DE3509626C2 - - Google Patents

Info

Publication number
DE3509626C2
DE3509626C2 DE3509626A DE3509626A DE3509626C2 DE 3509626 C2 DE3509626 C2 DE 3509626C2 DE 3509626 A DE3509626 A DE 3509626A DE 3509626 A DE3509626 A DE 3509626A DE 3509626 C2 DE3509626 C2 DE 3509626C2
Authority
DE
Germany
Prior art keywords
vacuum
suction
solder paste
plate
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3509626A
Other languages
German (de)
English (en)
Other versions
DE3509626A1 (de
Inventor
Horst 4155 Grefrath De Dathe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Original Assignee
Philips Patentverwaltung GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Patentverwaltung GmbH filed Critical Philips Patentverwaltung GmbH
Priority to DE19853509626 priority Critical patent/DE3509626A1/de
Publication of DE3509626A1 publication Critical patent/DE3509626A1/de
Application granted granted Critical
Publication of DE3509626C2 publication Critical patent/DE3509626C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Screen Printers (AREA)
DE19853509626 1985-03-16 1985-03-16 Vorrichtung zum erzeugen eines dosierten kurzzeitigen gas-unterdruckimpulses Granted DE3509626A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19853509626 DE3509626A1 (de) 1985-03-16 1985-03-16 Vorrichtung zum erzeugen eines dosierten kurzzeitigen gas-unterdruckimpulses

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853509626 DE3509626A1 (de) 1985-03-16 1985-03-16 Vorrichtung zum erzeugen eines dosierten kurzzeitigen gas-unterdruckimpulses

Publications (2)

Publication Number Publication Date
DE3509626A1 DE3509626A1 (de) 1986-09-18
DE3509626C2 true DE3509626C2 (enrdf_load_stackoverflow) 1988-03-24

Family

ID=6265502

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853509626 Granted DE3509626A1 (de) 1985-03-16 1985-03-16 Vorrichtung zum erzeugen eines dosierten kurzzeitigen gas-unterdruckimpulses

Country Status (1)

Country Link
DE (1) DE3509626A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19738550A1 (de) * 1997-09-03 1998-10-22 Siemens Ag Mehrlagen-Additivverfahren zur Herstellung mehrschichtiger Leitersysteme

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2852342B2 (ja) * 1989-08-22 1999-02-03 松下電器産業株式会社 スクリーン印刷方法
JPH0475398A (ja) * 1990-07-18 1992-03-10 Cmk Corp プリント配線板のスルーホール等に対する充填材の充填装置
DE4439108C1 (de) 1994-11-02 1996-04-11 Lpkf Cad Cam Systeme Gmbh Verfahren zum Durchkontaktieren von Bohrungen in mehrlagigen Leiterplatten
DE19547124C2 (de) * 1995-12-16 2001-04-19 Lpkf D O O Drehschieberventil zur wahlweisen Druck- oder Saugluftbeaufschlagung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR958095A (enrdf_load_stackoverflow) * 1946-03-08 1950-03-03
DE1071290B (enrdf_load_stackoverflow) * 1953-10-23
DE3102126C2 (de) * 1981-01-23 1983-12-15 Loewe Opta Gmbh, 8640 Kronach Drucktisch für eine Siebdruckmaschine
BE896966A (nl) * 1983-06-06 1983-12-06 Bell Telephone Mfg Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19738550A1 (de) * 1997-09-03 1998-10-22 Siemens Ag Mehrlagen-Additivverfahren zur Herstellung mehrschichtiger Leitersysteme

Also Published As

Publication number Publication date
DE3509626A1 (de) 1986-09-18

Similar Documents

Publication Publication Date Title
DE69715254T2 (de) Vorrichtung und Verfahren zum Reinigen
DE3420966A1 (de) Siebdruckverfahren und einrichtung zur ausuebung desselben
DE2339127C3 (de) Vorrichtung zum Sprühbeschichten
DE4214430A1 (de) Probenverteilungsverfahren
DE2536369B2 (de) Tintenspritzkopf
DE3005385C2 (de) Verfahren zum Abschalten einer mit Tropfenstrahlen arbeitenden Beschichtungsvorrichtung
DE3509626C2 (enrdf_load_stackoverflow)
DE3233817C2 (de) Vorrichtung zum Zuführen von flüssigem Metall zu einer Gießmaschine
EP0711106A1 (de) Verfahren zum Durchkontaktieren von Bohrungen in mehrlagigen Leiterplatten
DE3707071C1 (de) Vorrichtung zum Entgasen von Spuelwasser
DE19547124C2 (de) Drehschieberventil zur wahlweisen Druck- oder Saugluftbeaufschlagung
DE3624982A1 (de) Druckoel-schmiereinrichtung
DE3509627A1 (de) Vorrichtung zum durchkontaktieren von loechern in dickschichtschaltungsplatten
DE2724888C3 (de) Vorrichtung zur Reinigung von Tuscheschreiberspitzen
EP0438732A2 (de) Rakelvorrichtung für ein Spülfarbwerk einer Rotationsdruckmaschine
DE2559996C3 (de) Vorrichtung für das Auftragen von Flüssigkeitstropfen auf eine Oberfläche
DE3427004C2 (enrdf_load_stackoverflow)
DE8507918U1 (de) Vorrichtung zum Durchkontaktieren von Löchern in Dickschichtschaltungsplatten
DE10000585B4 (de) Siebdruckvorrichtung
DE69209862T2 (de) Tintenstrahlaufzeichnungskopf
DE2938958C2 (enrdf_load_stackoverflow)
DE3316226A1 (de) Verfahren und einrichtung zum entfernen von tinte vor den duesenmuendungen und luft aus dem duesenraum eines tintenstrahldruckkopfes
DE3839845A1 (de) Zufuhrvorrichtung fuer behandlungsfluessigkeiten fuer ein nassbehandlungsgeraet
DE2330408A1 (de) Doppeltwirkender siebdrucker
DE2824155A1 (de) Explosionssichere vorrichtung zur automatischen entnahme von fluessigkeitsproben, beispielsweise aus der kanalisation

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee