DE3483063D1 - Ausrichtungsmarkierungen auf halbleiterscheiben und verfahren zum herstellen der markierungen. - Google Patents

Ausrichtungsmarkierungen auf halbleiterscheiben und verfahren zum herstellen der markierungen.

Info

Publication number
DE3483063D1
DE3483063D1 DE8484303326T DE3483063T DE3483063D1 DE 3483063 D1 DE3483063 D1 DE 3483063D1 DE 8484303326 T DE8484303326 T DE 8484303326T DE 3483063 T DE3483063 T DE 3483063T DE 3483063 D1 DE3483063 D1 DE 3483063D1
Authority
DE
Germany
Prior art keywords
markings
producing
alignment
semiconductor disc
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484303326T
Other languages
German (de)
English (en)
Inventor
Hiroshi C O Oki Elec I Ohtsuka
Yoshio C O Oki Electric I Itoh
Tadashi C O Oki Elec Nishimuro
Hisamitsu C O Miyaza Mitsutomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Application granted granted Critical
Publication of DE3483063D1 publication Critical patent/DE3483063D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE8484303326T 1983-05-20 1984-05-16 Ausrichtungsmarkierungen auf halbleiterscheiben und verfahren zum herstellen der markierungen. Expired - Lifetime DE3483063D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58087542A JPS59224123A (ja) 1983-05-20 1983-05-20 ウエハアライメントマ−ク

Publications (1)

Publication Number Publication Date
DE3483063D1 true DE3483063D1 (de) 1990-10-04

Family

ID=13917864

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484303326T Expired - Lifetime DE3483063D1 (de) 1983-05-20 1984-05-16 Ausrichtungsmarkierungen auf halbleiterscheiben und verfahren zum herstellen der markierungen.

Country Status (4)

