IT1251393B - Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati. - Google Patents

Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati.

Info

Publication number
IT1251393B
IT1251393B ITMI912345A ITMI912345A IT1251393B IT 1251393 B IT1251393 B IT 1251393B IT MI912345 A ITMI912345 A IT MI912345A IT MI912345 A ITMI912345 A IT MI912345A IT 1251393 B IT1251393 B IT 1251393B
Authority
IT
Italy
Prior art keywords
analysis
accuracy
realization
procedure
measuring instruments
Prior art date
Application number
ITMI912345A
Other languages
English (en)
Inventor
Paolo Canestrari
Carlo Lietti
Giovanni Rivera
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITMI912345A priority Critical patent/IT1251393B/it
Publication of ITMI912345A0 publication Critical patent/ITMI912345A0/it
Priority to DE69226234T priority patent/DE69226234T2/de
Priority to EP92114465A priority patent/EP0539686B1/en
Priority to JP4233605A priority patent/JPH05259152A/ja
Priority to US07/938,826 priority patent/US5246539A/en
Publication of ITMI912345A1 publication Critical patent/ITMI912345A1/it
Application granted granted Critical
Publication of IT1251393B publication Critical patent/IT1251393B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati la peculiarità del quale consiste nel fatto di realizzare strutture metrologiche presentanti profili di misura realizzati su aree di substrato e su aree processate industrialmente su un singolo wafer. I profili di misura realizzano distribuzioni statistiche rilevabili con macchine di misura per l'analisi dell'accuratezza di misura delle macchine stesse.
ITMI912345A 1991-09-04 1991-09-04 Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati. IT1251393B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
ITMI912345A IT1251393B (it) 1991-09-04 1991-09-04 Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati.
DE69226234T DE69226234T2 (de) 1991-09-04 1992-08-25 Verfahren zur Herstellung metrologischen Strukturen besonders geeignet für die Bestimmung der Präzision in Vorrichtungen, die den Abstand auf bearbeiteten Substraten messen
EP92114465A EP0539686B1 (en) 1991-09-04 1992-08-25 Process for producing metrological structures particularly useful for analyzing the accuracy of instruments for measuring alignment on processed substrates
JP4233605A JPH05259152A (ja) 1991-09-04 1992-09-01 加工された基板上の整列を測定するための機器の正確さを特に分析するための計測学的構造を製造するための方法
US07/938,826 US5246539A (en) 1991-09-04 1992-09-01 Process for producing metrological structures particularly useful for analyzing the accuracy of instruments for measuring alignment on processed substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI912345A IT1251393B (it) 1991-09-04 1991-09-04 Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati.

Publications (3)

Publication Number Publication Date
ITMI912345A0 ITMI912345A0 (it) 1991-09-04
ITMI912345A1 ITMI912345A1 (it) 1993-03-04
IT1251393B true IT1251393B (it) 1995-05-09

Family

ID=11360608

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI912345A IT1251393B (it) 1991-09-04 1991-09-04 Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati.

Country Status (5)

Country Link
US (1) US5246539A (it)
EP (1) EP0539686B1 (it)
JP (1) JPH05259152A (it)
DE (1) DE69226234T2 (it)
IT (1) IT1251393B (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1248534B (it) * 1991-06-24 1995-01-19 Sgs Thomson Microelectronics Procedimento per la realizzazione di strutture di calibrazione particolarmente per la taratura di macchine di misura del disallineamento in circuiti integrati in genere.
IT1252539B (it) * 1991-12-18 1995-06-19 St Microelectronics Srl Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento.
US5952247A (en) * 1994-11-23 1999-09-14 Intel Corporation Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate
EP0720216B1 (en) * 1994-12-29 2001-10-17 AT&T Corp. Linewidth metrology of integrated circuit structures
US5904486A (en) * 1997-09-30 1999-05-18 Intel Corporation Method for performing a circuit edit through the back side of an integrated circuit die
KR100234292B1 (ko) * 1997-10-08 1999-12-15 윤종용 광디스크 제작용 마스터 디스크 제조방법
US6274393B1 (en) * 1998-04-20 2001-08-14 International Business Machines Corporation Method for measuring submicron images
US6069089A (en) * 1998-12-18 2000-05-30 Suh; Hong C. Defective semiconductor redistribution labeling system
US6218200B1 (en) * 2000-07-14 2001-04-17 Motorola, Inc. Multi-layer registration control for photolithography processes
US7301638B1 (en) * 2004-01-31 2007-11-27 Kla Tencor, Inc. Dimensional calibration standards

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224123A (ja) * 1983-05-20 1984-12-17 Oki Electric Ind Co Ltd ウエハアライメントマ−ク
JPH0669031B2 (ja) * 1984-07-17 1994-08-31 日本電気株式会社 半導体装置
CA1330837C (en) * 1988-04-13 1994-07-19 Yoichi Fukushima Method of producing masks for rom type optical recording cards and method of inspecting masks
IT1227758B (it) * 1988-12-30 1991-05-06 Sgs Thomson Microelectronics Struttura di marca di riferimento per guidare l'allineamento tra topografie semilavorate di circuiti integrati a semiconduttore e successive maschere
JP2897248B2 (ja) * 1989-04-18 1999-05-31 富士通株式会社 半導体装置の製造方法
US5017512A (en) * 1989-07-27 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Wafer having a dicing area having a step region covered with a conductive layer and method of manufacturing the same
US4992394A (en) * 1989-07-31 1991-02-12 At&T Bell Laboratories Self aligned registration marks for integrated circuit fabrication
JPH03139821A (ja) * 1989-10-25 1991-06-14 Toshiba Corp 微細パターンの形成方法

Also Published As

Publication number Publication date
US5246539A (en) 1993-09-21
JPH05259152A (ja) 1993-10-08
EP0539686A1 (en) 1993-05-05
EP0539686B1 (en) 1998-07-15
ITMI912345A0 (it) 1991-09-04
DE69226234T2 (de) 1999-04-01
DE69226234D1 (de) 1998-08-20
ITMI912345A1 (it) 1993-03-04

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970929