DE3501711C2 - - Google Patents
Info
- Publication number
- DE3501711C2 DE3501711C2 DE3501711A DE3501711A DE3501711C2 DE 3501711 C2 DE3501711 C2 DE 3501711C2 DE 3501711 A DE3501711 A DE 3501711A DE 3501711 A DE3501711 A DE 3501711A DE 3501711 C2 DE3501711 C2 DE 3501711C2
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- board according
- conductor tracks
- connecting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 46
- 238000005476 soldering Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 102100035261 FYN-binding protein 1 Human genes 0.000 description 1
- 108091011190 FYN-binding protein 1 Proteins 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/50—Bases; Cases formed as an integral body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19853501711 DE3501711A1 (de) | 1985-01-19 | 1985-01-19 | Leiterplatte mit integralem steckverbinder |
US06/818,158 US4668033A (en) | 1985-01-19 | 1986-01-13 | Circuit board with integral connector |
EP86100400A EP0189778B1 (en) | 1985-01-19 | 1986-01-14 | Circuit board with integral connector |
JP61007793A JPS61216278A (ja) | 1985-01-19 | 1986-01-17 | 差込み結合部材と一体型の導電板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19853501711 DE3501711A1 (de) | 1985-01-19 | 1985-01-19 | Leiterplatte mit integralem steckverbinder |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3501711A1 DE3501711A1 (de) | 1986-10-02 |
DE3501711C2 true DE3501711C2 (US20110009641A1-20110113-C00160.png) | 1989-05-24 |
Family
ID=6260246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19853501711 Granted DE3501711A1 (de) | 1985-01-19 | 1985-01-19 | Leiterplatte mit integralem steckverbinder |
Country Status (4)
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3743335A1 (de) * | 1987-12-21 | 1989-06-29 | Standard Elektrik Lorenz Ag | Leiterplatte |
US5158465A (en) * | 1990-02-23 | 1992-10-27 | General Electric Company | Audio jack connector |
US5030113A (en) * | 1990-11-05 | 1991-07-09 | Itt Corporation | One-piece insulator body and flexible circuit |
DE4412364B4 (de) * | 1994-04-11 | 2008-10-30 | Würth Elektronik GmbH & Co. KG | Leiterplatte mit einem auf einem Träger laminierten Foliensystem |
DE19640261C2 (de) * | 1996-09-30 | 1998-07-16 | Siemens Ag | Ventilsteuergerät mit dreidimensionaler Leiterplatte in MID-Technik |
US5804886A (en) * | 1996-11-12 | 1998-09-08 | Methode Electronics, Inc. | Electronic switch with insert molding and method of manufacturing same |
US20020159267A1 (en) * | 1999-12-09 | 2002-10-31 | Shuangqun Zhao | Touch-sensitive switch with brightness-control for lamps |
US9386693B2 (en) * | 2014-05-05 | 2016-07-05 | Lockheed Martin Corporation | Board integrated interconnect |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3160459A (en) * | 1961-02-17 | 1964-12-08 | Burndy Corp | Connector for printed circuit boards |
US3160455A (en) * | 1961-05-16 | 1964-12-08 | Burroughs Corp | Printed circuit boards and connectors therefor |
DE1590532B2 (de) * | 1963-11-14 | 1971-06-03 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Kontaktfederleiste |
US3413594A (en) * | 1966-08-02 | 1968-11-26 | Amp Inc | Edge connector |
DE1979189U (de) * | 1967-07-19 | 1968-02-22 | Kupfer Asbest Co | Stift- oder messerleiste fuer steckverbindung. |
FR2307436A1 (fr) * | 1975-04-11 | 1976-11-05 | Bonhomme F R | Perfectionnements aux cartes a circuits imprimes |
ZA783270B (en) * | 1977-07-06 | 1979-06-27 | Motorola Inc | Molded circuit board |
DE7822788U1 (de) * | 1978-07-29 | 1978-11-30 | C. A. Weidmueller Kg, 4930 Detmold | Einschub für Leiterplatten |
US4264114A (en) * | 1979-01-05 | 1981-04-28 | Mattel, Inc. | Electrical connector assembly |
US4252393A (en) * | 1979-08-06 | 1981-02-24 | Teledyne Industries, Inc. | Electrical connector for strip conductors |
DE8125378U1 (de) * | 1981-09-01 | 1981-12-24 | Siemens AG, 1000 Berlin und 8000 München | Erdverbindung bei einer eine feder- oder messerleiste tragenden leiterplatte |
US4418972A (en) * | 1982-02-01 | 1983-12-06 | Burroughs Corporation | Electrical connector for printed wiring board |
DE3222178A1 (de) * | 1982-06-12 | 1983-12-15 | IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen | Elektrisch isolierender traeger mit metallischen leitern |
US4475781A (en) * | 1982-12-08 | 1984-10-09 | Amp Incorporated | Bussing system for stacked array of panel boards |
US4518211A (en) * | 1983-09-26 | 1985-05-21 | Gte Automatic Electric Inc. | Device for mounting, interconnecting and terminating printed circuits |
-
1985
- 1985-01-19 DE DE19853501711 patent/DE3501711A1/de active Granted
-
1986
- 1986-01-13 US US06/818,158 patent/US4668033A/en not_active Expired - Fee Related
- 1986-01-14 EP EP86100400A patent/EP0189778B1/en not_active Expired
- 1986-01-17 JP JP61007793A patent/JPS61216278A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0189778A1 (en) | 1986-08-06 |
US4668033A (en) | 1987-05-26 |
DE3501711A1 (de) | 1986-10-02 |
JPS61216278A (ja) | 1986-09-25 |
EP0189778B1 (en) | 1988-09-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8363 | Opposition against the patent | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: AMPHENOL CORP., WALLINGFORD, CONN., US |
|
8339 | Ceased/non-payment of the annual fee |