DE3318289A1 - Gehaeuse zur kapselung einer halbleiter-hochspannungsschaltanordnung und verfahren zu seiner herstellung - Google Patents

Gehaeuse zur kapselung einer halbleiter-hochspannungsschaltanordnung und verfahren zu seiner herstellung

Info

Publication number
DE3318289A1
DE3318289A1 DE3318289A DE3318289A DE3318289A1 DE 3318289 A1 DE3318289 A1 DE 3318289A1 DE 3318289 A DE3318289 A DE 3318289A DE 3318289 A DE3318289 A DE 3318289A DE 3318289 A1 DE3318289 A1 DE 3318289A1
Authority
DE
Germany
Prior art keywords
housing
side body
glass
base
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE3318289A
Other languages
German (de)
English (en)
Inventor
Raymond 92260 Fontenay aux Roses Henry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of DE3318289A1 publication Critical patent/DE3318289A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casings For Electric Apparatus (AREA)
DE3318289A 1982-05-25 1983-05-19 Gehaeuse zur kapselung einer halbleiter-hochspannungsschaltanordnung und verfahren zu seiner herstellung Withdrawn DE3318289A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8209048A FR2527837A1 (fr) 1982-05-25 1982-05-25 Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication

Publications (1)

Publication Number Publication Date
DE3318289A1 true DE3318289A1 (de) 1983-12-01

Family

ID=9274293

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3318289A Withdrawn DE3318289A1 (de) 1982-05-25 1983-05-19 Gehaeuse zur kapselung einer halbleiter-hochspannungsschaltanordnung und verfahren zu seiner herstellung

Country Status (2)

Country Link
DE (1) DE3318289A1 (https=)
FR (1) FR2527837A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
DE4033999A1 (de) * 1990-10-25 1992-04-30 Siemens Ag Schaltungsmodul mit sicherheitsgehaeuse

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR8400122A (pt) * 1983-01-12 1984-08-21 Allen Bradley Co Modulo semicondutor e embalagem de semicondutor aperfeicoada
DE3717489A1 (de) * 1987-05-23 1988-12-01 Asea Brown Boveri Leistungshalbleitermodul und verfahren zur herstellung des moduls
US5148264A (en) * 1990-05-02 1992-09-15 Harris Semiconductor Patents, Inc. High current hermetic package
EP3955282A1 (de) * 2020-08-11 2022-02-16 Siemens Aktiengesellschaft Leistungsmodul mit mindestens einer leistungseinheit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3748543A (en) * 1971-04-01 1973-07-24 Motorola Inc Hermetically sealed semiconductor package and method of manufacture
US4117508A (en) * 1977-03-21 1978-09-26 General Electric Company Pressurizable semiconductor pellet assembly
US4158745A (en) * 1977-10-27 1979-06-19 Amp Incorporated Lead frame having integral terminal tabs

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
DE4033999A1 (de) * 1990-10-25 1992-04-30 Siemens Ag Schaltungsmodul mit sicherheitsgehaeuse

Also Published As

Publication number Publication date
FR2527837A1 (fr) 1983-12-02
FR2527837B1 (https=) 1985-05-17

Similar Documents

Publication Publication Date Title
DE1903961C3 (de) Integrierte Halbleiterschaltung und Verfahren zu ihrer Herstellung
DE10100620B4 (de) Leistungsmodul
DE2945972C2 (de) Halbleiterbauelement mit einer oberen Kammer zur Erhöhung der Festigkeit und zum Abdichten
DE69209369T2 (de) Halbleitereinheit und Methode zu ihrer Herstellung
EP0588026B1 (de) Abschaltbares Hochleistungs-Halbleiterbauelement
DE2352357A1 (de) Halbleitergehaeuse
DE3504992A1 (de) Leistungshalbleitermodul mit integriertem waermerohr
CH652533A5 (de) Halbleiterbaustein.
DE102009032973A1 (de) Leistungshalbleitervorrichtung
DE2808531A1 (de) Lichtgetriggertes hochleistungs-halbleiterbauelement
DE2245140A1 (de) Einkapselung fuer elektronische bauelemente
CH663491A5 (en) Electronic circuit module
DE69923374T2 (de) Halbleitervorrichtung
DE2248303C2 (de) Halbleiterbauelement
DE1589854A1 (de) Loetstellenfreier Halbleitergleichrichter
DE1961314A1 (de) Geschuetztes Halbleiterbauelement und Verfahren zu seiner Herstellung
DE3432449C2 (https=)
EP0169356B1 (de) Wechsellastbeständiges, schaltbares Halbleiterbauelement
DE2004776C2 (de) Halbleiterbauelement
DE2012440C3 (de) Halbleiteranordnung für gasdicht abgeschlossene scheibenförmige Halbleiterelemente
DE1789063A1 (de) Traeger fuer Halbleiterbauelemente
DE3318289A1 (de) Gehaeuse zur kapselung einer halbleiter-hochspannungsschaltanordnung und verfahren zu seiner herstellung
DE2250753A1 (de) Gekapseltes halbleiter-bauelement
DE19543245A1 (de) Halbleitervorrichtung mit flammgespritzter Wärmeausbreitungsschicht und Verfahren für deren Herstellung
DE2125468A1 (de) Halbleitervorrichtung

Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee