1 (de) Verfahren und vorrichtung fuer das ziehen von monokristallinen siliziumstaeben
DE3143146A1 (de) Als flachspule ausgebildete induktionsheizspule zum tiegelfreien zonenschmelzen
DE3502757A1 (de) Verfahren und einrichtung zum herstellen von kristallkeimen fuer einkristall-halbleiteranordnungen
DE3508690A1 (de) Verfahren fuer die beschichtung von keramik- und quarztiegeln mit stoffen, die elektrisch in eine dampfphase gebracht worden sind
DE1927961A1 (de) Verfahren und Vorrichtung zum Zuechten langgestreckter Staebe aus Feststoffen
DE1170913B (de) Verfahren zur Herstellung von kristallinem Silicium in Stabform
DE1419289A1 (de) Verfahren zum Herstellen dotierter Halbleiterkoerper
EP0931185B1 (de) Verfahren zum ziehen von einkristallen
DE2638094C3 (de) Vakuum-Lichtbogen-Erwärmungseinrichtung
AT206127B (de) Verfahren und Vorrichtung zum Schmelzen von chemisch hoch reaktionsfähigem Schmelzgut
DE1074273B (de) (V St A) I Verfahren zum Zonenschmelzen elektrisch leitender Korper durch unmittelbares galvanisches Erwarmen

Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: VAPOR TECHNOLOGIES, INC., MOUNT VERNON, N.Y., US

8128 New person/name/address of the agent

Representative=s name: HEMMERICH, F., 4000 DUESSELDORF MUELLER, G., DIPL.

8139 Disposal/non-payment of the annual fee