FR2527837A1 - Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication - Google Patents

Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication Download PDF

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Publication number
FR2527837A1
FR2527837A1 FR8209048A FR8209048A FR2527837A1 FR 2527837 A1 FR2527837 A1 FR 2527837A1 FR 8209048 A FR8209048 A FR 8209048A FR 8209048 A FR8209048 A FR 8209048A FR 2527837 A1 FR2527837 A1 FR 2527837A1
Authority
FR
France
Prior art keywords
lateral body
case
cover
glass
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8209048A
Other languages
English (en)
French (fr)
Other versions
FR2527837B1 (https=
Inventor
Raymond Henry
Jean-Claude Resneau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8209048A priority Critical patent/FR2527837A1/fr
Priority to DE3318289A priority patent/DE3318289A1/de
Publication of FR2527837A1 publication Critical patent/FR2527837A1/fr
Application granted granted Critical
Publication of FR2527837B1 publication Critical patent/FR2527837B1/fr
Granted legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casings For Electric Apparatus (AREA)
FR8209048A 1982-05-25 1982-05-25 Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication Granted FR2527837A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR8209048A FR2527837A1 (fr) 1982-05-25 1982-05-25 Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication
DE3318289A DE3318289A1 (de) 1982-05-25 1983-05-19 Gehaeuse zur kapselung einer halbleiter-hochspannungsschaltanordnung und verfahren zu seiner herstellung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8209048A FR2527837A1 (fr) 1982-05-25 1982-05-25 Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication

Publications (2)

Publication Number Publication Date
FR2527837A1 true FR2527837A1 (fr) 1983-12-02
FR2527837B1 FR2527837B1 (https=) 1985-05-17

Family

ID=9274293

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8209048A Granted FR2527837A1 (fr) 1982-05-25 1982-05-25 Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication

Country Status (2)

Country Link
DE (1) DE3318289A1 (https=)
FR (1) FR2527837A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0116289A3 (en) * 1983-01-12 1987-01-07 Allen-Bradley Company Power semiconductor module and package
EP0292848A3 (en) * 1987-05-23 1990-09-26 Asea Brown Boveri Aktiengesellschaft Semiconductor power module and method of manufacturing it
EP0517967A1 (en) * 1990-05-02 1992-12-16 Harris Semiconductor Patents, Inc. High current hermetic package
EP3955282A1 (de) * 2020-08-11 2022-02-16 Siemens Aktiengesellschaft Leistungsmodul mit mindestens einer leistungseinheit

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
DE4033999A1 (de) * 1990-10-25 1992-04-30 Siemens Ag Schaltungsmodul mit sicherheitsgehaeuse

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3748543A (en) * 1971-04-01 1973-07-24 Motorola Inc Hermetically sealed semiconductor package and method of manufacture
DE2811933A1 (de) * 1977-03-21 1978-09-28 Gen Electric Andrueckbare halbleiter-pelletanordnung
EP0001892A1 (en) * 1977-10-27 1979-05-16 AMP INCORPORATED (a New Jersey corporation) Lead frame and package for establishing electrical connections to electronic components

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3748543A (en) * 1971-04-01 1973-07-24 Motorola Inc Hermetically sealed semiconductor package and method of manufacture
DE2811933A1 (de) * 1977-03-21 1978-09-28 Gen Electric Andrueckbare halbleiter-pelletanordnung
EP0001892A1 (en) * 1977-10-27 1979-05-16 AMP INCORPORATED (a New Jersey corporation) Lead frame and package for establishing electrical connections to electronic components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SOLID STATE TECHNOLOGY, vol.14, no.1, janvier 1971, PORT WASHINGTON (US) *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0116289A3 (en) * 1983-01-12 1987-01-07 Allen-Bradley Company Power semiconductor module and package
EP0292848A3 (en) * 1987-05-23 1990-09-26 Asea Brown Boveri Aktiengesellschaft Semiconductor power module and method of manufacturing it
EP0517967A1 (en) * 1990-05-02 1992-12-16 Harris Semiconductor Patents, Inc. High current hermetic package
EP3955282A1 (de) * 2020-08-11 2022-02-16 Siemens Aktiengesellschaft Leistungsmodul mit mindestens einer leistungseinheit

Also Published As

Publication number Publication date
DE3318289A1 (de) 1983-12-01
FR2527837B1 (https=) 1985-05-17

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