JPS6454305A - Method and device for pattern size measurement - Google Patents

Method and device for pattern size measurement

Info

Publication number
JPS6454305A
JPS6454305A JP62213398A JP21339887A JPS6454305A JP S6454305 A JPS6454305 A JP S6454305A JP 62213398 A JP62213398 A JP 62213398A JP 21339887 A JP21339887 A JP 21339887A JP S6454305 A JPS6454305 A JP S6454305A
Authority
JP
Japan
Prior art keywords
data
measuring instrument
length measuring
measurement
cad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62213398A
Other languages
Japanese (ja)
Inventor
Toshiyuki Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62213398A priority Critical patent/JPS6454305A/en
Publication of JPS6454305A publication Critical patent/JPS6454305A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

PURPOSE:To facilitate and automate the handling of data by finding out a pattern to be measured from a high-density pattern formed on a wafer, and projecting a primary beam only on the part and measuring the pattern size. CONSTITUTION:A converting device 102 which inputs output data 101 from a CAD as MT converts the data 101 into the format of data which is easily processed by an electron beam length measuring instrument 105. Then a measurement schedule data generating device 103 which determines a measurement map, a register mark position, etc., in a wafer sends generated schedule data to a controller 104 and the electron beam length measuring instrument 105 starts measurement. Here, the length measuring instrument 105 is a stage with a laser interferometer and capable of high-accuracy positioning, so a position specified with the CAD data is found with + or -0.1mum accuracy.
JP62213398A 1987-08-26 1987-08-26 Method and device for pattern size measurement Pending JPS6454305A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62213398A JPS6454305A (en) 1987-08-26 1987-08-26 Method and device for pattern size measurement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62213398A JPS6454305A (en) 1987-08-26 1987-08-26 Method and device for pattern size measurement

Publications (1)

Publication Number Publication Date
JPS6454305A true JPS6454305A (en) 1989-03-01

Family

ID=16638551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62213398A Pending JPS6454305A (en) 1987-08-26 1987-08-26 Method and device for pattern size measurement

Country Status (1)

Country Link
JP (1) JPS6454305A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001304839A (en) * 2000-04-25 2001-10-31 Advantest Corp Electron beam length measuring apparatus and length measuring method
JP2002328015A (en) * 2001-04-27 2002-11-15 Hitachi Ltd Semiconductor test system
WO2007102421A1 (en) * 2006-03-06 2007-09-13 Advantest Corporation Pattern inspecting system and pattern inspecting method
JP2010085419A (en) * 2010-01-22 2010-04-15 Advantest Corp Device and method for measuring electron beam length

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50130474A (en) * 1974-04-03 1975-10-15
JPS57110913A (en) * 1980-12-27 1982-07-10 Toyota Motor Corp Measurement of curved surface
JPS6027809A (en) * 1983-07-25 1985-02-12 Toyota Motor Corp Method for measuring shape of surface
JPS61114121A (en) * 1984-11-08 1986-05-31 Toyota Motor Corp Method and device for size measurement
JPS61124816A (en) * 1984-11-22 1986-06-12 Hitachi Ltd Non-contact type three-dimensional measuring apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50130474A (en) * 1974-04-03 1975-10-15
JPS57110913A (en) * 1980-12-27 1982-07-10 Toyota Motor Corp Measurement of curved surface
JPS6027809A (en) * 1983-07-25 1985-02-12 Toyota Motor Corp Method for measuring shape of surface
JPS61114121A (en) * 1984-11-08 1986-05-31 Toyota Motor Corp Method and device for size measurement
JPS61124816A (en) * 1984-11-22 1986-06-12 Hitachi Ltd Non-contact type three-dimensional measuring apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001304839A (en) * 2000-04-25 2001-10-31 Advantest Corp Electron beam length measuring apparatus and length measuring method
JP2002328015A (en) * 2001-04-27 2002-11-15 Hitachi Ltd Semiconductor test system
WO2007102421A1 (en) * 2006-03-06 2007-09-13 Advantest Corporation Pattern inspecting system and pattern inspecting method
JP2010085419A (en) * 2010-01-22 2010-04-15 Advantest Corp Device and method for measuring electron beam length

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