JPH0116765B2 - - Google Patents
Info
- Publication number
- JPH0116765B2 JPH0116765B2 JP60153897A JP15389785A JPH0116765B2 JP H0116765 B2 JPH0116765 B2 JP H0116765B2 JP 60153897 A JP60153897 A JP 60153897A JP 15389785 A JP15389785 A JP 15389785A JP H0116765 B2 JPH0116765 B2 JP H0116765B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- electrode
- melt
- arc
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 114
- 229910052710 silicon Inorganic materials 0.000 claims description 114
- 239000010703 silicon Substances 0.000 claims description 114
- 239000000155 melt Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 20
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010891 electric arc Methods 0.000 claims 4
- 239000007788 liquid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000576 coating method Methods 0.000 description 7
- 239000000356 contaminant Substances 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 230000008016 vaporization Effects 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/10—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/14—Heating of the melt or the crystallised materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
- C30B23/06—Heating of the deposition chamber, the substrate or the materials to be evaporated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B7/00—Heating by electric discharge
- H05B7/18—Heating by arc discharge
- H05B7/20—Direct heating by arc discharge, i.e. where at least one end of the arc directly acts on the material to be heated, including additional resistance heating by arc current flowing through the material to be heated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Silicon Compounds (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Vapour Deposition (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US633124 | 1984-07-20 | ||
| US06/633,124 US4548670A (en) | 1984-07-20 | 1984-07-20 | Silicon melting and evaporation method for high purity applications |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6163513A JPS6163513A (ja) | 1986-04-01 |
| JPH0116765B2 true JPH0116765B2 ( ) | 1989-03-27 |
Family
ID=24538365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60153897A Granted JPS6163513A (ja) | 1984-07-20 | 1985-07-12 | シリコンの融解方法及びその装置 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4548670A ( ) |
| JP (1) | JPS6163513A ( ) |
| CA (1) | CA1240482A ( ) |
| DE (1) | DE3525177A1 ( ) |
| FR (1) | FR2567918A1 ( ) |
| GB (1) | GB2162766B ( ) |
| IL (1) | IL75715A ( ) |
| IT (1) | IT1185287B ( ) |
| SE (1) | SE8503405L ( ) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2248852A (en) * | 1990-10-16 | 1992-04-22 | Secr Defence | Vapour deposition |
| JP2792483B2 (ja) * | 1995-10-26 | 1998-09-03 | 日本電気株式会社 | 半導体製造装置 |
| US6126742A (en) * | 1996-09-20 | 2000-10-03 | Forshungszentrum Karlsruhe Gmbh | Method of drawing single crystals |
| DE19638563C2 (de) * | 1996-09-20 | 1999-07-08 | Karlsruhe Forschzent | Verfahren zum Ziehen von Einkristallen |
| US6395085B2 (en) | 1999-07-14 | 2002-05-28 | Seh America, Inc. | Purity silicon wafer for use in advanced semiconductor devices |
| US6632277B2 (en) | 1999-07-14 | 2003-10-14 | Seh America, Inc. | Optimized silicon wafer gettering for advanced semiconductor devices |
| US6454852B2 (en) | 1999-07-14 | 2002-09-24 | Seh America, Inc. | High efficiency silicon wafer optimized for advanced semiconductor devices |
| US6228165B1 (en) * | 1999-07-28 | 2001-05-08 | Seh America, Inc. | Method of manufacturing crystal of silicon using an electric potential |
| JP2007010501A (ja) * | 2005-06-30 | 2007-01-18 | Herzog Japan Ltd | ガラスビード作製装置及び方法 |
| US20100050932A1 (en) * | 2008-08-27 | 2010-03-04 | Bp Corporation North America Inc. | Apparatus and Method of Direct Electric Melting a Feedstock |
| DK2504470T3 (da) | 2009-11-24 | 2014-03-10 | Forschungsverbund Berlin Ev | Fremgangsmåde og apparat til fremstilling af enkrystaller af halvledermateriale |
| WO2011099110A1 (ja) * | 2010-02-09 | 2011-08-18 | Kaneko Kyojiro | シリコン真空溶解法 |
| CN102275927A (zh) * | 2011-06-01 | 2011-12-14 | 邓小宝 | 燃气电弧双热式蓄热余热废气回燃环保节能高效炼硅炉 |
| DE102013205225A1 (de) * | 2013-03-25 | 2014-09-25 | Wacker Chemie Ag | Herstellung von Silicium enthaltenden nano- und mikrometerskaligen Partikeln |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE542056A ( ) * | 1954-10-15 | |||
| US3160497A (en) * | 1962-11-15 | 1964-12-08 | Loung Pai Yen | Method of melting refractory metals using a double heating process |
| DE1243641B (de) * | 1962-12-12 | 1967-07-06 | Siemens Ag | Verfahren zur Herstellung von Halbleiterstaeben durch Ziehen aus der Schmelze |
| US3392056A (en) * | 1964-10-26 | 1968-07-09 | Irc Inc | Method of making single crystal films and the product resulting therefrom |
| US3625660A (en) * | 1968-03-18 | 1971-12-07 | Massachusetts Inst Technology | Method and structure for growing crystals |
| US4165361A (en) * | 1975-11-28 | 1979-08-21 | Milstein Joseph B | Process and apparatus for preparation of single crystals and textured polycrystals |
-
1984
- 1984-07-20 US US06/633,124 patent/US4548670A/en not_active Expired - Fee Related
-
1985
- 1985-06-24 CA CA000484991A patent/CA1240482A/en not_active Expired
- 1985-07-03 IL IL75715A patent/IL75715A/xx unknown
- 1985-07-09 SE SE8503405A patent/SE8503405L/ not_active Application Discontinuation
- 1985-07-12 JP JP60153897A patent/JPS6163513A/ja active Granted
- 1985-07-15 DE DE19853525177 patent/DE3525177A1/de not_active Withdrawn
- 1985-07-19 FR FR8511416A patent/FR2567918A1/fr not_active Withdrawn
- 1985-07-19 IT IT21642/85A patent/IT1185287B/it active
- 1985-07-22 GB GB08518400A patent/GB2162766B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB2162766A (en) | 1986-02-12 |
| GB8518400D0 (en) | 1985-08-29 |
| SE8503405D0 (sv) | 1985-07-09 |
| CA1240482A (en) | 1988-08-16 |
| IT8521642A0 (it) | 1985-07-19 |
| SE8503405L (sv) | 1986-01-21 |
| US4548670A (en) | 1985-10-22 |
| DE3525177A1 (de) | 1986-01-23 |
| IT1185287B (it) | 1987-11-04 |
| FR2567918A1 (fr) | 1986-01-24 |
| IL75715A (en) | 1989-06-30 |
| IL75715A0 (en) | 1985-11-29 |
| JPS6163513A (ja) | 1986-04-01 |
| GB2162766B (en) | 1987-10-28 |
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