Country Link
US (1) US4824254A (https=)
EP (1) EP0126621B1 (https=)
JP (1) JPS59224123A (https=)
DE (1) DE3483063D1 (https=)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6292440A (ja) * 1985-10-18 1987-04-27 Mitsubishi Electric Corp アライメントマ−ク
GB8806232D0 (en) * 1988-03-16 1988-04-13 Plessey Co Plc Vernier structure for flip chip bonded devices
WO1989008926A1 (en) * 1988-03-16 1989-09-21 Plessey Overseas Limited Vernier structure for flip chip bonded devices
JPH02234085A (ja) * 1989-03-08 1990-09-17 Mitsubishi Electric Corp 半導体装置
IT1251393B (it) * 1991-09-04 1995-05-09 St Microelectronics Srl Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati.
CA2096551A1 (en) * 1992-05-22 1993-11-23 Masanori Nishiguchi Semiconductor device
US5294975A (en) * 1992-10-15 1994-03-15 Altera Corporation Laser alignment target for semiconductor integrated circuits
US5300786A (en) * 1992-10-28 1994-04-05 International Business Machines Corporation Optical focus phase shift test pattern, monitoring system and process
US5316984A (en) * 1993-03-25 1994-05-31 Vlsi Technology, Inc. Bright field wafer target
US5311061A (en) * 1993-05-19 1994-05-10 Motorola Inc. Alignment key for a semiconductor device having a seal against ionic contamination
US5469263A (en) * 1994-07-01 1995-11-21 Motorola, Inc. Method for alignment in photolithographic processes
US5876819A (en) * 1995-02-17 1999-03-02 Mitsubishi Denki Kabushiki Kaisha Crystal orientation detectable semiconductor substrate, and methods of manufacturing and using the same
KR0170909B1 (ko) * 1995-09-27 1999-03-30 김주용 반도체 소자의 오버레이 검사방법
DE19939825A1 (de) * 1999-08-21 2001-03-01 Bosch Gmbh Robert Bauelement mit einem optisch erkennbaren Marker
US6815838B2 (en) 2002-02-20 2004-11-09 International Business Machines Corporation Laser alignment target and method
TWI288428B (en) 2004-01-21 2007-10-11 Seiko Epson Corp Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment
US6989682B1 (en) * 2005-03-16 2006-01-24 United Microelectronics Corp. Test key on a wafer
TWI707038B (zh) 2013-08-05 2020-10-11 美商扭轉生物科技有限公司 重新合成之基因庫
CA2975855C (en) 2015-02-04 2025-09-23 Twist Bioscience Corporation SYNTHETIC GENE COMPOSITIONS AND ASSEMBLY METHODS
WO2016126882A1 (en) 2015-02-04 2016-08-11 Twist Bioscience Corporation Methods and devices for de novo oligonucleic acid assembly
US9981239B2 (en) 2015-04-21 2018-05-29 Twist Bioscience Corporation Devices and methods for oligonucleic acid library synthesis
KR20180050411A (ko) 2015-09-18 2018-05-14 트위스트 바이오사이언스 코포레이션 올리고핵산 변이체 라이브러리 및 그의 합성
KR102794025B1 (ko) 2015-09-22 2025-04-09 트위스트 바이오사이언스 코포레이션 핵산 합성을 위한 가요성 기판
CN115920796A (zh) 2015-12-01 2023-04-07 特韦斯特生物科学公司 功能化表面及其制备
JP6854340B2 (ja) 2016-08-22 2021-04-07 ツイスト バイオサイエンス コーポレーション デノボ合成された核酸ライブラリ
US10417457B2 (en) 2016-09-21 2019-09-17 Twist Bioscience Corporation Nucleic acid based data storage
KR102514213B1 (ko) 2016-12-16 2023-03-27 트위스트 바이오사이언스 코포레이션 면역 시냅스의 변이체 라이브러리 및 그의 합성
CN110892485B (zh) 2017-02-22 2024-03-22 特韦斯特生物科学公司 基于核酸的数据存储
WO2018170169A1 (en) 2017-03-15 2018-09-20 Twist Bioscience Corporation Variant libraries of the immunological synapse and synthesis thereof
WO2018231864A1 (en) 2017-06-12 2018-12-20 Twist Bioscience Corporation Methods for seamless nucleic acid assembly
US10696965B2 (en) 2017-06-12 2020-06-30 Twist Bioscience Corporation Methods for seamless nucleic acid assembly
CN111566125A (zh) 2017-09-11 2020-08-21 特韦斯特生物科学公司 Gpcr结合蛋白及其合成
CN111565834B (zh) 2017-10-20 2022-08-26 特韦斯特生物科学公司 用于多核苷酸合成的加热的纳米孔
KR102804057B1 (ko) 2018-01-04 2025-05-07 트위스트 바이오사이언스 코포레이션 Dna 기반 디지털 정보 저장
CA3100739A1 (en) 2018-05-18 2019-11-21 Twist Bioscience Corporation Polynucleotides, reagents, and methods for nucleic acid hybridization
US12357959B2 (en) 2018-12-26 2025-07-15 Twist Bioscience Corporation Highly accurate de novo polynucleotide synthesis
CN113766930B (zh) 2019-02-26 2025-07-22 特韦斯特生物科学公司 Glp1受体的变异核酸文库
CA3131691A1 (en) 2019-02-26 2020-09-03 Twist Bioscience Corporation Variant nucleic acid libraries for antibody optimization
AU2020298294A1 (en) 2019-06-21 2022-02-17 Twist Bioscience Corporation Barcode-based nucleic acid sequence assembly
JP2022548309A (ja) 2019-09-23 2022-11-17 ツイスト バイオサイエンス コーポレーション Ｃｒｔｈ２のバリアント核酸ライブラリー
WO2021061842A1 (en) 2019-09-23 2021-04-01 Twist Bioscience Corporation Variant nucleic acid libraries for single domain antibodies
IL293670A (en) 2019-12-09 2022-08-01 Twist Bioscience Corp Variable nucleic acid libraries for adenosine receptors
TWI736226B (zh) * 2020-04-21 2021-08-11 錼創顯示科技股份有限公司 對位結構
CN117492336B (zh) * 2024-01-02 2024-04-09 天府兴隆湖实验室 对准标记及图形对准方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885877A (en) * 1973-10-11 1975-05-27 Ibm Electro-optical fine alignment process
GB1550867A (en) * 1975-08-04 1979-08-22 Hughes Aircraft Co Positioning method and apparatus for fabricating microcircuit devices
US4066485A (en) * 1977-01-21 1978-01-03 Rca Corporation Method of fabricating a semiconductor device
US4309813A (en) * 1979-12-26 1982-01-12 Harris Corporation Mask alignment scheme for laterally and totally dielectrically isolated integrated circuits
US4356223A (en) * 1980-02-28 1982-10-26 Nippon Electric Co., Ltd. Semiconductor device having a registration mark for use in an exposure technique for micro-fine working
US4419013A (en) * 1981-03-30 1983-12-06 Tre Semiconductor Equipment Corporation Phase contrast alignment system for a semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
JPH0463533B2 (https=) 1992-10-12
EP0126621B1 (en) 1990-08-29
EP0126621A3 (en) 1986-01-15
US4824254A (en) 1989-04-25
JPS59224123A (ja) 1984-12-17
EP0126621A2 (en) 1984-11-28

