DE3521572A1 - Leistungshalbleitermodul mit keramiksubstrat - Google Patents

Leistungshalbleitermodul mit keramiksubstrat

Info

Publication number
DE3521572A1
DE3521572A1 DE19853521572 DE3521572A DE3521572A1 DE 3521572 A1 DE3521572 A1 DE 3521572A1 DE 19853521572 DE19853521572 DE 19853521572 DE 3521572 A DE3521572 A DE 3521572A DE 3521572 A1 DE3521572 A1 DE 3521572A1
Authority
DE
Germany
Prior art keywords
supports
housing
semiconductor module
potting
power semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19853521572
Other languages
German (de)
English (en)
Inventor
Arno Dipl.-Phys. Dr. 6831 Plankstadt Neidig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB AG Germany
Original Assignee
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Germany
Priority to DE19853521572 priority Critical patent/DE3521572A1/de
Priority to EP19860102317 priority patent/EP0205746B1/de
Priority to DE8686102317T priority patent/DE3669017D1/de
Priority to JP61135113A priority patent/JPS61292949A/ja
Priority to US06/874,572 priority patent/US4731644A/en
Publication of DE3521572A1 publication Critical patent/DE3521572A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/641—Dispositions of strap connectors
    • H10W72/646—Dispositions of strap connectors the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
DE19853521572 1985-06-15 1985-06-15 Leistungshalbleitermodul mit keramiksubstrat Withdrawn DE3521572A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19853521572 DE3521572A1 (de) 1985-06-15 1985-06-15 Leistungshalbleitermodul mit keramiksubstrat
EP19860102317 EP0205746B1 (de) 1985-06-15 1986-02-22 Leistungshalbleitermodul mit Keramiksubstrat
DE8686102317T DE3669017D1 (de) 1985-06-15 1986-02-22 Leistungshalbleitermodul mit keramiksubstrat.
JP61135113A JPS61292949A (ja) 1985-06-15 1986-06-12 電力用半導体モジユ−ル
US06/874,572 US4731644A (en) 1985-06-15 1986-06-16 Semiconductor power module with ceramic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853521572 DE3521572A1 (de) 1985-06-15 1985-06-15 Leistungshalbleitermodul mit keramiksubstrat

Publications (1)

Publication Number Publication Date
DE3521572A1 true DE3521572A1 (de) 1986-12-18

Family

ID=6273418

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19853521572 Withdrawn DE3521572A1 (de) 1985-06-15 1985-06-15 Leistungshalbleitermodul mit keramiksubstrat
DE8686102317T Expired - Lifetime DE3669017D1 (de) 1985-06-15 1986-02-22 Leistungshalbleitermodul mit keramiksubstrat.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE8686102317T Expired - Lifetime DE3669017D1 (de) 1985-06-15 1986-02-22 Leistungshalbleitermodul mit keramiksubstrat.

Country Status (4)

Country Link
US (1) US4731644A (https=)
EP (1) EP0205746B1 (https=)
JP (1) JPS61292949A (https=)
DE (2) DE3521572A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4788626A (en) * 1986-02-15 1988-11-29 Brown, Boveri & Cie Ag Power semiconductor module
DE4135183A1 (de) * 1990-11-03 1992-05-07 Fuji Electric Co Ltd Abgedichtete halbleiter-anordnung
DE4111247A1 (de) * 1991-04-08 1992-10-22 Export Contor Aussenhandel Schaltungsanordnung
DE4131200A1 (de) * 1991-09-19 1993-04-01 Export Contor Aussenhandel Schaltungsanordnung
DE4237632A1 (de) * 1992-11-07 1994-05-11 Export Contor Ausenhandelsgese Schaltungsanordnung
US6507108B1 (en) 1999-09-08 2003-01-14 Ixys Semiconductor Gmbh Power semiconductor module

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3717489A1 (de) * 1987-05-23 1988-12-01 Asea Brown Boveri Leistungshalbleitermodul und verfahren zur herstellung des moduls
US5219795A (en) * 1989-02-07 1993-06-15 Fujitsu Limited Dual in-line packaging and method of producing the same
US4994890A (en) * 1989-11-27 1991-02-19 Snap-On Tools Corporation Rectifier structure with individual links
FR2660826A1 (fr) * 1990-04-05 1991-10-11 Mcb Sa Boitier economique pour composants electroniques de puissance, a fixer sur dissipateur thermique et son procede de fabrication.
JPH04312962A (ja) * 1991-03-18 1992-11-04 Mitsubishi Electric Corp 液体封止半導体装置及びその組立方法
US5220197A (en) * 1991-07-22 1993-06-15 Silicon Power Corporation Single inline packaged solid state relay with high current density capability
US5134094A (en) * 1991-07-22 1992-07-28 Silicon Power Corporation Single inline packaged solid state relay with high current density capability
DE4222973A1 (de) * 1992-07-13 1994-01-20 Asea Brown Boveri Bidirektionaler Halbleiterschalter
JP2956363B2 (ja) * 1992-07-24 1999-10-04 富士電機株式会社 パワー半導体装置
US5313091A (en) * 1992-09-28 1994-05-17 Sundstrand Corporation Package for a high power electrical component
US5465481A (en) * 1993-10-04 1995-11-14 Motorola, Inc. Method for fabricating a semiconductor package
DE4446527A1 (de) * 1994-12-24 1996-06-27 Ixys Semiconductor Gmbh Leistungshalbleitermodul
US5705848A (en) * 1995-11-24 1998-01-06 Asea Brown Boveri Ag Power semiconductor module having a plurality of submodules
US5748456A (en) * 1995-11-24 1998-05-05 Asea Brown Boveri Ag Power semiconductor module system
US5805427A (en) * 1996-02-14 1998-09-08 Olin Corporation Ball grid array electronic package standoff design
DE19615481C5 (de) * 1996-04-03 2013-03-14 Curamik Electronics Gmbh Gewölbtes Metall-Keramik-Substrat
DE19722355A1 (de) * 1997-05-28 1998-12-03 Bosch Gmbh Robert Verfahren zur Herstellung elektrischer Baugruppen und elektrische Baugruppe
DE19726534A1 (de) * 1997-06-23 1998-12-24 Asea Brown Boveri Leistungshalbleitermodul mit geschlossenen Submodulen
US6060795A (en) * 1998-03-18 2000-05-09 Intersil Corporation Semiconductor power pack
DE19903875C2 (de) * 1999-02-01 2001-11-29 Semikron Elektronik Gmbh Leistungshalbleiterschaltungsanordnung, insbesondere Stromumrichter, in Druckkontaktierung
DE10213648B4 (de) 2002-03-27 2011-12-15 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
US7696532B2 (en) * 2004-12-16 2010-04-13 Abb Research Ltd Power semiconductor module
DE102006005445A1 (de) * 2006-02-07 2007-08-16 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
US20070215997A1 (en) * 2006-03-17 2007-09-20 Martin Standing Chip-scale package
DE102006021018B4 (de) 2006-05-05 2014-08-14 Wabco Gmbh Induktiver Sensor
EP2019424B1 (de) 2007-07-26 2016-11-23 SEMIKRON Elektronik GmbH & Co. KG Leistungshalbleitermodul mit Dichteinrichtung zum Substratträger und Herstellungsverfahren hierzu
US7768109B2 (en) * 2007-08-24 2010-08-03 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same
US9064737B2 (en) * 2007-11-13 2015-06-23 Siemens Aktiengesellschaft Power semiconductor module
JP5267283B2 (ja) * 2009-04-02 2013-08-21 三菱電機株式会社 パワーモジュール
DE102011086048A1 (de) * 2011-04-07 2012-10-11 Continental Teves Ag & Co. Ohg Gehäuseseitige Trennschicht zur Stressentkopplung von vergossenen Elektroniken
US8482908B2 (en) 2011-10-14 2013-07-09 Badger Meter, Inc. Electronic meter register and method having a bottom formed by sealing material
DE102012222015B4 (de) * 2012-11-30 2019-07-18 Infineon Technologies Ag Feuchtigkeitsdichtes Halbleitermodul und ein Verfahren zu dessen Herstellung
US10399256B1 (en) * 2018-04-17 2019-09-03 Goodrich Corporation Sealed circuit card assembly

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2811933A1 (de) * 1977-03-21 1978-09-28 Gen Electric Andrueckbare halbleiter-pelletanordnung
DE2944614A1 (de) * 1979-11-05 1981-05-14 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit vergossenem gehaeuse und verfahren zum vergiessen
DE3028178A1 (de) * 1980-07-25 1982-02-25 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleiter-modul
EP0069901A2 (de) * 1981-07-11 1983-01-19 BROWN, BOVERI & CIE Aktiengesellschaft Stromrichtermodul
DE3232154A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleitermodul
DE3241508A1 (de) * 1982-11-10 1984-05-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungstransistor-modul
DE3415446A1 (de) * 1983-04-25 1984-10-25 Mitsubishi Denki K.K., Tokio/Tokyo Gegossene harz-halbleitervorrichtung
DE3323246A1 (de) * 1983-06-28 1985-01-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1213726A (en) * 1968-01-26 1970-11-25 Ferranti Ltd Improvements relating to electrical circuit assemblies
JPS51292B1 (https=) * 1968-09-11 1976-01-07
FR2516702A1 (fr) * 1981-11-18 1983-05-20 Dassault Electronique Boitier pour circuits electroniques
US4568962A (en) * 1982-11-08 1986-02-04 Motorola, Inc. Plastic encapsulated semiconductor power device means and method
JPS59181627A (ja) * 1983-03-31 1984-10-16 Toshiba Corp 半導体装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2811933A1 (de) * 1977-03-21 1978-09-28 Gen Electric Andrueckbare halbleiter-pelletanordnung
DE2944614A1 (de) * 1979-11-05 1981-05-14 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit vergossenem gehaeuse und verfahren zum vergiessen
DE3028178A1 (de) * 1980-07-25 1982-02-25 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleiter-modul
EP0069901A2 (de) * 1981-07-11 1983-01-19 BROWN, BOVERI & CIE Aktiengesellschaft Stromrichtermodul
DE3232154A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleitermodul
DE3241508A1 (de) * 1982-11-10 1984-05-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungstransistor-modul
DE3415446A1 (de) * 1983-04-25 1984-10-25 Mitsubishi Denki K.K., Tokio/Tokyo Gegossene harz-halbleitervorrichtung
DE3323246A1 (de) * 1983-06-28 1985-01-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4788626A (en) * 1986-02-15 1988-11-29 Brown, Boveri & Cie Ag Power semiconductor module
DE4135183A1 (de) * 1990-11-03 1992-05-07 Fuji Electric Co Ltd Abgedichtete halbleiter-anordnung
DE4135183C2 (de) * 1990-11-03 2002-03-14 Fuji Electric Co Ltd Anschlussleiste und deren Verwendung in einer Halbleiter-Anordnung
DE4111247A1 (de) * 1991-04-08 1992-10-22 Export Contor Aussenhandel Schaltungsanordnung
US5296739A (en) * 1991-04-08 1994-03-22 Export-Contor Aussenhandelsgesellschaft Mbh Circuit arrangement with a cooling member
DE4131200A1 (de) * 1991-09-19 1993-04-01 Export Contor Aussenhandel Schaltungsanordnung
DE4237632A1 (de) * 1992-11-07 1994-05-11 Export Contor Ausenhandelsgese Schaltungsanordnung
US5438479A (en) * 1992-11-07 1995-08-01 Export-Contor Aussenhandelsgesellschaft Mbh High density, heat-dissipating circuit assembly with accessible components
US6507108B1 (en) 1999-09-08 2003-01-14 Ixys Semiconductor Gmbh Power semiconductor module

Also Published As

Publication number Publication date
JPS61292949A (ja) 1986-12-23
EP0205746A2 (de) 1986-12-30
EP0205746B1 (de) 1990-02-07
EP0205746A3 (en) 1987-07-22
US4731644A (en) 1988-03-15
JPH0571183B2 (https=) 1993-10-06
DE3669017D1 (de) 1990-03-15

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8127 New person/name/address of the applicant

Owner name: BBC BROWN BOVERI AG, 6800 MANNHEIM, DE

8127 New person/name/address of the applicant

Owner name: ASEA BROWN BOVERI AG, 6800 MANNHEIM, DE

8139 Disposal/non-payment of the annual fee