Similar Documents

Publication Publication Date Title
DE3483063D1 (de) Ausrichtungsmarkierungen auf halbleiterscheiben und verfahren zum herstellen der markierungen.
DE3575241D1 (de) Halbleiteranordnung und verfahren zum herstellen derselben.
DE3875463D1 (de) Verfahren zum verkuerzen der formgebungstaktzeit.
DE3381509D1 (de) Verfahren zum herstellen von halbleiteranordnungen.
DE3579681D1 (de) Verfahren und vorrichtung zum waermebehandeln von schienen.
DE68908326D1 (de) Verfahren zum herstellen elektrochromer vorrichtungen.
DE3684676D1 (de) Verfahren zum herstellen von halbleitersubstraten.
DE3876019D1 (de) Verfahren und vorrichtung zum herstellen von pyramidenstumpffoermiger dosenzargen.
DE3482523D1 (de) Verfahren zum herstellen eines elektrets und anordnungen.
DE3382563D1 (de) Verfahren zum unterscheiden zwischen komplexen zeichenvorraeten.
DE3861164D1 (de) Verfahren zum herstellen von sphaerischen teilchen.
DE3772490D1 (de) Halbleiteranordnung sowie verfahren zum herstellen und testen derselben.
DE3481412D1 (de) Apparat zum herstellen von etiketten.
DE58904461D1 (de) Verfahren zum herstellen von schaumstoffpolstern.
DE3784605D1 (de) Verfahren zum herstellen einer halbleitervorrichtung und halbleitervorrichtung.
DE3587514D1 (de) Verfahren und vorrichtung zum berechnen der beziehung zwischen der rohlinse und der brillenlinse.
DE3482530D1 (de) Elektrisch programmierbare speicheranordnung und verfahren zum herstellen derselben.
DE3578266D1 (de) Verfahren zum herstellen von halbleiteranordnungen und dadurch hergestellte anordnungen.
DE3577781D1 (de) Ein festwertspeicher und ein verfahren zum herstellen desselben.
DE3586019D1 (de) Verfahren zum herstellen eines elektrostriktiven elementes.
AT381875B (de) Verfahren zum richten von eisenbahnschienen und durch das verfahren hergestellte eisenbahnschienen
DE3481569D1 (de) Verfahren zum herstellen von diamantwaermesenken.
DE3483520D1 (de) Verfahren zum herstellen bedruckter formkoerper.
FI842680A7 (fi) Menetelmä bio-pasutushiilen valmistamiseksi ja laite menetelmän suorittamiseksi.
DE3577282D1 (de) Vorrichtung und verfahren zum herstellen von mischungen.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition